Patents by Inventor Hong-Siek Gan

Hong-Siek Gan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF REMOVING PHOTORESIST LAYER AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
    Publication number: 20080261384
    Abstract: A method of removing a photoresist layer is provided. An ion implantation process has been performed on the photoresist layer to transform a surface of the photoresist layer to a crust and a soft photoresist layer remains within the crust. The method includes performing a first removing step to remove the crust, such that the soft photoresist layer is exposed. Thereafter, a second removing step is performed to remove the soft photoresist layer. The first and the second removing steps are performed in difference chambers, and a temperature for performing the first removing step is lower than that for performing the second removing step and lower than a gasification temperature of a solvent in the soft photoresist layer.
    Type: Application
    Filed: April 18, 2007
    Publication date: October 23, 2008
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Zhi-Qiang Sun, Xi PEI, Tien-Cheng Lan, Yu-Jou Chen, Guo-Fu Zhou, Kai-Ping Huang, Hong-Siek Gan, Jian-Peng Yan, Kai YANG, Sheng ZHANG