Abstract: A semiconductor integrated circuit includes a decoding circuit configured to decode one or more test source signals and generate a plurality of test decoding signals, a transmission circuit configured to transmit the plurality of test decoding signals as a plurality of test mode group signals in response to a test enable signal, wherein the transmission circuit outputs the test mode group signals with maintaining a previous output, when the test decoding signals different from each other are sequentially activated, and a test mode signal output circuit configured to output a plurality of test mode signals corresponding to test mode groups, respectively, in response to the plurality of test mode group signals and one or more test mode select signals.

Abstract: The semiconductor memory device includes a cell capacitor having a first terminal electrically connected to a storage node and a second terminal electrically connected to an internal node, an internal voltage generator configured to generate an internal voltage signal applied to the internal node in response to a power-up signal, and an initialization element configured to initialize the internal node in response to the power-up signal.

Abstract: A test circuit that senses a misaligned probe during a test includes a first power control section that senses voltage levels of a plurality of sensing lines and controls power supplied to a lower circuit section provided below a part of a pad group, and a second power control section that selectively provides an internal voltage in response to a sensing result of the first power control section.

Abstract: Semiconductor memory devices are described. The semiconductor memory device includes a cell capacitor having a first terminal electrically connected to a storage node and a second terminal electrically connected to an internal node, an internal voltage generator configured to generate an internal voltage signal applied to the internal node in response to a power-up signal, and an initialization element configured to initialize the internal node in response to the power-up signal.

Abstract: A local skew detecting circuit for a semiconductor apparatus include a reference delay block located on the center of the semiconductor apparatus, the reference delay block being configured to receive a predetermined signal and generate a reference delay signal by delaying the predetermined signal by a delay time and a first timing detecting block located on one edge of the semiconductor apparatus, the first timing detecting block being configured to receive the predetermined signal, generate a first delay signal by delaying the predetermined signal by the delay time, and detect an enable timing order of the reference delay signal and the first delay signal to generate a first detection signal.

Abstract: A semiconductor integrated circuit includes a decoding circuit configured to decode one or more test source signals and generate a plurality of test decoding signals, a transmission circuit configured to transmit the plurality of test decoding signals as a plurality of test mode group signals in response to a test enable signal, wherein the transmission circuit outputs the test mode group signals with maintaining a previous output, when the test decoding signals different from each other are sequentially activated, and a test mode signal output circuit configured to output a plurality of test mode signals corresponding to test mode groups, respectively, in response to the plurality of test mode group signals and one or more test mode select signals.

Abstract: A sense amplifier is configured to transfer data on a first data I/O line to a second data I/O line or to transfer data on the second data I/O line to the first data I/O line. The first data I/O line is substantially continuously coupled to the second data I/O line during an active operation.

Abstract: An integrated circuit includes a transfer unit configured to transfer an input signal having a first swing width between a first voltage and a second voltage, a driving unit configured to drive an output terminal to output an output signal having a second swing width in response to the input signal transferred from the transfer unit, and a control unit configured to control the driving unit in response to the output signal.

Abstract: A data output device of a semiconductor memory apparatus includes detection means configured to detect a specified operation frequency range; pre-driving means configured to be inputted with signals; driving means configured to receive outputs of the pre-driving means and drive an output of data; and adjustment means configured to adjust a slew rate of the driving means under the control of an output signal of the detection means.

Abstract: A sense amplifier is configured to transfer data on a first data I/O line to a second data I/O line or to transfer data on the second data I/O line to the first data I/O line. The first data I/O line is substantially continuously coupled to the second data I/O line during an active operation.

Abstract: A semiconductor memory apparatus includes a multi-bit test signal generating device configured to receive an address signal and generate a multi-bit test signal based on the address signal when a multi-bit test write operation is performed.

Abstract: A test circuit that senses a misaligned probe during a test includes a first power control section that senses voltage levels of a plurality of sensing lines and controls power supplied to a lower circuit section provided below a part of a pad group, and a second power control section that selectively provides an internal voltage in response to a sensing result of the first power control section.

Abstract: A local skew detecting circuit for a semiconductor apparatus include a reference delay block located on the center of the semiconductor apparatus, the reference delay block being configured to receive a predetermined signal and generate a reference delay signal by delaying the predetermined signal by a delay time and a first timing detecting block located on one edge of the semiconductor apparatus, the first timing detecting block being configured to receive the predetermined signal, generate a first delay signal by delaying the predetermined signal by the delay time, and detect an enable timing order of the reference delay signal and the first delay signal to generate a first detection signal.

Abstract: A test circuit that senses a misaligned probe during a test includes a first power control section that senses voltage levels of a plurality of sensing lines and controls power supplied to a lower circuit section provided below a part of a pad group, and a second power control section that selectively provides an internal voltage in response to a sensing result of the first power control section.

Abstract: An input circuit is disclosed. The input circuit can include a cross voltage generating block that can be configured to perform charge-sharing on a pair of input signals whose phases are opposite to each other and generate a cross voltage, and an input buffer block that can be configured to buffer the pair of input signals at a voltage level corresponding to a voltage level of the cross voltage and generate an output signal.

Abstract: A local skew detecting circuit for a semiconductor integrated circuit includes a reference delay block that receives a test signal and generates a reference delay signal by delaying the test signal by a predetermined delay time, and a first timing detecting block coupled with the reference delay block, the first timing detecting block configured to receive the test signal, generate a first delay signal by delaying the test signal by the same predetermined delay time, and detect an enable timing order of the reference delay signal and the first delay signal to generate a first detection signal.

Abstract: A circuit for generating negative voltage includes a variable period oscillator configured to generate an oscillator signal enabled in response to a detection signal and to determine a period of the oscillator signal in response to a control signal, a pump configured to perform pumping operations in response to the oscillator signal and to generate a negative voltage by the pumping operations, a negative voltage detecting unit configured to detect the level of the negative voltage to generate the detection signal, and a gate-induced drain leakage current detecting unit configured to measure the amount of a gate-induced drain leakage current to generate the control signal.

Abstract: A method for performing a burn-in test of a metal wire for a signal transmission of a semiconductor device including driving a first terminal of the metal wire with a first voltage and forming a current path in the metal wire by driving a second terminal of the metal wire with a second voltage whose level is different from that of the first voltage.

Abstract: An input circuit is disclosed. The input circuit can include a cross voltage generating block that can be configured to perform charge-sharing on a pair of input signals whose phases are opposite to each other and generate a cross voltage, and an input buffer block that can be configured to buffer the pair of input signals at a voltage level corresponding to a voltage level of the cross voltage and generate an output signal.

Abstract: A data output device of a semiconductor memory apparatus includes detection means configured to detect a specified operation frequency range; pre-driving means configured to be inputted with signals; driving means configured to receive outputs of the pre-driving means and drive an output of data; and adjustment means configured to adjust a slew rate of the driving means under the control of an output signal of the detection means.