Patents by Inventor Hong Sub Kim

Hong Sub Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Curable organopolysiloxane composition for transducers and applications of such curable silicone composition for transducers
    Patent number: 9947858
    Abstract: The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition, dielectric inorganic fine particles having a specific dielectric constant of greater than or equal to 10, and fine particles having a specific dielectric constant of less than 10.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: April 17, 2018
    Assignees: DOW CORNING CORPORATION, DOW CORNING TORAY CO., LTD.
    Inventors: Toyohiko Fujisawa, Hiroshi Fukui, Haruhiko Furukawa, Peter Cheshire Hupfield, Hong Sub Kim, Eiji Kitaura, Kent R. Larson, Wataru Nishiumi, Takuya Ogawa, Masayuki Onishi, Kouichi Ozaki, Keiji Wakita
  • Curable organopolysiloxane composition for transducers and applications of such curable silicone composition for transducers
    Patent number: 9879126
    Abstract: The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition and a compound having a highly dielectric functional group.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: January 30, 2018
    Assignees: DOW CORNING CORPORATION, DOW CORNING TORAY CO., LTD.
    Inventors: Haruhiko Furukawa, Peter Cheshire Hupfield, Hong Sub Kim, Eiji Kitaura, Kent R. Larson, Wataru Nishiumi, Takuya Ogawa, Kouichi Ozaki, Son Thanh Phan, Keiji Wakita
  • Curable Organopolysiloxane Composition For Transducers And Applications Of Such Curable Silicone Composition For Transducers
    Publication number: 20150380636
    Abstract: The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition, dielectric inorganic fine particles having a specific dielectric constant of greater than or equal to 10, and fine particles having a specific dielectric constant of less than 10.
    Type: Application
    Filed: December 26, 2013
    Publication date: December 31, 2015
    Inventors: Toyohiko Fujisawa, Hiroshi Fukui, Haruhiko Furukawa, Peter Cheshire Hupfield, Hong Sub Kim, Eiji Kitaura, Kent R. Larson, Wataru Nishiumi, Takuya Ogawa, Masayuki Onishi, Kouichi Ozaki, Keiji Wakita
  • Curable Organopolysiloxane Composition For Transducers And Applications Of Such Curable Silicone Composition For Transducers
    Publication number: 20150344671
    Abstract: The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition and a compound having a highly dielectric functional group.
    Type: Application
    Filed: December 26, 2013
    Publication date: December 3, 2015
    Inventors: Haruhiko Furukawa, Peter Cheshire Hupfield, Hong Sub Kim, Eiji Kitaura, Kent R. Larson, Wataru Nishiumi, Takuya Ogawa, Kouichi Ozaki, Son Thanh Phan, Keiji Wakita