Abstract: A method of manufacturing a light-emitting diode package, including following steps: providing a mounting base; providing a light-emitting chip on the mounting base, and the light-emitting chip including at least one electrode on the top surface thereof; forming a fluorescent layer on the top surface of the light-emitting chip, and the fluorescent layer covering the electrode; providing a laser generator to emit a focused laser beam to remove a portion of the fluorescent layer covered on the light-emitting chip to form a through-hole; providing a conductive wire to electrically connect the electrode of the light-emitting chip via the through-hole to the mounting base. The conductive wire can then be electrically connecting the electrode to the mounting base via the through-hole. Therefore, the thickness of fluorescent layer around the metal wire would be evenly formed, resulting better uniformity of white light mixing of the light-emitting diode package.

Abstract: A light emitting diode (LED) illumination assembly comprises a base, at least one first LED chip and at least one light modulation subassembly. The base is formed with a receiving groove, in which at least one first arrangement region and at least one second arrangement region recessed from the first arrangement region are located. The first LED chip is mounted on the first arrangement region for projecting at least one first light beam. The light modulation subassembly comprises a second LED chip and a light-transmissible layer. The second LED chip is mounted on the second arrangement region for projecting a second light beam. The light-transmissible layer contains phosphor powder, and covers the second LED chip. The second light beam is stimulated after transmitting through the light-transmissible layer, and mixes with the first light beam after being stimulated, so as to generate an illumination light beam.