Abstract: An apparatus for cleaning wafers includes one or more rows of receptacles for receiving cleaning agents or water The wafers are moved through and downward into the receptacles one by one for allowing the wafers to be cleaned by the cleaning agents first and then cleaned by the water. A vacuuming device may be used for drawing the air of the cleaning agent out of the apparatus. The wafers may be grasped between two grasping arms and separated from each other and moved through the receptacles. About 50 wafers may be cleaned once at a time.