Abstract: Disclosed is an all-solid-state battery capable of suppressing volume expansion during charging and discharging.

Abstract: A positive electrode active material precursor having a uniform particle size distribution and represented by Formula 1, wherein a percentage of fine powder with an average particle diameter (D50) of 1 ?m or less is generated when the positive electrode active material precursor is rolled at 2.5 kgf/cm2 is less than 1%, and an aspect ratio is 0.93 or more, and a method of preparing the positive electrode active material precursor [NixCoyM1zM2w](OH)2 ??[Formula 1] in Formula 1, 0.5?x<1, 0<y?0.5, 0<z?0.5, and 0?w?0.1, M1 includes at least one selected from the group consisting of Mn and Al, and M2 includes at least one selected from the group consisting of Zr, B, W, Mo, Cr, Nb, Mg, Hf, Ta, La, Ti, Sr, Ba, Ce, F, P, S, and Y. A method of preparing the positive electrode active material precursor is also provided.

Abstract: Provided are methods of treating cancer (e.g., non-small cell lung cancer (NSCLC), head and neck squamous cell carcinoma (HNSCC), HER2-positive gastric/gastroesophageal junction (GEJ) cancer, de novo or transformed diffuse large B cell lymphoma (DLBCL), or indolent lymphoma) in an individual that comprise administering to the individual (a) a polypeptide comprising a SIRP? D1 domain variant and an Fc domain variant, and (b) an anti-cancer antibody (e.g., an anti-PD1 antibody, anti-HER2 antibody, or an anti-CD20 antibody). Also provided are related kits pharmaceutical compositions.

Abstract: Stacked semiconductor die assemblies with support members and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a package substrate, a first semiconductor die attached to the package substrate, and a plurality of support members also attached to the package substrate. The plurality of support members can include a first support member and a second support member disposed at opposite sides of the first semiconductor die, and a second semiconductor die can be coupled to the support members such that at least a portion of the second semiconductor die is over the first semiconductor die.

Abstract: Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor device assembly may include a base layer, a dielectric interposer coupled to the base layer and including a first outer surface facing the base layer and an opposing second outer surface facing away from the base layer and spaced apart from the first outer surface in a direction, a first electrical-connection cut-in in the second outer surface that extends, in the direction, toward the first outer surface, and one or more first electrical connections disposed within the first electrical-connection cut-in such that at least a portion of the one or more first electrical connections does not extend, in the direction, beyond the second outer surface.

Abstract: Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods are disclosed herein. In one embodiment, a substrate includes a first pair and a second pair of electrical contacts on a first surface of the substrate. The first pair of electrical contacts can be configured to receive a first surface-mount capacitor, and the second pair of electrical contacts can be configured to receive a second surface-mount capacitor. The first pair of electrical contacts can be spaced apart by a first space, and the second pair of electrical contacts can be spaced apart by a second space. The first and second spaces can correspond to corresponding to first and second distances between electrical contacts of the first and second surface-mount capacitors.

Abstract: The present disclosure provides a method for recycling urea-formaldehyde (UF) from a wood-based panel. In the present disclosure, the UF is depolymerized by an ultrasonic treatment, and depolymerized UF can be reused for UF manufacture and wood-based panel production. The recycled and treated UF can be repeatedly used in wood-based panel manufacture without affecting performances of the wood-based panel. UF-glued wood-based panels can be recycled, and a recycled wood-based panel raw material can replace at least 50% of a non-recycled wood-based raw material for particle board production without affecting performances of the wood-based panel.

Abstract: An embodiment for analyzing and tracking data flow to determine proper schemas for unstructured data. The embodiment may automatically use a sidecar to collect schema discovery rules during conversion of raw data to unstructured data. The embodiment may automatically generate multiple schemas for different tenants using the collected schema discovery rules. The embodiment may automatically use ETL to export unstructured data to SQL databases with the generated multiple schemas for the different tenants. The embodiment may automatically monitor usage data of the SQL databases and collect the usage data. The embodiment may automatically optimize schema discovery using the collected usage data. The embodiment may automatically discover schemas with hot usage and apply the discovered schemas with hot usage to other tenants for consumption and further monitoring.

Abstract: Provided herein, inter alia, are isolated, humanized antibodies that bind an extracellular domain of a human SIRP-? polypeptide. Also provided are polynucleotides, vectors, host cells, and methods of production and use related thereto.

Abstract: Semiconductor devices and associated systems and methods are disclosed herein. In some embodiments, the semiconductor device is an assembly that includes a package substrate having a front side and a backside opposite the front side. A controller die with a first longitudinal footprint can be attached to the front side of the package substrate. A passive electrical component is also attached to the front side of the package substrate. A stack of semiconductor dies can be attached to the controller die and the passive electrical component. The stack of semiconductor dies has a second longitudinal footprint greater than the first longitudinal footprint in at least one dimension. The controller die and the passive electrical component are positioned at least partially within the second longitudinal footprint, thereby at least partially supporting the stack of semiconductor dies.

Abstract: A lost circulation detection device includes a first detection member and a second detection member, a first signal transmitter and a first signal receiver are disposed on the first detection member, and the first signal transmitter transmits a signal along an axial direction of a rockshaft so that the first signal receiver acquires data information of drilling fluid in the axial direction of the rockshaft; a fluid channel penetrating through the second detection member is disposed in the second detection member, and the fluid channel is configurable to be in communication with the rockshaft; a second signal transmitter and a second signal receiver are disposed oppositely on two sides of the fluid channel, and the second signal transmitter transmits a signal along a center line of a second accommodating groove, so that the second signal receiver acquires data information of drilling fluid in a circumferential direction of the rockshaft.

Abstract: A method, computer system, and a computer program product is provided for computer log management. In one embodiment, in response to receiving a log request from a user, an input content is analyzed and adjusted according to input contents and user's previous activities. A similarity analysis and a fairness analysis is performed to determine similarities between the input content, as adjusted, and a plurality of log records in an object library. The similarity analysis includes analyzing any patterns and attributes. The attributes have a dimension, and each dimension has a predefined weight (W). The fairness analysis ensures that one type of log is not favored over others. A best possible match is then determined, and one or more logs are presented to the user providing the best possible match.

Abstract: One or more computer processors generate a debug chain from one or more similar resource bound breakpoints, wherein the debug chain provides dynamic code flow. The one or more computer processors distribute the generated debug chain to one or more tenants.

Abstract: An apparatus includes a substrate for mounting an integrated circuit. The substrate includes a primary layer including a first surface that is a first external surface of the substrate. The substrate includes an inner layer that is located below the primary layer and including a second surface. A portion of the second surface of the inner layer is exposed via an open area associated with the primary layer. The inner layer includes a first multiple of wire bond pads that are exposed via the open area associated with the primary layer.

Abstract: Disclosed is an anodeless all-solid-state battery which may effectively control local volume expansion due to lithium deposited during charging of the battery. The all-solid-state battery includes an anode current collector, an intermediate layer located on the anode current collector, a solid electrolyte layer located on the intermediate layer, a cathode active material layer located on the solid electrolyte layer and including a cathode active material, and a cathode current collector located on the cathode active material layer. The intermediate layer includes carbon particles and metal particles alloyable with lithium, and the carbon particles include a first carbon material, e.g., as a spherical carbon material, and a second carbon material, e.g., a linear carbon material.

Abstract: A microelectronic device package includes a microelectronic device, a masking material defined (MMD) contact, and a non-masking material defined (NMMD) contact. The microelectronic device is supported on, and electrically connected to, one of a package substrate and a redistribution layer. The MMD contact is located in a first region of the one of the package substrate and the redistribution layer and facilitates a first electrical connection between the microelectronic device and the one of the package substrate and the redistribution layer. The NMMD contact is located in a second, different region of the one of the package substrate and the redistribution layer and facilitates a second electrical connection between the microelectronic device and the one of the package substrate and the redistribution layer. Related methods and systems are also disclosed.

Abstract: Provided are methods of treating cancer that comprise administering a polypeptide (e.g. a fusion polypeptide) that comprises a SIRP? D1 domain variant and an Fc domain variant in combination with at least one chemotherapy agent and/or at least one therapeutic antibody. Also provided are related kits.

Abstract: Semiconductor devices, and related systems and methods, are disclosed herein. In some embodiments, the stacked semiconductor device includes a package substrate having an inner surface, a die stack carried by the inner surface, and a stacked capacitor device carried by the inner surface adjacent to the die stack. The die stack can include one or more semiconductor dies, each of which can be electrically coupled to the inner surface by one or more bond wires and/or solder structures. The stacked capacitor device can include a first capacitor having a lower surface attached to the inner surface of the package substrate, a interposer having a first side attached to an upper surface of the first capacitor, and a second capacitor attached to a second side of the interposer opposite the first side.

Abstract: Modular systems in packages, and associated devices, systems, and methods, are disclosed herein. In one embodiment, a system comprises a main module package and an upper module package. The main module package includes a first substrate and a first electronic device mounted on a first side of the first substrate. The upper module package includes a second substrate and one or more second electronic devices mounted on a first side of the second substrate. The second substrate includes a cavity at a second side of the second substrate opposite the first side, and the upper module package is mountable on the first side of the first substrate of the main module package such that the first electronic device is positioned within the cavity and the second substrate generally surrounds at least a portion of a perimeter of the first electronic device.

Abstract: A semiconductor device assembly including a substrate; a first split via including a first via land that is disposed on a surface of the substrate and that has a first footprint with a half-moon shape with a first radius of curvature, and a first via that passes through the substrate and that has a second radius of curvature, wherein the first via is disposed within the first footprint; and a second split via including a second via land that is disposed on the surface of the substrate and that has a second footprint with the half-moon shape with the first radius of curvature, and a second via that passes through the substrate and that has the second radius of curvature, wherein the second via is disposed within the second footprint, wherein the first and second via lands are disposed entirely within a circular region having the first radius of curvature.