Patents by Inventor Hong Wei

Hong Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12356740
    Abstract: Disclosed herein are photodetectors using arrays of pixels with single-photon avalanche diodes (SPADs). The pixel arrays may have configurations that include one or more control transistors for each SPAD collocated on the same chip or wafer as the pixels and located on a surface of the wafer opposite to the light gathering surface of the pixel arrays. The control transistors may be positioned or configured for interconnection with a logic chip that is bonded to the wafer of the pixel array. The pixels may be formed in a substrate having doping gradient. The control transistors may be positioned on or within the SPADs, or adjacent to, but isolated from, the SPADs. Isolation between the individual SPADs and the respective control transistors may make use of shallow trench isolation regions or deep trench isolation regions.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: July 8, 2025
    Assignee: Apple Inc.
    Inventors: Hong Wei Lee, Cristiano L. Niclass, Shingo Mandai, Xiaofeng Fan
  • Patent number: 12344894
    Abstract: Method for selecting mammalian cells having a genetically-desirable trait, the method comprising culturing an embryo in vitro, dividing the cells from the embryo into aliquots, subjecting the cells from at least one of the aliquots to a genetic analysis, and, based on the results of such analysis, selecting an aliquot of cells. Method for selecting mammalian cells having a genetically-desirable trait, the method comprising culturing an embryo in vitro, transferring the cultured embryo into a recipient female, collecting the embryo, dividing the cells from the embryo into aliquots, subjecting the cells from at least one of the aliquots to a genetic analysis, and, based on the results of such analysis, selecting an aliquot of cells.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: July 1, 2025
    Assignee: TRANS OVA GENETICS, L.C.
    Inventors: Poothappillai K. Kasinathan, Hong Wei, Mark F. Allan, David C. Faber
  • Publication number: 20250183225
    Abstract: A method of fabricating a semiconductor chip includes the following steps. A bonding material layer is formed on a first wafer substrate and is patterned to form a first bonding layer having a strength adjustment pattern. A semiconductor component layer and a first interconnect structure layer are formed on a second wafer substrate. The first interconnect structure layer is located. A second bonding layer is formed on the first interconnect structure layer. The second wafer substrate is bonded to the first wafer substrate by contacting the second bonding layer with the first bonding layer. A bonding interface of the second bonding layer and the first bonding layer is smaller than an area of the second bonding layer. A second interconnect structure layer is formed on the semiconductor component layer. A conductor terminal is formed on the second interconnect structure layer.
    Type: Application
    Filed: February 6, 2025
    Publication date: June 5, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hong-Wei Chan, Jiing-Feng Yang, Yung-Shih Cheng, Yao-Te Huang, Hui Lee
  • Publication number: 20250184778
    Abstract: A data quality measurement method and an apparatus are provided. The method includes: A data quality measurement apparatus sends first configuration information to a first data collection node, where the first configuration information is used to configure feature extraction in similarity measurement, the similarity measurement is used to determine a degree of similarity in statistical distribution between different datasets, and the feature extraction is used to extract a feature of a data sample included in the dataset. The data quality measurement apparatus receives a first feature set of a first dataset from the first data collection node, where the first feature set is based on the first configuration information. Accordingly, the data quality measurement apparatus can determine whether the dataset collected by the data collection node meets a low similarity requirement.
    Type: Application
    Filed: January 30, 2025
    Publication date: June 5, 2025
    Inventors: Jing LIANG, Xiaomeng CHAI, Hong WEI, Yan SUN, Rui ZHOU, Liusha YANG, Zhiquan LUO
  • Patent number: 12317216
    Abstract: Embodiments include systems and methods for supporting registration in a fifth generation (5G) new radio (NR) (5GNR) standalone (SA) network by a processor of a multi-subscriber identity module (SIM) wireless device configured with a first subscription and a second subscription. Various embodiments may include determining whether the first subscription received a shared mobile country code (MCC) from the second subscription and the shared MCC is different than an MCC of a home public land mobile network (HPLMN) of the first subscription in response to preforming a full band scan of frequencies supporting the first subscription, and stopping the full band scan by the first subscription and scanning a 5GNR band associated with the shared MCC in response to determining that the first subscription received the shared MCC from the second subscription and the shared MCC is different than the MCC of the HPLMN of the first subscription.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: May 27, 2025
    Assignee: QUALCOMM Incorporated
    Inventors: Yi Liu, Jinglin Zhang, Haojun Wang, Fojian Zhang, Zhenqing Cui, Hong Wei, Jian Li
  • Publication number: 20250156253
    Abstract: A proactive switchover process in a distributed database system evaluates available resources for a plurality of database instances based on database performance metrics of the database instances and resource metrics for physical hosts of the database instances. Periodic collection and storing of the metrics dataset provide for estimating a switching time length required for switching a primary database instance candidate with the current primary database instance. Further estimating based on historic values informs the proactive switchover determination.
    Type: Application
    Filed: November 13, 2023
    Publication date: May 15, 2025
    Inventors: HONG WEI SUN, Peng Hui Jiang, Yu Zhuo Sun, Xi Xue Jia, ZHI HONG LI
  • Patent number: 12274099
    Abstract: Disclosed herein are global shutter image sensors and methods of operating such image sensors. An image sensor includes a semiconductor wafer having a light receiving surface opposite an electrical connection surface; an oxide extending from the light receiving surface toward the electrical connection surface and at least partially surrounding a pixel region; a photodiode disposed within the pixel region; and a set of storage nodes disposed under the photodiode, between the photodiode and the electrical connection surface. The set of storage nodes comprises a first storage node and a second storage node. The storage nodes may be disposed vertically beneath the photodiode, or side by side.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: April 8, 2025
    Assignee: Apple Inc.
    Inventors: Dajiang Yang, Hong Wei Lee, Xiaofeng Fan, Oray O. Cellek, Xiangli Li, Kai Shen
  • Publication number: 20250111735
    Abstract: There are provided a gaming machine and method that utilize game-logic circuitry and a presentation assembly configured to present a plurality of symbol-bearing base reels and a base array. The plurality of base reels are repeatedly spun and stopped to land symbols from the base reels in the base array. In response to the landed symbols including a triggering symbol combination, a level up mode recursively adds additional pluralities of symbol bearing reels and arrays for each subsequent triggering symbol combination prior to exhaustion of a spin counter. The symbols forming each triggering combination are at least partially removed from the reels and replaced with replacement symbols including enhanced payment symbols to make the game more lucrative at each level.
    Type: Application
    Filed: October 2, 2024
    Publication date: April 3, 2025
    Inventors: Ted HASE, Kyle LEIBOVITZ, Joshua SIEVERDING, Yanis TSOMBANIDIS, Emily WASIELEWSKI, Hong WEI
  • Patent number: 12260714
    Abstract: A gaming machine is described herein. The gaming machine includes a processor programmed to execute an algorithm including the steps of displaying a game screen including a plurality reels, a bonus wheel including a plurality of wheel wedges displaying prize symbols and a prize selector, and a bonus wheel meter including a number of bonus wheel symbols. The processor is programmed to spin and stop the reels to display an instance of the game, detect an appearance of a bonus wheel symbol appearing in the reels with the reels stopped, and increase the number of bonus wheel symbols included in the bonus wheel meter based on the detected bonus wheel symbol. The processor initiates a bonus wheel feature including a spin of the bonus wheel upon determining the increased number of bonus wheel symbols included in the bonus wheel meter is equal to a predefined number of bonus wheel symbols.
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: March 25, 2025
    Assignee: Konami Gaming, Inc.
    Inventors: Hong Wei, Scott Dorsch, Sam Ellis
  • Publication number: 20250083536
    Abstract: A trailer adapted for use with an electric tractor is provided. In one embodiment, the trailer includes: a chassis comprising at least one electric drive axle, the at least one drive axle comprising at least one electric drive motor; a motor control unit (MCU) coupled to the at least one electric drive motor of the electric drive axle; a power storage device coupled to the at least one electric drive motor via the motor control unit (MCU); at least one sensor; and a vehicle control unit (VCU) coupled to the motor control unit (MCU), the power storage device, and the at least one sensor, the vehicle control unit adapted to receive an input signal from the at least one sensor and provide at least one control signal to the power storage device and the motor control unit (MCU), wherein the VCU is adapted to control the motor control unit to operate the at least one motor of the electric drive axle in a drive mode and in an energy recovery mode.
    Type: Application
    Filed: November 12, 2024
    Publication date: March 13, 2025
    Inventor: HONG-WEI JING
  • Publication number: 20250072081
    Abstract: A method for forming a semiconductor structure is provided. The method includes providing a substrate with a word line region and a select gate region adjacent to each other, sequentially forming a stack layer and a hard mask layer on the substrate, and forming patterned mandrels on the hard mask layer. The method includes forming sidewall spacers on the patterned mandrels, and forming a patterned photoresist over the select gate region. The method further includes sequentially patterning the hard mask layer and the stack layer to form word lines in the word line region and a select gate in the select gate region, respectively. There is a first spacing between the word lines, and a second spacing between the select gate and the first word line of the word lines closest to the select gate. The second spacing is greater than the first spacing.
    Type: Application
    Filed: March 28, 2024
    Publication date: February 27, 2025
    Applicant: Winbond Electronics Corp.
    Inventors: Cheng-Hong WEI, Tseng-Yao PAN
  • Publication number: 20250063439
    Abstract: Methods, systems, and devices for wireless communications are described. Some wireless communications systems may support inter-frequency measurement techniques. A user equipment (UE) may receive a control message indicating respective measurement configurations for multiple measurement objects. The UE may perform a measurement of a first measurement object from the plurality of measurement objects and transmit a first measurement report for the first measurement object in accordance with a measurement order. In other examples, the UE may perform measurements of each of the multiple measurement objects, including the first measurement object, prior to transmitting the measurement report, where respective measurement reports may be transmitted in accordance with the measurement order. In any case, the measurement order may be determined using a set of parameters corresponding to a current state of the UE, one or more services at the UE, a user preference, or any combination thereof.
    Type: Application
    Filed: March 2, 2022
    Publication date: February 20, 2025
    Inventors: Haojun WANG, Kaikai YANG, Jinglin ZHANG, Zhenqing CUI, Hong WEI, Tom CHIN
  • Patent number: 12230603
    Abstract: A method of fabricating a semiconductor chip includes the following steps. A bonding material layer is formed on a first wafer substrate and is patterned to form a first bonding layer having a strength adjustment pattern. A semiconductor component layer and a first interconnect structure layer are formed on a second wafer substrate. The first interconnect structure layer is located. A second bonding layer is formed on the first interconnect structure layer. The second wafer substrate is bonded to the first wafer substrate by contacting the second bonding layer with the first bonding layer. A bonding interface of the second bonding layer and the first bonding layer is smaller than an area of the second bonding layer. A second interconnect structure layer is formed on the semiconductor component layer. A conductor terminal is formed on the second interconnect structure layer.
    Type: Grant
    Filed: July 26, 2023
    Date of Patent: February 18, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hong-Wei Chan, Jiing-Feng Yang, Yung-Shih Cheng, Yao-Te Huang, Hui Lee
  • Patent number: 12189515
    Abstract: Examples described herein provide a computer-implemented method for identifying regression test failures that includes comparing a base code to a new code to locate an updated aspect of a program. The method further includes inserting debug code into corresponding source files for each of the base code and the new code for the updated aspect. The method further includes building a first image for the base code and a second image for the new code, the first and second images running in respective first and second containers. The method further includes comparing debugging outputs from a regression test of the respective first and second containers to identify a regression test failure. The method further includes implementing a corrective action to correct the regression test failure.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: January 7, 2025
    Assignee: International Business Machines Corporation
    Inventors: Xiao-Yu Li, Hua Wei Fan, Jiangang Deng, Hong Wei Sun, Xiao Ling Chen, Wen Ji Huang
  • Patent number: 12193344
    Abstract: A RRAM and its manufacturing method are provided. The RRAM includes a first dielectric layer formed on a substrate, and two memory cells. The two memory cells include two bottom electrode structures separated from each other. Each bottom electrode structure fills one of two trenches in the first dielectric layer. The two memory cells also include a resistance switching layer and a top electrode structure. The resistance switching layer is conformally formed on the surface of an opening in the first dielectric layer, and the opening is between the two trenches. The top electrode structure is on the resistance switching layer and fills the opening. A top surface of the first dielectric layer, top surfaces of the bottom electrode structures, a top surface of the resistance switching layer, and a top surface of the top electrode structure are coplanar.
    Type: Grant
    Filed: August 21, 2023
    Date of Patent: January 7, 2025
    Assignee: WINBOND ELECTRONICS CORP
    Inventors: Cheng-Hong Wei, Chien-Hsiang Yu, Hung-Sheng Chen
  • Patent number: 12183040
    Abstract: The panoramic surround view system in the vehicle can control the projection device of the vehicle to project the preset pattern on the ground around the vehicle, acquire the plurality of target photographs including the preset pattern, and generate the target calibrating data of the surround view cameras according to the plurality of target photographs, so that the surround view cameras of the panoramic surround view system can be calibrated by using the target calibrating data to obtain the panoramic surround view image. Therefore, when the user needs to re-calibrate the calibrating data of the image splicing of the panoramic surround view system of the vehicle, the calibrating process can be completed by only by using the projection device of the vehicle, without using a special calibrating site and equipment, thus simplifying the calibrating operation steps and saving time.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: December 31, 2024
    Assignee: GREAT WALL MOTOR COMPANY LIMITED
    Inventors: Fuhai Duan, Shuli Li, Bo Gao, Tong Gao, Hong Wei, Zhichao Fan, Dongchun Xu, Peng Hao, Bingxu Ma, Jianzhang Yang, Rongchang Xu, Chong Wang
  • Publication number: 20240395728
    Abstract: Semiconductor devices and methods of manufacturing the semiconductor devices are described herein. A method includes forming an interconnect structure over a device wafer. The device wafer includes a first integrated circuit, a semiconductor substrate, and a redistribution structure. The method further includes forming a metallization layer and a group of dummy insertion structures having a stepped pattern density in a topmost dielectric layer of the interconnect structure. The group of dummy insertion structures and the metallization layer are planarized with the dielectric layer. The method further includes forming a first bonding layer over the group of dummy insertion structures, the metallization layer, and the dielectric layer. The method further includes bonding a carrier wafer to the first bonding layer, forming an opening through the semiconductor substrate, and forming a conductive via in the opening and electrically coupled to the redistribution structure.
    Type: Application
    Filed: July 31, 2024
    Publication date: November 28, 2024
    Inventors: Yao-Te Huang, Hong-Wei Chan, Yung-Shih Cheng, Jiing-Feng Yang, Hui Lee
  • Publication number: 20240387630
    Abstract: A method includes forming a transistor over a front side of a substrate; forming a front-side interconnect structure over the transistor, the front-side interconnect structure comprising layers of conductive lines, and conductive vias interconnecting the layers of conductive lines; forming a first bonding layer over the front-side interconnect structure; forming a second bonding layer over a carrier substrate; bonding the front-side interconnect structure to the carrier substrate by pressing the first bonding layer against the second bonding layer; and forming a backside interconnect structure over a backside of the substrate after bonding the front-side interconnect structure to the carrier substrate.
    Type: Application
    Filed: July 29, 2024
    Publication date: November 21, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Guan-Yao TU, Su-Jen SUNG, Tze-Liang LEE, Hong-Wei CHAN
  • Publication number: 20240378104
    Abstract: A method, system and computer program product for diagnosing a malfunctioning or misused electronic device is disclosed. The method includes performing analytics on at least one of video and audio to automatically detect at least one anomaly exhibited by the electronic device or exhibited in relation to user interaction with the electronic device, the at least one anomaly being distinguishable from other non-present anomalies detectable by a computer system that carries out the performing of the analytics.
    Type: Application
    Filed: May 10, 2023
    Publication date: November 14, 2024
    Inventors: REXY PRAKASH CHACKO, MURALI KUYIMBIL, AINA AZIZ, HONG WEI LIM
  • Patent number: D1053621
    Type: Grant
    Filed: May 13, 2024
    Date of Patent: December 10, 2024
    Inventor: Hong Wei