Patents by Inventor Hong-Wen Lin

Hong-Wen Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for prevention or treatment of amyotrophic lateral sclerosis by administering gastrodin
    Patent number: 11963969
    Abstract: Provided is a pharmaceutical composition including gastrodin and a use thereof for the prevention or the treatment of amyotrophic lateral sclerosis. The pharmaceutical composition is effective in reducing neuronal axon degeneration and neurofibromin accumulation, improving symptoms of amyotrophic lateral sclerosis and extending life of patients of amyotrophic lateral sclerosis.
    Type: Grant
    Filed: September 16, 2022
    Date of Patent: April 23, 2024
    Assignee: BUDDHIST TZU CHI MEDICAL FOUNDATION
    Inventors: Chia-Yu Chang, Shinn-Zong Lin, Hsiao-Chien Ting, Hui-I Yang, Horng-Jyh Harn, Hong-Lin Su, Ching-Ann Liu, Yu-Shuan Chen, Tzyy-Wen Chiou, Tsung-Jung Ho
  • Applications of butylidenephthalide
    Patent number: 11920157
    Abstract: Applications of butylidenephthalide (BP), comprising the use of BP in providing a kit for promoting differentiation of stem cells into brown adipose cells, and the use of BP in preparing a medicament, wherein the medicament is used for inhibiting the accumulation of white adipose cells, promoting the conversion of white adipose cells into brown adipose cells, inhibiting weight gain and/or reducing the content of triglycerides, glucose, and total cholesterol in blood.
    Type: Grant
    Filed: September 15, 2022
    Date of Patent: March 5, 2024
    Assignee: NATIONAL DONG HWA UNIVERSITY
    Inventors: Tzyy-Wen Chiou, Shinn-Zong Lin, Horng-Jyh Harn, Hong-Lin Su, Shih-Ping Liu, Kang-Yun Lu, Jeanne Hsieh
  • Integrated circuit and seal ring
    Patent number: 8933539
    Abstract: An integrated circuit (IC) and a seal ring thereof are provided. The IC includes a first seal ring. The first seal ring is disposed in the IC. The first seal ring includes at least one stagger structure. The at least one stagger structure includes at least one stagger unit. The at least one stagger unit makes staggered connection with another neighboring stagger unit.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: January 13, 2015
    Assignee: VIA Telecom Co., Ltd.
    Inventors: Bing-Jye Kuo, Hong-Wen Lin, Yu-Jie Ji
  • INTEGRATED CIRCUIT AND SEAL RING
    Publication number: 20140077341
    Abstract: An integrated circuit (IC) and a seal ring thereof are provided. The IC includes a first seal ring. The first seal ring is disposed in the IC. The first seal ring includes at least one stagger structure. The at least one stagger structure includes at least one stagger unit. The at least one stagger unit makes staggered connection with another neighboring stagger unit.
    Type: Application
    Filed: September 14, 2012
    Publication date: March 20, 2014
    Applicant: VIA TELECOM, INC.
    Inventors: Bing-Jye Kuo, Hong-Wen Lin, Yu-Jie Ji