Patents by Inventor Hong Won Chae

Hong Won Chae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyoxymethylene resin composition and molded article manufactured with the same
    Patent number: 10808067
    Abstract: Disclosed is a polyoxymethylene resin composition that includes a filler in an amount of about 5 to 30 wt %, a formaldehyde reducing agent in an amount of about 0.01 to 1 wt %, and a polyoxymethylene resin constituting the remaining balance of the polyoxymethylene resin composition, all the wt % based on the total weight of the polyoxymethylene resin composition. In particular, per 1 g of the polyoxymethylene resin may include an amount of 30 to 40 ?mol of formate at terminal ends of the polyoxymethylene resin.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: October 20, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Joon Yong Song, Shin Tae Bae, KieYoun Jeong, Soon Young Cha, Hong Won Chae, Hyeon Cheol Kim
  • POLYOXYMETHYLENE RESIN COMPOSITION AND MOLDED ARTICLE MANUFACTURED WITH THE SAME
    Publication number: 20190161572
    Abstract: Disclosed is a polyoxymethylene resin composition that includes a filler in an amount of about 5 to 30 wt %, a formaldehyde reducing agent in an amount of about 0.01 to 1 wt %, and a polyoxymethylene resin constituting the remaining balance of the polyoxymethylene resin composition, all the wt % based on the total weight of the polyoxymethylene resin composition. In particular, per 1 g of the polyoxymethylene resin may include an amount of 30 to 40 ?mol of formate at terminal ends of the polyoxymethylene resin.
    Type: Application
    Filed: November 1, 2018
    Publication date: May 30, 2019
    Inventors: Joon Yong Song, Shin Tae Bae, KieYoun Jeong, Soon Young Cha, Hong Won Chae, Hyeon Cheol Kim