Abstract: An embodiment composition for solid electrolyte membranes of all-solid-state batteries includes a sulfide-based solid electrolyte and a cross-linking agent including two or more acrylate functionalities. An embodiment method of manufacturing a solid electrolyte membrane for an all-solid-state battery includes forming a composition including a sulfide-based solid electrolyte and a cross-linking agent including two or more acrylate functionalities and cross-linking the composition.

Abstract: Disclosed is an image segmentation device. The image segmentation device may include: a storage unit storing a segmentation model learned so as to segment at least one predetermined object; and at least one processor inputting input data into the segmentation model and segmenting at least one predetermined object in the input data, in which the segmentation model may include an encoder including at least one dimension reduction block reducing a dimension of the input data, a decoder including at least one dimension increase block increasing the dimension of output data output from the encoder by using data output from at least one dimension reduction block, and an auxiliary classification model receiving the output data and recognizing whether a specific object is included in the output data.

Abstract: Disclosed herein are an apparatus and method for processing vehicle data security based on a cloud.

Abstract: A fan-out semiconductor package includes a redistribution layer, an interconnection member, a semiconductor chip, and a protective layer. The interconnection member has a through hole disposed on the redistribution layer. The semiconductor chip is disposed on the redistribution layer exposed within the through hole. The protective layer is formed between the redistribution layer and the interconnection member, and coupled to the interconnection member to protect the interconnection member.

Abstract: A metrology system includes a timing estimator, a sensor, and a position estimator. The timing estimator receives a control signal transmitted at a first timing of a first control loop and estimates a second timing at which the control signal is transmitted in a second control loop subsequent to the first control loop. The sensor senses position information of a wafer. The position estimator estimates the position information of the wafer at the estimated second timing based on the sensed position information of the wafer and outputs the estimated position information of the wafer based on a position request signal.

Abstract: A metrology system includes a timing estimator, a sensor, and a position estimator. The timing estimator receives a control signal transmitted at a first timing of a first control loop and estimates a second timing at which the control signal is transmitted in a second control loop subsequent to the first control loop. The sensor senses position information of a wafer. The position estimator estimates the position information of the wafer at the estimated second timing based on the sensed position information of the wafer and outputs the estimated position information of the wafer based on a position request signal.

Abstract: A fan-out semiconductor package includes a redistribution layer, an interconnection member, a semiconductor chip, and a protective layer. The interconnection member has a through hole disposed on the redistribution layer. The semiconductor chip is disposed on the redistribution layer exposed within the through hole. The protective layer is formed between the redistribution layer and the interconnection member, and coupled to the interconnection member to protect the interconnection member.

Abstract: A robot capable of communicating according to a gesture may include a plurality of link members, and an outer cover member surrounding the plurality of link members. The shape of the outer cover member is varied into a curved shape, when the outer cover member is adhered closely to the plurality of link members, according to the variation of the shapes of the plurality of link members.

Abstract: A dialog system uses an extended domain in order to have a dialog with a user using natural language. If a dialog pattern actually input by the user is different from a dialog pattern predicted by an expert, an extended domain generated in real time based on user input is used and an extended domain generated in advance is used to have a dialog with the user.

Abstract: A coil component and a method of manufacturing a coil component are disclosed. The coil component includes an insulation layer including a coil conductor, and a magnetic-resin composite layer disposed on the insulation layer. The magnetic-resin composite layer includes a magnetic core.

Abstract: A coil component includes an insulation layer having a coil conductor, and a magnetic-resin composite layer disposed on the insulation layer. The magnetic-resin composite layer includes a heat-dissipating filler.

Abstract: Disclosed herein are a method for manufacturing an electronic component embedding substrate and an electronic component embedding substrate. The method for manufacturing an electronic component embedding substrate includes: inserting an electronic component into a cavity formed in a core substrate; stacking a first insulating layer on one side of the core substrate into which the electronic component is inserted; performing surface treatment on the other side of the core substrate opposite to a direction in which the first insulating layer is stacked to improve a surface roughness of at least an exposed surface of the first insulating layer; and stacking a second insulating layer on the other side of the core substrate so as to be bonded to the exposed surface of the first insulating layer of which the surface roughness is improved. In addition, disclosed herein is the electronic component embedding substrate.

Abstract: Disclosed is a coil component and method of manufacturing the coil component. The coil component includes a core magnetic layer, coil conductors formed on two opposing surfaces of the core magnetic layer, and outer magnetic layers laminated on the core magnetic layer and covering the coil conductors.

Abstract: A coil-embedded substrate and a method of manufacturing the same are provided. The coil-embedded substrate includes a substrate having a hollow portion disposed therein, a coil conductor disposed in the substrate and having a spiral shape winding about the hollow portion, a magnetic core disposed in the hollow portion, and a cover layer covering the substrate and the hollow portion.

Abstract: An electronic component embedded substrate is disclosed. The electronic component embedded substrate in accordance with an embodiment of the present invention includes: a core substrate having a cavity formed therein; a plurality of electronic components embedded in the cavity and arranged in a predetermined format; and a plurality of dielectric spacers interposed in between the plurality of electronic components that are adjacent to one another in the cavity.

Abstract: An electronic component embedded substrate is disclosed. The electronic component embedded substrate in accordance with an embodiment of the present invention includes: a core substrate having a cavity formed therein; a plurality of electronic components embedded in the cavity and arranged in a predetermined format; and a plurality of dielectric spacers interposed in between the plurality of electronic components that are adjacent to one another in the cavity.

Abstract: Embodiments of the invention provide an electronic component-embedded substrate and a manufacturing method thereof. According to at least one embodiment, the electronic component-embedded substrate includes a cavity formed in a core substrate and including two or more embedding spaces which have a rectangular shape (when viewed on a plane) and are connected to each other by a connecting space, and two or more electronic components separately accommodated in the embedding spaces of the cavity, respectively. According to at least one embodiment, neighboring long sides of first and second embedding spaces are partially connected to each other by the connecting space, and one side (when viewed on the plane) forming a connecting width of the connecting space connecting the first and second embedding spaces to each other coincides with one short side of the first embedding space, and the other side (when viewed on the plane) coincides with the other short side of the second embedding space.

Abstract: Disclosed herein are a method for manufacturing an electronic component embedding substrate and an electronic component embedding substrate. The method for manufacturing an electronic component embedding substrate includes: inserting an electronic component into a cavity formed in a core substrate; stacking a first insulating layer on one side of the core substrate into which the electronic component is inserted; performing surface treatment on the other side of the core substrate opposite to a direction in which the first insulating layer is stacked to improve a surface roughness of at least an exposed surface of the first insulating layer; and stacking a second insulating layer on the other side of the core substrate so as to be bonded to the exposed surface of the first insulating layer of which the surface roughness is improved. In addition, disclosed herein is the electronic component embedding substrate.

Abstract: A method of manufacturing a capacitor-embedded printed circuit board using a first conductive layer formed on one side of an insulation layer, the method including: forming a second conductive layer on one side of the first conductive layer; forming a second electrode by removing a portion of the second conductive layer; forming a first electrode by removing a portion of the first conductive layer in correspondence with the second electrode; and forming a dielectric layer on one side of the second electrode.

Abstract: Disclosed herein is a robot, which is capable of communicating according to a gesture. The robot includes a plurality of link members, and an outer cover member surrounding the plurality of link members. The shape of the outer cover member is varied into a curved shape, when the outer cover member is adhered closely to the plurality of link members, according to the variation of the shapes of the plurality of link members.