Patents by Inventor Hong Xia Fu

Hong Xia Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer process for molded chip scale package (MCSP) with thick backside metallization
    Patent number: 9245861
    Abstract: A wafer process for MCSP comprises: depositing a metal bump on bonding pads of chips; forming a first packaging layer at front surface of wafer covering metal bumps while forming an un-covered ring at the edge of wafer to expose the ends of each scribe line located between two adjacent chips; thinning first packaging layer to expose metal bumps; grinding back surface of wafer to form a recessed space and a support ring at the edge of the wafer; depositing a metal seed layer and a thick metal layer at bottom surface of wafer in recessed space in a sequence; cutting off the edge portion of wafer; and separating individual chips from wafer by cutting through first packaging layer, the wafer and the metal seed and metal layers along the scribe line.
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: January 26, 2016
    Assignee: ALPHA AND OMEGA SEMICONDUCTOR INCORPORATED
    Inventors: Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Zhiqiang Niu, Guo Feng Lian, Hong Xia Fu, Yu Ping Gong
  • WAFER PROCESS FOR MOLDED CHIP SCALE PACKAGE (MCSP) WITH THICK BACKSIDE METALLIZATION
    Publication number: 20140315350
    Abstract: A wafer process for MCSP comprises: depositing a metal bump on bonding pads of chips; forming a first packaging layer at front surface of wafer covering metal bumps while forming an un-covered ring at the edge of wafer to expose the ends of each scribe line located between two adjacent chips; thinning first packaging layer to expose metal bumps; grinding back surface of wafer to form a recessed space and a support ring at the edge of the wafer; depositing a metal seed layer and a thick metal layer at bottom surface of wafer in recessed space in a sequence; cutting off the edge portion of wafer; and separating individual chips from wafer by cutting through first packaging layer, the wafer and the metal seed and metal layers along the scribe line.
    Type: Application
    Filed: June 27, 2014
    Publication date: October 23, 2014
    Inventors: Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Zhiqiang Niu, Guo Feng Lian, Hong Xia Fu, Yu Ping Gong