Patents by Inventor HONG-XIA SHENG

HONG-XIA SHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device
    Patent number: 9179563
    Abstract: An electronic device includes a case and a connector. The case includes a first sidewall, a second sidewall perpendicularly connected to the first sidewall, and a pair of latching protrusions. A through hole is defined in the first sidewall. The pair of latching protrusions is located on the two opposite sides of the through hole and perpendicular extended from the second sidewall. Each of the latching protrusions comprises a first side near to the through hole and a second side away from the through hole. The connector is inserted in the case. The connector includes a shaft portion and a flange radially extending from the shaft portion. The shaft portion is inserted into the through hole. Thus, securing the connector from falling.
    Type: Grant
    Filed: January 22, 2014
    Date of Patent: November 3, 2015
    Assignees: AMBIT MICROSYSTEMS (SHANGHAI) LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Dong Qin, Hong-Xia Sheng, Hui Hu
  • ELECTRONIC DEVICE
    Publication number: 20140211383
    Abstract: An electronic device includes a case and a connector. The case includes a first sidewall, a second sidewall perpendicularly connected to the first sidewall, and a pair of latching protrusions. A through hole is defined in the first sidewall. The pair of latching protrusions is located on the two opposite sides of the through hole and perpendicular extended from the second sidewall. Each of the latching protrusions comprises a first side near to the through hole and a second side away from the through hole. The connector is inserted in the case. The connector includes a shaft portion and a flange radially extending from the shaft portion. The shaft portion is inserted into the through hole. Thus, securing the connector from falling.
    Type: Application
    Filed: January 22, 2014
    Publication date: July 31, 2014
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., AMBIT MICROSYSTEMS (SHANGHAI) LTD.
    Inventors: DONG QIN, HONG-XIA SHENG, HUI HU