Abstract: The present invention is directed to micro- and nano-scale imprinting methods and the use of such methods to fabricate supported and/or free-standing 3-D micro- and/or nano-structures of polymeric, ceramic, and/or metallic materials, particularly for pixel segregation in OLED-based displays. In some embodiments, a duo-mold approach is employed in the fabrication of these structures. In such methods, surface treatments are employed to impart differential surface energies to different molds and/or different parts of the mold(s). Such surface treatments permit the formation of three-dimensional (3-D) structures through imprinting and the transfer of such structures to a substrate. In some or other embodiments, such surface treatments and variation in glass transition temperature of the polymers used can facilitate separation of the 3-D structures from the molds to form free-standing micro- and/or nano-structures individually and/or in a film.

Abstract: A method for forming hierarchical patterns on an article by nanoimprinting is disclosed. The method includes using a first mould to form a primary pattern on the article at a first temperature and a first pressure, the first temperature and the first pressure being able to reduce the elastic modulus of the article; and using a second mould to form a second pattern on the primary pattern at a second temperature that is below the article's glass transition temperature, the forming of the second pattern being at a second pressure.

Abstract: There is disclosed an imprinted polymer support for solid phase organic synthesis (SPOS). The polymer support being obtainable from a method that comprises providing a substrate and a mold, the mold having a defined surface pattern. A composition is placed between the defined surface pattern of the mold and the substrate. The composition comprises a polymerisation medium with at least one functional monomer and a free radical initiator. The composition is polymerised to form an array of polymer imprints adhered to the substrate.

Abstract: An improved method of fabricating a device such as OLED is disclosed. The method includes applying an adhesive on a cap or substrate. The adhesive is partially cured to initiate the cross-linking process while remaining in the liquid phase. The cap is then mounted onto the substrate and the adhesive is cured to encapsulate the device. By partially curing the adhesive prior to mounting the cap, the curing of the adhesive can be achieved without prolonged exposure to UV radiation or high temperatures which can adversely impact the device.

Abstract: A method of removing organic material having a conjugated structure from a selected region of a surface of an organic microelectronic device (OMED) during production of the OMED, the method comprising the acts of providing a source of ultraviolet radiation, irradiating at least the selected region of the surface of the OMED with ultraviolet radiation, thereby photolyzing at least some of the organic material and subjecting the selected region of the surface of the OMED to a temperature sufficient to evaporate at least some of the photolysed organic material.

Abstract: An improved method of fabricating a device such as OLED is disclosed. The method includes applying an adhesive on a cap or substrate. The adhesive is partially cured to initiate the cross-linking process while remaining in the liquid phase. The cap is then mounted onto the substrate and the adhesive is cured to encapsulate the device. By partially curing the adhesive prior to mounting the cap, the curing of the adhesive can be achieved without prolonged exposure to UV radiation or high temperatures which can adversely impact the device.