Abstract: A semiconductor device is located between a first die-set part and a second die-set part of a press, and the first and second die-set parts are moved relative to each other for punching and shaping the semiconductor device therebetween. At least one parameter is monitored with at least one sensor attached to the first die-set part and/or the second die-set part at different positions of the first die-set part when it is moving relative to the second die-set part. Variations of the at least one parameter at different relative positions of the first and second die-set parts are compared, and a failure is determined to have occurred when the present variation of the parameter is different from its expected variation during normal operation of the press when there is no failure.

Abstract: An apparatus and a method for detecting a failure in a press for punching semiconductor devices are provided, where the method comprises the steps of locating a semiconductor device between a first die-set part and a second die-set part comprised in the press, and moving the first die-set part and the second die-set part relative to each other for punching the semiconductor device therebetween.