Abstract: An inspecting apparatus for a semiconductor device includes a match plate; a contact module combined with the match plate and including a radiator to radiate heat from the semiconductor device to the outside and a tester to contact the leads of the semiconductor device; and a heat pipe provided in the radiator. The inspecting apparatus performs testing at a constant temperature, regardless of heat from the semiconductor device, by transferring the heat quickly and efficiently, thereby producing more accurate test results. The apparatus also improves productivity and saves expense by removing faulty test results caused by incorrectly identifying a qualified semiconductor device as a defective semiconductor device.

Abstract: An inspecting apparatus for semiconductor devices comprising: a match plate; a contact module combined with the match plate, itself comprising a radiator to radiate heat from the semiconductor device to the outside and a tester to contact the leads of the semiconductor device; and a heat pipe provided in the radiator. Accordingly, the inspecting apparatus for semiconductor devices according to the present invention performs testing at a constant temperature, regardless of heat from the semiconductor device, by transferring heat from the semiconductor device quickly and efficiently, thereby producing more accurate test results.