Abstract: A first permissible operating range of the self-elevating vessel is determined based on a first structural analysis of the self-elevating vessel under a first set of conditions. A structural utilization ratio of the self-elevating vessel is determined based on a second structural analysis of the self-elevating vessel under first and second sets of conditions. Safety of lowering the self-elevating vessel from an elevated state to a first hull draft level is determined when the structural utilization ratio is less than a predetermined value. Safety of lowering the self-elevating vessel from the first hull draft level to a second hull draft level is indicated when positional displacement data obtained while the vessel is at the first hull draft level indicates that the positional displacement of the self-elevating vessel while at the first hull draft level is within the first permissible operating range.

Abstract: A first permissible operating range of the self-elevating vessel is determined based on a first structural analysis of the self-elevating vessel under a first set of conditions. A structural utilization ratio of the self-elevating vessel is determined based on a second structural analysis of the self-elevating vessel under first and second sets of conditions. Safety of lowering the self-elevating vessel from an elevated state to a first hull draft level is determined when the structural utilization ratio is less than a predetermined value. Safety of lowering the self-elevating vessel from the first hull draft level to a second hull draft level is indicated when positional displacement data obtained while the vessel is at the first hull draft level indicates that the positional displacement of the self-elevating vessel while at the first hull draft level is within the first permissible operating range.

Abstract: A molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layer in accordance with the present invention is used to form an adhering layer on a substrate and a sacrificial layer on the adhering layer. The sacrificial layer is patterned according to the copper interconnecting wires and displaced to form the copper interconnecting wires in a specific chemical solution.

Abstract: A molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layer in accordance with the present invention is used to form an adhering layer on a substrate and a sacrificial layer on the adhering layer. The sacrificial layer is patterned according to the copper interconnecting wires and displaced to form the copper interconnecting wires in a specific chemical solution.