Patents by Inventor Hong-Yuan Huang

Hong-Yuan Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9746465
    Abstract: A magnetic bead-based digital microfluidic immunoanalysis device and a method thereof are provided, which includes a lower plate, an upper plate disposed above the lower plate, a separating structure therebetween and a magnet disposed on the upper plate or the lower plate. The lower plate includes a first electrode layer including a plurality of channel electrodes with different sizes. A droplet containing few magnetic beads is adapted to be disposed on the lower plate and corresponding to the channel electrodes. The magnet attracts the magnetic beads to approach to the smaller one of the channel electrodes though a magnetic force, and when a voltage is applied to the first electrode layer, the droplet is divided to a detection portion with the magnetic beads and a waste-liquid portion without the magnetic beads respectively corresponding to the smaller one and the larger one of the channel electrodes through a dual-direction electrowetting-on-dielectric force.
    Type: Grant
    Filed: June 15, 2015
    Date of Patent: August 29, 2017
    Assignee: National Chiao Tung University
    Inventors: Wensyang Hsu, Cheng-Yeh Huang, Po-Yen Tsai, Po-Huai Shih, Shih-Kang Fan, Da-Jeng Yao, Cheng-Hsien Liu, Hong-Yuan Huang
  • Patent number: 9663751
    Abstract: The present disclosure illustrates a platform system for in vitro cell co-cultivation with automatic trapping function. The platform system aims to develop a bio-chip applied in cell culture systems, and has several features. The first feature is that this co-cultivation platform can construct a micro environment suitable for culture of various cells. The second feature is dynamic perfusion. The microfluidic system is used to dynamically replace the culture medium, in order to maintain an appropriate environment for the growth of cells. The third feature is the automatic trapping. The cells to be cultured can be trapped in a suitable location according to the flow resistance, so that the damaged on the cell caused by manual operation can be minimized.
    Type: Grant
    Filed: January 2, 2015
    Date of Patent: May 30, 2017
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Ting-Ju Yueh, Chi-Fan Chen, Kuo-Wei Chang, Pei-Yu Chang, Cheng-Hsien Liu, Hong-Yuan Huang, Chin-Jung Li, Chang-Hung Tien, Da-Jeng Yao, Shih-Kang Fan, Wen-Syang Hsu
  • Publication number: 20160274098
    Abstract: A magnetic bead-based digital microfluidic immunoanalysis device and a method thereof are provided, which includes a lower plate, an upper plate disposed above the lower plate, a separating structure therebetween and a magnet disposed on the upper plate or the lower plate. The lower plate includes a first electrode layer including a plurality of channel electrodes with different sizes. A droplet containing few magnetic beads is adapted to be disposed on the lower plate and corresponding to the channel electrodes. The magnet attracts the magnetic beads to approach to the smaller one of the channel electrodes though a magnetic force, and when a voltage is applied to the first electrode layer, the droplet is divided to a detection portion with the magnetic beads and a waste-liquid portion without the magnetic beads respectively corresponding to the smaller one and the larger one of the channel electrodes through a dual-direction electrowetting-on-dielectric force.
    Type: Application
    Filed: June 15, 2015
    Publication date: September 22, 2016
    Inventors: Wensyang Hsu, Cheng-Yeh Huang, Po-Yen Tsai, Po-Huai Shih, Shih-Kang Fan, Da-Jeng Yao, Cheng-Hsien Liu, Hong-Yuan Huang
  • Publication number: 20150291926
    Abstract: The present disclosure illustrates a platform system for in vitro cell co-cultivation with automatic trapping function. The platform system aims to develop a bio-chip applied in cell culture systems, and has several features. The first feature is that this co-cultivation platform can construct a micro environment suitable for culture of various cells. The second feature is dynamic perfusion. The microfluidic system is used to dynamically replace the culture medium, in order to maintain an appropriate environment for the growth of cells. The third feature is the automatic trapping. The cells to be cultured can be trapped in a suitable location according to the flow resistance, so that the damaged on the cell caused by manual operation can be minimized.
    Type: Application
    Filed: January 2, 2015
    Publication date: October 15, 2015
    Inventors: Ting-Ju YUEH, Chi-Fan CHEN, Kuo-Wei CHANG, Pei-Yu CHANG, Cheng-Hsien LIU, Hong-Yuan HUANG, Chin-Jung LI, Chang-Hung TIEN, Da-Jeng YAO, Shih-Kang FAN, Wen-Syang HSU
  • Publication number: 20100291535
    Abstract: The present invention discloses a method using a microfluidic chip to sort high motility sperm. In the present invention, sperm and a medium are respectively injected into a microchannel of a microfluidic chip via several inlets. Owing to the characteristic of microfluidics, the sperm and the medium form a sperm laminar flow and medium laminar flow in the microchannels; the sperm laminar flow and the medium laminar flow are parallel to each other. The higher motile sperm may pass through at least one laminar flow within a limited time, whereby different motility levels of sperm can be respectively collected from different outlets.
    Type: Application
    Filed: August 24, 2009
    Publication date: November 18, 2010
    Inventors: Da-Jeng Yao, Tsung-Lin Wu, Fan-Gang Tseng, Li-Chern Pan, Hong-Yuan Huang
  • Patent number: 7411790
    Abstract: A heat sink with a built-in heat pipe for semiconductor package is disclosed. At least a built-in heat pipe is disposed in a cavity of a metal vessel and sealed by a metal cover. The built-in heat pipe has an evaporating portion, a condensing portion, and a bent portion between the evaporating portion and the condensing portion. Thermal interface materials are applied in the cavity such that the evaporating portion is thermally coupled to the metal vessel, and the condensing portion is thermally coupled to the metal cover. The metal vessel has a flat surface opposing to the cavity for attaching to a heating surface of a semiconductor package.
    Type: Grant
    Filed: December 23, 2004
    Date of Patent: August 12, 2008
    Assignee: Advanced Semiconductor Engineering Inc.
    Inventor: Hong-Yuan Huang
  • Publication number: 20050201060
    Abstract: A heat sink with a built-in heat pipe for semiconductor package is disclosed. At least a built-in heat pipe is disposed in a cavity of a metal vessel and sealed by a metal cover. The built-in heat pipe has an evaporating portion, a condensing portion, and a bent portion between the evaporating portion and the condensing portion. Thermal interface materials are applied in the cavity such that the evaporating portion is thermally coupled to the metal vessel, and the condensing portion is thermally coupled to the metal cover. The metal vessel has a flat surface opposing to the cavity for attaching to a heating surface of a semiconductor package.
    Type: Application
    Filed: December 23, 2004
    Publication date: September 15, 2005
    Inventor: Hong-Yuan Huang
  • Publication number: 20050087864
    Abstract: A cavity-down semiconductor package mainly includes a heat spreader, a substrate, and a chip. The substrate has an outer surface, an inner surface opposing to the outer surface and an opening passing through the outer and inner surfaces. The inner surface is attached to the heat spreader to form a chip carrier with a chip cavity. The chip is located in the opening and electrically connected to the substrate. The substrate includes a metal cover layer over the inner surface. The metal cover layer can be bonded to the heat spreader to establish a thermal-coupling relationship to improve adhesion, heat conductibility and electrical performance between the substrate and the heat spreader.
    Type: Application
    Filed: December 8, 2004
    Publication date: April 28, 2005
    Inventors: Ching-Hsu Yang, Hong-Yuan Huang, Hsin-Fu Chuang, Chih-Huang Chang
  • Patent number: 5146828
    Abstract: A wrap film cutter including a bar shaped housing and a lid as the main body; a double tiered protrusion on the front edge of the lid; a stuck out shaft attached to the end of the protrusion; a trough on the front edge of the housing; an indented cutting set installed in the trough. The hollow portion of the bar shaped housing is for the installation of the wrap film. With this device the film wil be cut by the length needed through an easy and quick pushing motion onto the lid. This way can save the time and energy and meanwhile, keep film in tidy shape.
    Type: Grant
    Filed: March 29, 1991
    Date of Patent: September 15, 1992
    Inventors: Hong-Yuan Huang, Kuo-Feng Huang