Patents by Inventor Hong Z. Pesetski

Hong Z. Pesetski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High impedance microwave electronics
    Patent number: 9035704
    Abstract: High impedance, high frequency nanoscale device electronics configured to interface with low impedance loads include an impedance transforming stage constructed of multiple nanoscale devices, such as carbon nanotube field-effect transistors. In an embodiment of the present invention, an impedance transforming output stage of a multistage amplifier is configured to drive a 50 ohm transmission line with unity voltage gain using multiple carbon nanotube field-effect transistors in parallel. In a further embodiment, a receiver provided for an electronically steered receive array is a monolithic, lumped-element system formed from nanoscale devices and configured to interface with the external electrical systems via a single transmission line.
    Type: Grant
    Filed: October 1, 2010
    Date of Patent: May 19, 2015
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Aaron A. Pesetski, Hong Z. Pesetski, James E. Baumgardner, II, Dale E. Dawson
  • HIGH IMPEDANCE MICROWAVE ELECTRONICS
    Publication number: 20120081184
    Abstract: High impedance, high frequency nanoscale device electronics configured to interface with low impedance loads include an impedance transforming stage constructed of multiple nanoscale devices, such as carbon nanotube field-effect transistors. In an embodiment of the present invention, an impedance transforming output stage of a multistage amplifier is configured to drive a 50 ohm transmission line with unity voltage gain using multiple carbon nanotube field-effect transistors in parallel. In a further embodiment, a receiver provided for an electronically steered receive array is a monolithic, lumped-element system formed from nanoscale devices and configured to interface with the external electrical systems via a single transmission line.
    Type: Application
    Filed: October 1, 2010
    Publication date: April 5, 2012
    Applicant: Northrop Grumman Systems Corporation
    Inventors: Aaron A. PESETSKI, Hong Z. Pesetski, James E. Baumgardner, II, Dale E. Dawson