Patents by Inventor Hong-Zhi Sun
Hong-Zhi Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8848363Abstract: A heat dissipation system includes a computer case having a base plate and a back plate perpendicularly to the base plate, a motherboard on the base plate adjacent to the back plate, and a mass storage device beside the motherboard. The motherboard has a heat sink and a first fan on the heat sink. The base plate has a second fan beside the motherboard. The second fan is adjacent to the back plate. The mass storage device is away from the back plate. The first fan rotates in such a manner that airflow is drawn into the computer case, flows through the heat sink and is exhausted out of the computer case. The second fan rotates in such a manner that airflow is drawn into the computer case, flows through the mass storage device and is exhausted out of the computer case.Type: GrantFiled: June 3, 2011Date of Patent: September 30, 2014Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Chen Chen, Hong-Zhi Sun, Yang Li
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Patent number: 8737060Abstract: A computer system includes a computer case, a receiving tray, and a bracket. The computer case includes a front plate with a plurality of air intakes and a first side plate. The receiving tray includes a retaining wall. The bracket includes a first mounting plate and a second mounting plate. A plurality of first through hole is defined in the first mounting plate, and a plurality of second through hole is defined in the second mounting plate. The airflow guiding duct includes a first guiding plate and a second guiding plate. The first guiding plate is located between the front plate and the first mounting plate, the second guiding plate is located between the bracket and the first side plate; the plurality of air intakes, the airflow guiding duct, the plurality of first through hole second through hole together form a path for the air to flow.Type: GrantFiled: March 23, 2012Date of Patent: May 27, 2014Assignees: Hong Fu Jin Precision Industry (WuHan) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Hong-Zhi Sun, Tian Wang
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Patent number: 8456829Abstract: A computer includes an enclosure and a mainframe module enclosed in the enclosure. The mainframe module includes a base board, a motherboard, a partition panel perpendicularly attached on the base board, and a fan. The motherboard and the fan are attached on the base board at opposite sides of the partition panel. The fan is capable of blowing air to the motherboard to cool heat generating components of the motherboard.Type: GrantFiled: November 12, 2010Date of Patent: June 4, 2013Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Chen Chen, Hong-Zhi Sun, Yang Li
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Publication number: 20120327589Abstract: A computer includes a computer case and an airflow guiding duct. The computer case includes a rear plate with a number of air outlets. A bracket and a first fan are received in the case. The bracket receives a number of first heat generating components and includes a mounting plate with a number of through holes. A heat sink and a second fan are received in the case, and the second fan is attached to the heat sink for absorbing heat generated by a second heat generating component. The duct defines an hole and an opening. The through holes, the first fan, the hole, and the air outlets define a first airflow passage for cooling the first heat generating components, and the second fan, the opening, the hole, and the air outlets define a second airflow passage for cooling the second heat generating component.Type: ApplicationFiled: February 29, 2012Publication date: December 27, 2012Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.Inventors: HONG-ZHI SUN, TIAN WANG
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Publication number: 20120327586Abstract: A computer system includes a computer case, a receiving tray, and a bracket. The computer case includes a front plate with a plurality of air intakes and a first side plate. The receiving tray includes a retaining wall. The bracket includes a first mounting plate and a second mounting plate. A plurality of first through hole is defined in the first mounting plate, and a plurality of second through hole is defined in the second mounting plate. The airflow guiding duct includes a first guiding plate and a second guiding plate. The first guiding plate is located between the front plate and the first mounting plate, the second guiding plate is located between the bracket and the first side plate; the plurality of air intakes, the airflow guiding duct, the plurality of first through hole second through hole together form a path for the air to flow.Type: ApplicationFiled: March 23, 2012Publication date: December 27, 2012Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD.Inventors: Hong-Zhi SUN, Tian WANG
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Patent number: 8335082Abstract: A heat dissipating apparatus comprises a cooler, an air duct, and a cooling fan. a cooler secured to a circuit board of a host; the cooler is secured to a circuit board of a host; the air duct, covers the cooler, comprises a side tray that is substantially perpendicular to the circuit board; the cooling fan is secured to the cooler and located on a side of the cooler, and adjacent to the side tray; a gap is defined between the side tray and the cooler, an air guiding board is located in the gap and extends towards a VRM that is secured to the circuit board, and the air guiding board is configured to direct air flowing towards the VRM.Type: GrantFiled: April 28, 2011Date of Patent: December 18, 2012Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Hong-Zhi Sun, Chen Chen, Yang Li
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Patent number: 8300405Abstract: An airflow duct for guiding air toward two heat sink apparatuses in computer includes a duct body fixed in a computer case, a first air guide channel and a second air guide channel defined in the duct body. The duct body has an air inlet and an air outlet. The first air guide channel forms a first air outlet, which opens towards a first heat sink apparatus in the computer case. The second air guide channel forms a second air outlet, which opens towards a second heat sink apparatus in the computer case. The first and second air guide channels guide air from the air inlet to the first and second heat sink apparatuses, through the first and second air outlet openings to dissipate heat respectively from the first and second heat sink apparatuses. A first air guide channel height is greater than that of the second air guide channel.Type: GrantFiled: October 12, 2010Date of Patent: October 30, 2012Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Hong-Zhi Sun, Chen Chen, Yang Li
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Publication number: 20120147546Abstract: A heat dissipation system includes a computer case having a base plate and a back plate perpendicularly to the base plate, a motherboard on the base plate adjacent to the back plate, and a mass storage device beside the motherboard. The motherboard has a heat sink and a first fan on the heat sink. The base plate has a second fan beside the motherboard. The second fan is adjacent to the back plate. The mass storage device is away from the back plate. The first fan rotates in such a manner that airflow is drawn into the computer case, flows through the heat sink and is exhausted out of the computer case. The second fan rotates in such a manner that airflow is drawn into the computer case, flows through the mass storage device and is exhausted out of the computer case.Type: ApplicationFiled: June 3, 2011Publication date: June 14, 2012Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventors: CHEN CHEN, HONG-ZHI SUN, YANG LI
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Publication number: 20120120595Abstract: A computer system includes a computer case and a heat dissipating device. The heat dissipating device includes a heat sink, a fan and an airflow guiding duct. The fan is attached to the heat sink, and the airflow guiding duct covers on the fan. The airflow guiding duct includes a bottom panel, two side panels and a blocking panel. Each side panel includes a first panel and a second panel connected to the first panel. The blocking panel is slanted and connected to the bottom panel and the second panel of each side panel, the blocking panel is adapted to allow the air to pass through the airflow guiding duct, and an inward direction of the airflows generated by the fan is substantially perpendicular or oblique to an outward direction of the airflow.Type: ApplicationFiled: June 28, 2011Publication date: May 17, 2012Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO.,LTD.Inventors: HONG-ZHI SUN, CHEN CHEN, YANG LI
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Patent number: 8164900Abstract: An enclosure of an electronic device includes a bottom plate, a rear plate connected to the bottom plate, and a power supply unit. A heat generation apparatus is located on the bottom plate. An opening is defined in the rear plate. A power supply unit includes a wide first receiver portion and a narrow second receiver portion. A fan is mounted in the wide first receiver portion. The wide first receiver portion includes a rear wall located in the opening and a first front wall that is parallel to the rear wall. The first front wall and the rear wall define vent holes. The narrow second receiver portion includes a second side wall perpendicular to the first front wall. The second side wall and the heat generation apparatus form an air flow channel therebetween. The fan drives air flow through the air flow channel.Type: GrantFiled: November 3, 2010Date of Patent: April 24, 2012Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Hong-Zhi Sun, Chen Chen, Yang Li
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Publication number: 20120067553Abstract: A heat dissipating apparatus comprises a cooler, an air duct, and a cooling fan. a cooler secured to a circuit board of a host; the cooler is secured to a circuit board of a host; the air duct, covers the cooler, comprises a side tray that is substantially perpendicular to the circuit board; the cooling fan is secured to the cooler and located on a side of the cooler, and adjacent to the side tray; a gap is defined between the side tray and the cooler, an air guiding board is located in the gap and extends towards a VRM that is secured to the circuit board, and the air guiding board is configured to direct air flowing towards the VRM.Type: ApplicationFiled: April 28, 2011Publication date: March 22, 2012Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventors: HONG-ZHI SUN, CHEN CHEN, YANG LI
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Publication number: 20120002365Abstract: A computer includes an enclosure and a mainframe module enclosed in the enclosure. The mainframe module includes a base board, a motherboard, a partition panel perpendicularly attached on the base board, and a fan. The motherboard and the fan are attached on the base board at opposite sides of the partition panel. The fan is capable of blowing air to the motherboard to cool heat generating components of the motherboard.Type: ApplicationFiled: November 12, 2010Publication date: January 5, 2012Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY(ShenZhen) CO., LTD.Inventors: CHEN CHEN, HONG-ZHI SUN, YANG LI
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Publication number: 20110317363Abstract: An enclosure of an electronic device includes a bottom plate, a rear plate connected to the bottom plate, and a power supply unit. A heat generation apparatus is located on the bottom plate. An opening is defined in the rear plate. A power supply unit includes a wide first receiver portion and a narrow second receiver portion. A fan is mounted in the wide first receiver portion. The wide first receiver portion includes a rear wall located in the opening and a first front wall that is parallel to the rear wall. The first front wall and the rear wall define vent holes. The narrow second receiver portion includes a second side wall perpendicular to the first front wall. The second side wall and the heat generation apparatus form an air flow channel therebetween. The fan drives air flow through the air flow channel.Type: ApplicationFiled: November 3, 2010Publication date: December 29, 2011Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventors: HONG-ZHI SUN, CHEN CHEN, YANG LI
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Publication number: 20110304978Abstract: An enclosure of an electronic device includes a bottom wall and a sidewall. A motherboard is mounted on the bottom wall. The motherboard includes a heat generation apparatus and a heat sink attached thereon. The heat sink is in contact with the heat generation apparatus, and is configured to transmit heat from the heat generation apparatus to the heat sink. The sidewall defines a number of vents, which are in alignment with the heat sink. A fan is mounted between the sidewall and the heat sink with an air inlet side of the fan directed towards the heat sink and an air outlet side of the fan directed towards the plurality of vents.Type: ApplicationFiled: November 3, 2010Publication date: December 15, 2011Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventors: HONG-ZHI SUN, CHEN CHEN, YANG LI
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Patent number: 8072763Abstract: A printed circuit board assembly includes a heat sink, a back board, and a securing member. The heat sink is configured to be mounted on a heat generating element of a printed circuit board. The heat sink is configured to dissipate heat generated by the heat generating element. The heat sink and the back board are configured to be placed on opposite sides of the printed circuit board. The heat sink includes a first connecting heat pipe. The back board includes a second connecting heat pipe. The second connecting heat pipe contacts the first connecting heat pipe. The securing member thermally contacts the first connecting heat pipe and the second connecting heat pipe.Type: GrantFiled: March 22, 2010Date of Patent: December 6, 2011Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Yang Li, Hong-Zhi Sun, Shuang Fu
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Patent number: 8072753Abstract: A computer system includes a cover and a chassis. The chassis includes a bottom plate parallel to the cover, a first side plate, and a second side plate corresponding to the first side plate. A motherboard and a power supply are fixed on the bottom plate. The power supply is adjacent to the first side plate. The motherboard includes a first heat generating component. The power supply includes a first fan module. A second fan module is secured on the first heat generating component. A first airflow inlet is defined in the first fan module. A second airflow inlet is defined in the second fan module. The first and second airflow inlets are perpendicular to the bottom plate. A third airflow inlet is defined in the cover. The second airflow inlet is located between the first heat generating component and the second side plate.Type: GrantFiled: January 29, 2010Date of Patent: December 6, 2011Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventor: Hong-Zhi Sun
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Publication number: 20110292580Abstract: An airflow duct for guiding air toward two heat sink apparatuses in computer includes a duct body fixed in a computer case, a first air guide channel and a second air guide channel defined in the duct body. The duct body has an air inlet and an air outlet. The first air guide channel forms a first air outlet, which opens towards a first heat sink apparatus in the computer case. The second air guide channel forms a second air outlet, which opens towards a second heat sink apparatus in the computer case. The first and second air guide channels guide air from the air inlet to the first and second heat sink apparatuses, through the first and second air outlet openings to dissipate heat respectively from the first and second heat sink apparatuses. A first air guide channel height is greater than that of the second air guide channel.Type: ApplicationFiled: October 12, 2010Publication date: December 1, 2011Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventors: HONG-ZHI SUN, CHEN CHEN, YANG LI
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Publication number: 20110096502Abstract: A printed circuit board assembly includes a heat sink, a back board, and a securing member. The heat sink is configured to be mounted on a heat generating element of a printed circuit board. The heat sink is configured to dissipate heat generated by the heat generating element. The heat sink and the back board are configured to be placed on opposite sides of the printed circuit board. The heat sink includes a first connecting heat pipe. The back board includes a second connecting heat pipe. The second connecting heat pipe contacts the first connecting heat pipe. The securing member thermally contacts the first connecting heat pipe and the second connecting heat pipe.Type: ApplicationFiled: March 22, 2010Publication date: April 28, 2011Applicants: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD, HON HAI PRECISION INDUSTRY CO., LTD.Inventors: YANG LI, HONG-ZHI SUN, SHUANG FU
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Publication number: 20110090643Abstract: A computer system includes a cover and a chassis. The chassis includes a bottom plate parallel to the cover, a first side plate, and a second side plate corresponding to the first side plate. A motherboard and a power supply are fixed on the bottom plate. The power supply is adjacent to the first side plate. The motherboard includes a first heat generating component. The power supply includes a first fan module. A second fan module is secured on the first heat generating component. A first airflow inlet is defined in the first fan module. A second airflow inlet is defined in the second fan module. The first and second airflow inlets are perpendicular to the bottom plate. A third airflow inlet is defined in the cover. The second airflow inlet is located between the first heat generating component and the second side plate.Type: ApplicationFiled: January 29, 2010Publication date: April 21, 2011Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventor: HONG-ZHI SUN