Patents by Inventor Hong Zong
Hong Zong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11963969Abstract: Provided is a pharmaceutical composition including gastrodin and a use thereof for the prevention or the treatment of amyotrophic lateral sclerosis. The pharmaceutical composition is effective in reducing neuronal axon degeneration and neurofibromin accumulation, improving symptoms of amyotrophic lateral sclerosis and extending life of patients of amyotrophic lateral sclerosis.Type: GrantFiled: September 16, 2022Date of Patent: April 23, 2024Assignee: BUDDHIST TZU CHI MEDICAL FOUNDATIONInventors: Chia-Yu Chang, Shinn-Zong Lin, Hsiao-Chien Ting, Hui-I Yang, Horng-Jyh Harn, Hong-Lin Su, Ching-Ann Liu, Yu-Shuan Chen, Tzyy-Wen Chiou, Tsung-Jung Ho
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Patent number: 11953803Abstract: Embodiments of the present application provide a method for controlling voltages of a liquid crystal on silicon (LCoS) two-dimensional array which includes a plurality of pixel sets, and the plurality of pixel sets include a first pixel set and a second pixel set. The method includes: determining a plurality of bit sequences, where the plurality of bit sequences include a first bit sequence and a second bit sequence; controlling a voltage of the first pixel set by using the first bit sequence; and controlling a voltage of the second pixel set by using the second bit sequence, where the first pixel set and the second pixel set are in different phase cycles in a port direction of the LCoS two-dimensional array, the first pixel set and the second pixel set have a same phase, and duty ratios of the first bit sequence and the second bit sequence are the same.Type: GrantFiled: February 25, 2022Date of Patent: April 9, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Zeshan Chang, Lei Mao, Liangjia Zong, Tong Li, Hong Yang
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Patent number: 11920738Abstract: A LED bulb apparatus has a bulb shell, a head cap, a driver circuit and at least one light strip. The bulb shell has a light passing shell and a bottom portion. A head cap has a neck portion, a first electrode and a second electrode. The neck portion of the head cap is connected to the bottom portion of the bulb shell forming a container space. A fluorescent layer covers the multiple LED modules. The driving current is transmitted via at least one of the top end and the bottom end of the light strip to the LED modules. The substrate has a light transmittance less than 50%.Type: GrantFiled: June 4, 2020Date of Patent: March 5, 2024Assignee: XIAMEN ECO LIGHTING CO. LTD.Inventors: Liang Liang Cao, Cheng Zong Wu, Hong Kui Jiang, Yanzeng Gao
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Patent number: 11920157Abstract: Applications of butylidenephthalide (BP), comprising the use of BP in providing a kit for promoting differentiation of stem cells into brown adipose cells, and the use of BP in preparing a medicament, wherein the medicament is used for inhibiting the accumulation of white adipose cells, promoting the conversion of white adipose cells into brown adipose cells, inhibiting weight gain and/or reducing the content of triglycerides, glucose, and total cholesterol in blood.Type: GrantFiled: September 15, 2022Date of Patent: March 5, 2024Assignee: NATIONAL DONG HWA UNIVERSITYInventors: Tzyy-Wen Chiou, Shinn-Zong Lin, Horng-Jyh Harn, Hong-Lin Su, Shih-Ping Liu, Kang-Yun Lu, Jeanne Hsieh
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Patent number: 11404209Abstract: An electrical device package structure and manufacturing method thereof is disclosed. The manufacturing method comprises: providing an electrical device body having at least two electrodes, wherein an outer surface of the electrical device body is partially covered by the electrodes, and outer surfaces of the electrodes are covered by a plastic material; forming a first protective layer including phosphate salt at least on the exposed outer surface of the electrical device body; and forming a second protective layer including glass at least on an exposed outer surface of the first protective layer. The present invention can prevent the electrical device body and/or the electrodes from being damaged on their manufacturing process, and avoid a forming high impedance layer on an electrode.Type: GrantFiled: July 10, 2020Date of Patent: August 2, 2022Assignee: SFI Electronics Technology Inc.Inventors: Ching-Hohn Len, Hong Zong Xu, Zhi Xian Xu, Hsing Tsai Huang, Jie-An Zhu
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Publication number: 20210280373Abstract: An electrical device package structure and manufacturing method thereof is disclosed. The manufacturing method comprises: providing an electrical device body having at least two electrodes, wherein an outer surface of the electrical device body is partially covered by the electrodes, and outer surfaces of the electrodes are covered by a plastic material; forming a first protective layer including phosphate salt at least on the exposed outer surface of the electrical device body; and forming a second protective layer including glass at least on an exposed outer surface of the first protective layer. The present invention can prevent the electrical device body and/or the electrodes from being damaged on their manufacturing process, and avoid a forming high impedance layer on an electrode.Type: ApplicationFiled: July 10, 2020Publication date: September 9, 2021Inventors: Ching-Hohn Len, Hong Zong Xu, Zhi Xian Xu, Hsing Tsai Huang, Jie-An Zhu
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Publication number: 20210247638Abstract: A smart film apparatus includes a smart film and a control member. The smart film includes a polymer dispersed liquid crystal or a polymer network dispersed liquid crystal between two conductive layers. Plural electrodes are formed on a single surface of one of the conductive layers, and it is easier to process. Two conductive layers that respectively include multitudes electrically isolated conductive units. With floating or ground controlling signal, the control member controls the conductive units to perform a variety of displaying effects. Moreover, the surface opposed to the single surface with electrodes is evenly flat with paste and beneficial to apply to desired target surface.Type: ApplicationFiled: November 18, 2020Publication date: August 12, 2021Inventors: Hong Zong LIAO, Ta Jung CHENG, Cheng I CHEN, Li Hua CHU
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Publication number: 20200362339Abstract: Provided herein are processes for preparing an oligomer (e.g., a morpholino oligomer). The synthetic processes described herein may be advantageous to scaling up oligomer synthesis while maintaining overall yield and purity of a synthesized oligomer.Type: ApplicationFiled: September 25, 2018Publication date: November 19, 2020Inventors: Kyle A. Totaro, Mark D. Simon, Ming Zhou, Hong Zong, Gunnar J. Hanson, Bradley L. Pentelute
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Patent number: 9947444Abstract: A process for producing a multilayer varistor (MLV) if remained its size unchanged as prior arts is favorable to outstandingly increase overall current-carrying area and improve the performance of final produced MLV; and the MLV has laminated a lower cap, an inner-electrode stack formed from piling up several inner-electrode gaps (g), and an upper cap into a unity, and at least satisfies the condition that the lower cap and the upper cap has a thickness smaller than a thickness of the inner-electrode gap (g), but equal to or greater than 0.1 times of the thickness of the inner-electrode gap (g).Type: GrantFiled: September 20, 2017Date of Patent: April 17, 2018Assignee: SFI ELECTRONICS TECHNOLOGY INC.Inventors: Ching-Hohn Lien, Jie-An Zhu, Zhi-Xian Xu, Ting-Yi Fang, Hong-Zong Xu
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Patent number: 9931412Abstract: Provided herein is technology relating to theranostic agents and particularly, but not exclusively, to compositions comprising cell-specific theranostic agents and associated methods and systems for using the cell-specific theranostic agents to treat subjects.Type: GrantFiled: February 7, 2014Date of Patent: April 3, 2018Assignee: THE REGENTS OF THE UNIVERSITY OF MICHIGANInventors: Sascha N. Goonewardena, Bertram Pitt, Hong Zong
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Publication number: 20180090248Abstract: A process for producing a multilayer varistor (MLV) if remained its size unchanged as prior arts is favorable to outstandingly increase overall current-carrying area and improve the performance of final produced MLV; and the MLV has laminated a lower cap, an inner-electrode stack formed from piling up several inner-electrode gaps (g), and an upper cap into a unity, and at least satisfies the condition that the lower cap and the upper cap has a thickness smaller than a thickness of the inner-electrode gap (g), but equal to or greater than 0.1 times of the thickness of the inner-electrode gap (g).Type: ApplicationFiled: September 20, 2017Publication date: March 29, 2018Inventors: Ching-Hohn LIEN, Jie-An ZHU, Zhi-Xian XU, Ting-Yi FANG, Hong-Zong XU
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Patent number: 9691735Abstract: A miniaturized SMD diode package involves using a diode chip whose bottom surface has a positive electrode and a negative electrode, using a circuit board instead of a conventional lead frame during packaging, and using Charge-Coupled Device (CCD) image registration technology to perform chip bonding; the beneficial advantages brought from a process for producing the same including to simplify producing process and reduce manufacturing cost, to improve accuracy and precision of producing the miniaturized SMD diode package due to using a circuit board instead of conventionally used lead frame, and to ensure the produced miniaturized SMD diode package possesses excellent diode characteristics without distortion or defect.Type: GrantFiled: December 30, 2014Date of Patent: June 27, 2017Assignee: SFI ELECTRONICS TECHNOLOGY INC.Inventors: Ching-Hohn Lien, Xing-Xiang Huang, Hsing-Tsai Huang, Hong-Zong Xu, Yi-Wei Chen
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Patent number: 9691736Abstract: A process for producing a miniaturized SMD diode package involves using a diode chip whose bottom surface has a positive electrode and a negative electrode, using a circuit board instead of a conventional lead frame during packaging, and using Charge-Coupled Device (CCD) image registration technology to perform chip bonding; the beneficial advantages brought from the process for producing the same including to simplify producing process and reduce manufacturing cost, to improve accuracy and precision of producing the miniaturized SMD diode package due to using a circuit board instead of conventionally used lead frame, and to ensure the produced miniaturized SMD diode package possesses excellent diode characteristics without distortion or defect.Type: GrantFiled: October 13, 2015Date of Patent: June 27, 2017Assignee: SFI ELECTRONICS TECHNOLOGY INC.Inventors: Ching-Hohn Lien, Xing-Xiang Huang, Hsing-Tsai Huang, Hong-Zong Xu, Yi-Wei Chen
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Patent number: 9684103Abstract: A structured light generation device includes a first surface structure and a second surface structure, which are opposed to each other. The first surface structure includes a diffractive optical element. The second surface structure includes a lenticular lens structure. By the diffractive optical element, an incident dot beam is processed into plural dot beams with different sizes and different brightness values. By the lenticular lens structure, the each dot beam is expanded to a linear beam. After the single dot beam is processed by the structured light generation device, a structured light is generated. The structured light generation device can be applied to a projection system with a 3D gesture sensing control or detection device.Type: GrantFiled: May 7, 2015Date of Patent: June 20, 2017Assignee: AHEAD OPTOELECTRONICS, INC.Inventors: Hong-Zong Liao, Ying-Yueh Chang
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Publication number: 20170131560Abstract: A laser diode-DOE module includes a diffractive optical element and a laser light source. The diffractive optical element receives a non-collimated dot beam. The laser light source emits a non-collimated dot beam. Consequently, the spacing distance between the laser light source and the diffractive optical element can be designed as short as possible. Consequently, the total length of the laser diode-DOE module is reduced.Type: ApplicationFiled: May 7, 2015Publication date: May 11, 2017Inventors: HONG-ZONG LIAO, YING-YUEH CHANG, CHIH-MING YEN
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Patent number: 9443825Abstract: A surface-mount device (SMD) uses no conventional lead frame and contains a multi-function die module formed from either a single die or two or more dies electrically connected in series, in parallel, or in any combination of series and parallel, to provide such a SMD having one or more different functions including wave filtration, rectification, surge protection, sensing, current limiting, voltage regulation or prevention from voltage backflow, as compared to the prior art, the SMD disclosed is formed from fewer components, is simpler to manufacture and more effectively reduce layout wire length and noise.Type: GrantFiled: February 9, 2016Date of Patent: September 13, 2016Assignee: SFI ELECTRONICS TECHNOLOGY INC.Inventors: Ching-Hohn Lien, Xing-Xiang Huang, Hsing-Tsai Huang, Jie-An Zhu, Hong-Zong Xu, Yi-Wei Chen, Jung-Chun Chiang
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Publication number: 20160240510Abstract: A surface-mount device (SMD) uses no conventional lead frame and contains a multi-function die module formed from either a single die or two or more dies electrically connected in series, in parallel, or in any combination of series and parallel, to provide such a SMD having one or more different functions including wave filtration, rectification, surge protection, sensing, current limiting, voltage regulation or prevention from voltage backflow, as compared to the prior art, the SMD disclosed is formed from fewer components, is simpler to manufacture and more effectively reduce layout wire length and noise.Type: ApplicationFiled: February 9, 2016Publication date: August 18, 2016Inventors: Ching-Hohn LIEN, Xing-Xiang HUANG, Hsing-Tsai HUANG, Jie-An ZHU, Hong-Zong XU, Yi-Wei CHEN, Jung-Chun CHIANG
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Publication number: 20160035697Abstract: A process for producing a miniaturized SMD diode package involves using a diode chip whose bottom surface has a positive electrode and a negative electrode, using a circuit board instead of a conventional lead frame during packaging, and using Charge-Coupled Device (CCD) image registration technology to perform chip bonding; the beneficial advantages brought from the process for producing the same including to simplify producing process and reduce manufacturing cost, to improve accuracy and precision of producing the miniaturized SMD diode package due to using a circuit board instead of conventionally used lead frame, and to ensure the produced miniaturized SMD diode package possesses excellent diode characteristics without distortion or defect.Type: ApplicationFiled: October 13, 2015Publication date: February 4, 2016Inventors: Ching-Hohn LIEN, Xing- Xiang HUANG, Hsing-Tsai HUANG, Hong-Zong XU, Yi-Wei CHEN
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Publication number: 20150323155Abstract: A structured light generation device includes a first surface structure and a second surface structure, which are opposed to each other. The first surface structure includes a diffractive optical element. The second surface structure includes a lenticular lens structure. By the diffractive optical element, an incident dot beam is processed into plural dot beams with different sizes and different brightness values. By the lenticular lens structure, the each dot beam is expanded to a linear beam. After the single dot beam is processed by the structured light generation device, a structured light is generated. The structured light generation device can be applied to a projection system with a 3D gesture sensing control or detection device.Type: ApplicationFiled: May 7, 2015Publication date: November 12, 2015Inventors: HONG-ZONG LIAO, YING-YUEH CHANG
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Publication number: 20150309042Abstract: The present invention relates to fluorogenic dendrimer reporters. In particular, the present invention relates to dendrimer nanoparticles conjugated with ‘click-on’ fluorogenic reporters and related methods of use.Type: ApplicationFiled: January 6, 2014Publication date: October 29, 2015Inventors: James R. Baker, JR., Hong Zong, Sascha Goonewardena