Patents by Inventor Hong-Zong Xu
Hong-Zong Xu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11404209Abstract: An electrical device package structure and manufacturing method thereof is disclosed. The manufacturing method comprises: providing an electrical device body having at least two electrodes, wherein an outer surface of the electrical device body is partially covered by the electrodes, and outer surfaces of the electrodes are covered by a plastic material; forming a first protective layer including phosphate salt at least on the exposed outer surface of the electrical device body; and forming a second protective layer including glass at least on an exposed outer surface of the first protective layer. The present invention can prevent the electrical device body and/or the electrodes from being damaged on their manufacturing process, and avoid a forming high impedance layer on an electrode.Type: GrantFiled: July 10, 2020Date of Patent: August 2, 2022Assignee: SFI Electronics Technology Inc.Inventors: Ching-Hohn Len, Hong Zong Xu, Zhi Xian Xu, Hsing Tsai Huang, Jie-An Zhu
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Publication number: 20210280373Abstract: An electrical device package structure and manufacturing method thereof is disclosed. The manufacturing method comprises: providing an electrical device body having at least two electrodes, wherein an outer surface of the electrical device body is partially covered by the electrodes, and outer surfaces of the electrodes are covered by a plastic material; forming a first protective layer including phosphate salt at least on the exposed outer surface of the electrical device body; and forming a second protective layer including glass at least on an exposed outer surface of the first protective layer. The present invention can prevent the electrical device body and/or the electrodes from being damaged on their manufacturing process, and avoid a forming high impedance layer on an electrode.Type: ApplicationFiled: July 10, 2020Publication date: September 9, 2021Inventors: Ching-Hohn Len, Hong Zong Xu, Zhi Xian Xu, Hsing Tsai Huang, Jie-An Zhu
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Patent number: 9947444Abstract: A process for producing a multilayer varistor (MLV) if remained its size unchanged as prior arts is favorable to outstandingly increase overall current-carrying area and improve the performance of final produced MLV; and the MLV has laminated a lower cap, an inner-electrode stack formed from piling up several inner-electrode gaps (g), and an upper cap into a unity, and at least satisfies the condition that the lower cap and the upper cap has a thickness smaller than a thickness of the inner-electrode gap (g), but equal to or greater than 0.1 times of the thickness of the inner-electrode gap (g).Type: GrantFiled: September 20, 2017Date of Patent: April 17, 2018Assignee: SFI ELECTRONICS TECHNOLOGY INC.Inventors: Ching-Hohn Lien, Jie-An Zhu, Zhi-Xian Xu, Ting-Yi Fang, Hong-Zong Xu
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Publication number: 20180090248Abstract: A process for producing a multilayer varistor (MLV) if remained its size unchanged as prior arts is favorable to outstandingly increase overall current-carrying area and improve the performance of final produced MLV; and the MLV has laminated a lower cap, an inner-electrode stack formed from piling up several inner-electrode gaps (g), and an upper cap into a unity, and at least satisfies the condition that the lower cap and the upper cap has a thickness smaller than a thickness of the inner-electrode gap (g), but equal to or greater than 0.1 times of the thickness of the inner-electrode gap (g).Type: ApplicationFiled: September 20, 2017Publication date: March 29, 2018Inventors: Ching-Hohn LIEN, Jie-An ZHU, Zhi-Xian XU, Ting-Yi FANG, Hong-Zong XU
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Patent number: 9691735Abstract: A miniaturized SMD diode package involves using a diode chip whose bottom surface has a positive electrode and a negative electrode, using a circuit board instead of a conventional lead frame during packaging, and using Charge-Coupled Device (CCD) image registration technology to perform chip bonding; the beneficial advantages brought from a process for producing the same including to simplify producing process and reduce manufacturing cost, to improve accuracy and precision of producing the miniaturized SMD diode package due to using a circuit board instead of conventionally used lead frame, and to ensure the produced miniaturized SMD diode package possesses excellent diode characteristics without distortion or defect.Type: GrantFiled: December 30, 2014Date of Patent: June 27, 2017Assignee: SFI ELECTRONICS TECHNOLOGY INC.Inventors: Ching-Hohn Lien, Xing-Xiang Huang, Hsing-Tsai Huang, Hong-Zong Xu, Yi-Wei Chen
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Patent number: 9691736Abstract: A process for producing a miniaturized SMD diode package involves using a diode chip whose bottom surface has a positive electrode and a negative electrode, using a circuit board instead of a conventional lead frame during packaging, and using Charge-Coupled Device (CCD) image registration technology to perform chip bonding; the beneficial advantages brought from the process for producing the same including to simplify producing process and reduce manufacturing cost, to improve accuracy and precision of producing the miniaturized SMD diode package due to using a circuit board instead of conventionally used lead frame, and to ensure the produced miniaturized SMD diode package possesses excellent diode characteristics without distortion or defect.Type: GrantFiled: October 13, 2015Date of Patent: June 27, 2017Assignee: SFI ELECTRONICS TECHNOLOGY INC.Inventors: Ching-Hohn Lien, Xing-Xiang Huang, Hsing-Tsai Huang, Hong-Zong Xu, Yi-Wei Chen
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Patent number: 9443825Abstract: A surface-mount device (SMD) uses no conventional lead frame and contains a multi-function die module formed from either a single die or two or more dies electrically connected in series, in parallel, or in any combination of series and parallel, to provide such a SMD having one or more different functions including wave filtration, rectification, surge protection, sensing, current limiting, voltage regulation or prevention from voltage backflow, as compared to the prior art, the SMD disclosed is formed from fewer components, is simpler to manufacture and more effectively reduce layout wire length and noise.Type: GrantFiled: February 9, 2016Date of Patent: September 13, 2016Assignee: SFI ELECTRONICS TECHNOLOGY INC.Inventors: Ching-Hohn Lien, Xing-Xiang Huang, Hsing-Tsai Huang, Jie-An Zhu, Hong-Zong Xu, Yi-Wei Chen, Jung-Chun Chiang
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Publication number: 20160240510Abstract: A surface-mount device (SMD) uses no conventional lead frame and contains a multi-function die module formed from either a single die or two or more dies electrically connected in series, in parallel, or in any combination of series and parallel, to provide such a SMD having one or more different functions including wave filtration, rectification, surge protection, sensing, current limiting, voltage regulation or prevention from voltage backflow, as compared to the prior art, the SMD disclosed is formed from fewer components, is simpler to manufacture and more effectively reduce layout wire length and noise.Type: ApplicationFiled: February 9, 2016Publication date: August 18, 2016Inventors: Ching-Hohn LIEN, Xing-Xiang HUANG, Hsing-Tsai HUANG, Jie-An ZHU, Hong-Zong XU, Yi-Wei CHEN, Jung-Chun CHIANG
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Publication number: 20160035697Abstract: A process for producing a miniaturized SMD diode package involves using a diode chip whose bottom surface has a positive electrode and a negative electrode, using a circuit board instead of a conventional lead frame during packaging, and using Charge-Coupled Device (CCD) image registration technology to perform chip bonding; the beneficial advantages brought from the process for producing the same including to simplify producing process and reduce manufacturing cost, to improve accuracy and precision of producing the miniaturized SMD diode package due to using a circuit board instead of conventionally used lead frame, and to ensure the produced miniaturized SMD diode package possesses excellent diode characteristics without distortion or defect.Type: ApplicationFiled: October 13, 2015Publication date: February 4, 2016Inventors: Ching-Hohn LIEN, Xing- Xiang HUANG, Hsing-Tsai HUANG, Hong-Zong XU, Yi-Wei CHEN
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Patent number: 9165872Abstract: A novel chip scale diode package due to no containing outer lead pins is miniaturized like a chip scale appearance to promote dimensional accuracy so that the diode package is so suitably produced by automation equipment to get automated mass production; the produced diode package may contain one or more diode chips to increase versatile functions more useful in applications, such as produced as a SMT diode package or an array-type SMT diode, and the present diode package due to made of no lead-containing material conforms to requirements for environmental protection.Type: GrantFiled: October 24, 2014Date of Patent: October 20, 2015Assignee: SFI ELECTRONICS TECHNOLOGY INC.Inventors: Ching-Hohn Lien, Xing-Xiang Huang, Hsing-Tsai Huang, Hong-Zong Xu
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Publication number: 20150200147Abstract: A miniaturized SMD diode package involves using a diode chip whose bottom surface has a positive electrode and a negative electrode, using a circuit board instead of a conventional lead frame during packaging, and using Charge-Coupled Device (CCD) image registration technology to perform chip bonding; the beneficial advantages brought from a process for producing the same including to simplify producing process and reduce manufacturing cost, to improve accuracy and precision of producing the miniaturized SMD diode package due to using a circuit board instead of conventionally used lead frame, and to ensure the produced miniaturized SMD diode package possesses excellent diode characteristics without distortion or defect.Type: ApplicationFiled: December 30, 2014Publication date: July 16, 2015Inventors: Ching-Hohn LIEN, Xing- Xiang HUANG, Hsing-Tsai HUANG, Hong-Zong XU, Yi-Wei CHEN
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Publication number: 20150123254Abstract: A novel chip scale diode package due to no containing outer lead pins is miniaturized like a chip scale appearance to promote dimensional accuracy so that the diode package is so suitably produced by automation equipment to get automated mass production; the produced diode package may contain one or more diode chips to increase versatile functions more useful in applications, such as produced as a SMT diode package or an array-type SMT diode, and the present diode package due to made of no lead-containing material conforms to requirements for environmental protection.Type: ApplicationFiled: October 24, 2014Publication date: May 7, 2015Inventors: Ching-Hohn LIEN, Xing- Xiang HUANG, Hsing-Tsai HUANG, Hong-Zong XU
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Patent number: 8363382Abstract: A multilayer ceramic device comprises a laminated ceramic body having opposite end surfaces, a pair of conductive electrodes each respectively attached to one end surface of the laminated ceramic body and a plurality of alternately staggered internal electrodes within the laminated ceramic body configured in an alternating manner and each electrically connected to the corresponding conductive electrodes respectively; each conductive electrodes of the multilayer ceramic device is further covered with a solder paste layer so that the multilayer ceramic device is thus made without any plating step and no need of treating waste liquid nickel or waste liquid tin as well as no problem of environmental pollution caused by plating solution, thereby lowering manufacturing costs and reducing processing time.Type: GrantFiled: February 10, 2011Date of Patent: January 29, 2013Assignee: SFI Electronics Technology Inc.Inventors: Ching-Hohn Lien, Hong-Zong Xu
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Publication number: 20130011963Abstract: A process for producing zinc oxide varistors possessed a property of breakdown voltage (V1mA) ranging from 230 to 1,730 V/mm is to perform the doping of zinc oxide and the sintering of zinc oxide grains with a high-impedance sintered powder through two independent procedures, so that the doped zinc oxide and the high-impedance sintered powder are well mixed in a predetermined ratio and then used to make the zinc oxide varistors through conventional technology by low-temperature sintering (lower than 900° C.); the resultant zinc oxide varistors may use pure silver as inner electrode and particularly possess breakdown voltage ranging from 230 to 1,730 V/mm.Type: ApplicationFiled: September 13, 2012Publication date: January 10, 2013Applicant: SFI ELECTRONICS TECHNOLOGY INC.Inventors: Ching-Hohn LIEN, Jie-An ZHU, Zhi-Xian XU, Hong-Zong XU, Ting-Yi FANG, Xing-Xiang HUANG
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Publication number: 20120208040Abstract: A multilayer ceramic device comprises a laminated ceramic body having opposite end surfaces, a pair of conductive electrodes each respectively attached to one end surface of the laminated ceramic body and a plurality of alternately staggered internal electrodes within the laminated ceramic body configured in an alternating manner and each electrically connected to the corresponding conductive electrodes respectively; each conductive electrodes of the multilayer ceramic device is further covered with a solder paste layer so that the multilayer ceramic device is thus made without any plating step and no need of treating waste liquid nickel or waste liquid tin as well as no problem of environmental pollution caused by plating solution, thereby lowering manufacturing costs and reducing processing time.Type: ApplicationFiled: February 10, 2011Publication date: August 16, 2012Applicant: SFI Electronics Technology Inc.Inventors: Ching-Hohn LIEN, Hong-Zong Xu
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Publication number: 20100117271Abstract: A process for producing zinc oxide varistors is to perform the doping of zinc oxide and the sintering of zinc oxide grains with a high-impedance sintering material through two independent procedures, so that the doped zinc oxide and the high-impedance sintering material are well mixed in a predetermined ratio and then used to make the zinc oxide varistors through conventional technology by low-temperature sintering (lower than 900° C.); the resultant zinc oxide varistors may use pure silver as inner electrode and particularly possess one or more of varistor properties, thermistor properties, capacitor properties, inductor properties, piezoelectricity and magnetism.Type: ApplicationFiled: July 9, 2009Publication date: May 13, 2010Applicant: SFI Electronics Technology Inc.Inventors: Ching-Hohn Lien, Jie-An Zhu, Cheng-Tsung Kuo, Jiu-Nan Lin, Zhi-Xian Xu, Hong-Zong Xu, Ting-Yi Fang, Xing-Xiang Huang