Abstract: The wireless headset includes a main control module. The main control module includes a rigid-flexible circuit board, a first substrate, a first support member, and a plurality of chips. The rigid-flexible circuit board includes a rigid board portion and a first flexible board portion and a second flexible board portion that are connected to the rigid board portion. The rigid board portion is located in the earbud portion. The first flexible board portion is located in the earbud portion and has one end connected to the rigid board portion. One end of the second flexible board portion is connected to the rigid board portion and the other end thereof extends to the ear handle portion. A plurality of layers of components are stacked on the rigid board portion of the wireless headset, so that component integration degree is high.

Abstract: The present invention belongs to the technical field of packaging boxes, and in particular relates to a packaging box with a film sticking function, including a bottom box and an upper cover, where a side wall of the upper cover is provided with a pull-out opening, an inner wall of the upper cover is connected with a protective film set, a pull-out bar of the protective film set passes through the pull-out opening and extends out of the pull-out opening, and the protective film set and the upper cover jointly cover the bottom box to form a positioning cavity. The packaging box provided by the present invention integrates functions of film sticking and glass protective film packaging, facilitating use by users.

Abstract: The wireless headset includes a main control module. The main control module includes a rigid-flexible circuit board, a first substrate, a first support member, and a plurality of chips. The rigid-flexible circuit board includes a rigid board portion and a first flexible board portion and a second flexible board portion that are connected to the rigid board portion. The rigid board portion is located in the earbud portion. The first flexible board portion is located in the earbud portion and has one end connected to the rigid board portion. One end of the second flexible board portion is connected to the rigid board portion and the other end thereof extends to the ear handle portion. A plurality of layers of components are stacked on the rigid board portion of the wireless headset, so that component integration degree is high.