Patents by Inventor Hongbing Shi

Hongbing Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12170868
    Abstract: The wireless headset includes a main control module. The main control module includes a rigid-flexible circuit board, a first substrate, a first support member, and a plurality of chips. The rigid-flexible circuit board includes a rigid board portion and a first flexible board portion and a second flexible board portion that are connected to the rigid board portion. The rigid board portion is located in the earbud portion. The first flexible board portion is located in the earbud portion and has one end connected to the rigid board portion. One end of the second flexible board portion is connected to the rigid board portion and the other end thereof extends to the ear handle portion. A plurality of layers of components are stacked on the rigid board portion of the wireless headset, so that component integration degree is high.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: December 17, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Deliang Li, Shaojian Chen, Xueping Guo, Dongyi Zhu, Fuqiang Ma, Hongbing Shi, Runqing Ye
  • Publication number: 20240164498
    Abstract: The present invention belongs to the technical field of packaging boxes, and in particular relates to a packaging box with a film sticking function, including a bottom box and an upper cover, where a side wall of the upper cover is provided with a pull-out opening, an inner wall of the upper cover is connected with a protective film set, a pull-out bar of the protective film set passes through the pull-out opening and extends out of the pull-out opening, and the protective film set and the upper cover jointly cover the bottom box to form a positioning cavity. The packaging box provided by the present invention integrates functions of film sticking and glass protective film packaging, facilitating use by users.
    Type: Application
    Filed: February 2, 2024
    Publication date: May 23, 2024
    Inventor: Hongbing Shi
  • Publication number: 20220386015
    Abstract: The wireless headset includes a main control module. The main control module includes a rigid-flexible circuit board, a first substrate, a first support member, and a plurality of chips. The rigid-flexible circuit board includes a rigid board portion and a first flexible board portion and a second flexible board portion that are connected to the rigid board portion. The rigid board portion is located in the earbud portion. The first flexible board portion is located in the earbud portion and has one end connected to the rigid board portion. One end of the second flexible board portion is connected to the rigid board portion and the other end thereof extends to the ear handle portion. A plurality of layers of components are stacked on the rigid board portion of the wireless headset, so that component integration degree is high.
    Type: Application
    Filed: October 14, 2020
    Publication date: December 1, 2022
    Inventors: Deliang Li, Shaojian Chen, Xueping Guo, Dongyi Zhu, Fuqiang Ma, Hongbing Shi, Runqing Ye
  • Patent number: D1028703
    Type: Grant
    Filed: November 8, 2023
    Date of Patent: May 28, 2024
    Inventor: Hongbing Shi
  • Patent number: D1028772
    Type: Grant
    Filed: November 28, 2023
    Date of Patent: May 28, 2024
    Inventors: Quan Ren, Hongbing Shi, Qinghui Ge