Abstract: The present invention discloses a method of preparing an alkali activation material by using red mud-based wet grinding and carbon sequestration and an application thereof. The preparation method includes: (1) adding water, red mud, a crystalline control agent, and a grinding aid into a wet grinding carbon sequestration apparatus to perform wet grinding, and simultaneously introducing CO2 until a slurry pH reaches 7 to 7.5; and removing wet grinding balls by a sieve to obtain a slurry A; (2) adding carbide slag, water and a water reducer to a wet planetary ball grinder tank for wet grinding, and removing wet grinding balls by a sieve to obtain a slurry B; (3) taking 50 to 80 parts of the slurry A and 20 to 50 parts of the slurry B and mixing them to obtain an alkali activation material.

Abstract: The present invention provides a method of preparing a recycled cementitious material by a phosphogypsum-assisted carbon sequestration pretreatment process. The method includes: (1) placing 100 mass parts of phosphogypsum, 1 to 2 mass parts of grinding aid, 10 to 20 mass parts of sodium-containing alkali component, 150 to 300 mass parts of zirconia balls, and 150 to 300 mass parts of water into a wet grinding tank for wet grinding. After 10 min to 30 min of wet grinding, introducing CO2 at a flow rate of 1.5 to 2.2 mass parts/min to keep a temperature of a wet grinding slurry below 40° C. When the wet grinding slurry reaches pH=10, ending the wet grinding and sieving out a wet grinding slurry; (2) mixing the wet grinding slurry with 700 to 1000 mass parts of slag and 100 to 350 mass parts of water to obtain a recycled cementitious material.

Abstract: A flip LED chip module and a method for manufacturing LED chip module are provided. In the manufactured flip LED chip module, the second glue layer for reducing light energy is formed on the front surface of each of the flip LED chips. Therefore, the difference between the light intensity of the light along the normal direction of the flip LED chip and the light intensity of the light at the four sides of the flip LED chip can be reduced, thus improving the uniformity of the color of the light. Hence, the color of the light of the LED device manufactured by the LED chip module can be more uniform, thus improving the quality of the LED device and the user satisfaction.