Patents by Inventor Hongchao Yang
Hongchao Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11926920Abstract: Embodiments of the present invention provide an electroplating apparatus for electroplating on a surface of a wafer, which comprising a plurality of electrodes, for forming electric fields on the surface of the wafer, an independent electric field is formed in a designated area, when a notch of the wafer is positioned within the designated area, a total amount of power received by the notch is reduced. Embodiments of the present invention also provide an electroplating method for electroplating on a surface of a wafer, the method controlling the plurality of electrodes to form electric fields on the surface of the wafer, an independent electric field is formed in a designated area, when a notch of the wafer is positioned within the designated area, a total amount of power received by the notch is reduced. The present invention is more accurate and reliable, the electroplating efficiency is also increased.Type: GrantFiled: April 29, 2019Date of Patent: March 12, 2024Assignee: ACM RESEARCH (SHANGHAI), INC.Inventors: Zhaowei Jia, Jian Wang, Hui Wang, Hongchao Yang
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Publication number: 20240044038Abstract: Disclosed in one embodiment of the present invention is an electroplating apparatus and an electroplating method. The electroplating apparatus comprises a plurality of paddles arranged in parallel. The paddles move in a direction parallel to a substrate, and are used to stir electroplating solution. Within one cycle, the paddles perform reciprocating motion at a set stroke, and the turning points of the reciprocating motion are related to the width of the paddles and the narrowest width of a gap between adjacent paddles. According to the present invention, by designing the size and movement mode of the paddles, the accumulated time in which each corresponding point on the substrate is blocked by the paddles is equal, so that the received quantity of electricity is equal, and thus the consistency of an electroplating height is further improved.Type: ApplicationFiled: December 13, 2021Publication date: February 8, 2024Applicant: ACM RESEARCH (SHANGHAI), INC.Inventors: Hui Wang, Jian Wang, Zhaowei Jia, Hongchao Yang, Jun Cai, Chenhua Lu, Jiaqi Li, Meng Wu
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Publication number: 20240035189Abstract: A cup-shaped chuck of a substrate holding device includes an inner pressing ring, a middle frame, a sealing element, an outer pressing ring and a contact ring. The inner pressing ring is locked on the inner peripheral surface of the middle frame. The sealing element has an outer end part, a bottom part and an inner end part. The outer end part of the sealing element wraps the outer peripheral surface of at least part of the middle frame. The bottom part of the sealing element wraps the bottom of the middle frame, and is exposed to the outside of the cup-shaped chuck. The inner end part of the sealing element wraps the inner peripheral surface of at least part of the middle frame and is pressed between the inner pressing ring and the middle frame by the inner pressing ring.Type: ApplicationFiled: November 19, 2021Publication date: February 1, 2024Applicant: ACM RESEARCH (SHANGHAI), INC.Inventors: Hui Wang, Jian Wang, Zhaowei Jia, Yinuo Jin, Hongchao Yang
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Publication number: 20240026561Abstract: The present invention discloses a plating apparatus. The plating apparatus comprises a multiple electrodes. The multiple electrodes include a main electrode and at least two second electrodes. The main electrode and the at least two second electrodes respectively generate an electric field in a corresponding area on the surface of a wafer. The main electrode and the at least two second electrodes respectively have a control interface. By selecting the combination of the control relationship between each second electrode and the main electrode, the wafers with different sizes or different notch shapes are plated, and the control relationship is independent control or joint control. The plating apparatus of the present invention can plate wafers with different sizes or different notch shapes without replacing the whole plating chamber.Type: ApplicationFiled: October 29, 2021Publication date: January 25, 2024Applicant: ACM RESEARCH (SHANGHAI), INC.Inventors: Zhaowei Jia, Jian Wang, Hui Wang, Hongchao Yang
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Publication number: 20240018681Abstract: The present invention discloses a plating apparatus and plating methods for plating metal layers on a substrate.Type: ApplicationFiled: July 31, 2023Publication date: January 18, 2024Applicant: ACM RESEARCH (SHANGHAI), INC.Inventors: Yinuo Jin, Hongchao Yang, Jian Wang, Hui Wang
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Patent number: 11859303Abstract: A plating apparatus for depositing metal on a substrate, comprising a membrane frame (14), a catholyte inlet pipe (30) and a center cap (40). The membrane frame (14) has a center passage (144) which passes through the center of the membrane frame (14). The catholyte inlet pipe (30) is connected to the center passage (144) of the membrane frame (14). The center cap (40) is fixed at the center of the membrane frame (14) and covers over the center passage (144) of the membrane frame (14). The top of the center cap (40) has a plurality of first holes (42). The catholyte inlet pipe (30) supplies catholyte to the center cap (40) through the center passage (144) of the membrane frame (14), and the catholyte is supplied to a center area of the substrate through the first holes (42) of the center cap (40).Type: GrantFiled: August 30, 2017Date of Patent: January 2, 2024Assignee: ACM RESEARCH (SHANGHAI), INC.Inventors: Zhaowei Jia, Hongchao Yang, Chenhua Lu, Jian Wang, Hui Wang
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Patent number: 11854842Abstract: The present invention provides a substrate heat treatment apparatus for heat treating a substrate, including a bake plate, support components, a baffle plate, and a driving device. The bake plate defines at least one gas passage. The support components support the substrate. The baffle plate is fixed on a top surface of the bake plate. The baffle plate surrounds the substrate and a gap is formed between an inner circumferential wall of the baffle plate and the substrate. A driving device drives the plurality of support components to move up or down. When heat treating the substrate, a hot gas is supplied to the space between the substrate and the top surface of the bake plate through the gas passage of the bake plate, and the hot gas flows out through the gap formed between the inner circumferential wall of the baffle plate and the substrate.Type: GrantFiled: March 18, 2016Date of Patent: December 26, 2023Assignee: ACM RESEARCH (SHANGHAI), INC.Inventors: Hui Wang, Hongchao Yang, Jun Wu, Wenjun Wang, Fuping Chen, Zhiyou Fang
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Publication number: 20230381722Abstract: A hydrodynamic cavitation generating device and a method, including: a wheel disc, being provided with a plurality of flow passages, an orifice plate is provided inside the flow passages, and a throat orifice is provided on the orifice plate; a driving mechanism, being connected to the wheel disc, and configured to drive a rotation of the wheel disc; and a water-inlet pipe, being arranged fixedly, fitting with a first side end face of the wheel disc, and may inject water into the flow passage when being aligned with the flow passage; the cavitation effect obtained by using the hydraulic cavitation generating device is better.Type: ApplicationFiled: January 21, 2022Publication date: November 30, 2023Applicant: CHINA UNIVERSITY OF PETROLEUM (EAST CHINA)Inventors: Cuiwei LIU, Xuejie LI, Qingshan FENG, Yuxing LI, Hui HAN, Qihui HU, Yihan LIAO, Yuanbo YIN, Kang XIAO, Hongchao YANG, Rui DING
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Publication number: 20230374691Abstract: The present invention discloses plating apparatuses and plating methods for metal deposition on a substrate with pattern structures. In an embodiment, a plating apparatus comprises a plating bath configured to accommodate electrolyte, a substrate holding module configured to hold a substrate, and at least one driving device configured to drive the substrate holding module together with the substrate to horizontally vibrate and/or vertically vibrate during the substrate being immersed into the electrolyte to be plated. The present invention can enhance mass transfer during the substrate being plated by vibrating the substrate holding module so as to raise plating rate and uniformly plating on the pattern structures.Type: ApplicationFiled: March 23, 2020Publication date: November 23, 2023Applicant: ACM Research (Shanghai) Inc.Inventors: Hui Wang, Jian Wang, Hongchao Yang, Zhaowei Jia
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Patent number: 11781235Abstract: A plating apparatus and plating methods for plating metal layers on a substrate.Type: GrantFiled: December 28, 2018Date of Patent: October 10, 2023Assignee: ACM RESEARCH (SHANGHAI), INC.Inventors: Yinuo Jin, Hongchao Yang, Jian Wang, Hui Wang
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Publication number: 20230247846Abstract: The preparation method for fluorescent quantum dots includes: carrying out solvothermal reaction on a first evenly mixed reaction system containing a silver source, a negative ion source and a weakly polar solvent to prepare a silver-based quantum dots precursor; and carrying out ion exchange reaction on a second evenly mixed reaction system containing the silver-based quantum dots precursor, a negative ion source and/or a metal positive ion source to obtain alloyed fluorescent quantum dots with a fluorescence emission peak wavelength of 500-1700 nm and an absolute quantum efficiency of more than 85%. The silver-based quantum dots are prepared through a simple high-temperature solvothermal method and then the alloyed quantum dots are obtained by the ion exchange method, and therefore the synthesis process is simple and controllable. The obtained fluorescent quantum dots can be prepared on large scale, and have adjustable fluorescence emission from visible to near-infrared region and excellent photostability.Type: ApplicationFiled: December 21, 2021Publication date: August 3, 2023Applicant: SUZHOU INSTITUTE OF NANO-TECH AND NANO-BIONICS (SINANO), CHINESE ACADEMY OF SCIENCESInventors: Qiangbin WANG, Hongchao YANG
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Patent number: 11469134Abstract: A plating chuck for holding a substrate during plating processes, wherein the substrate has a notch area (3031) and a patterned region (3032) adjacent to the notch area (3031). The plating chuck comprises a cover plate (3033) configured to cover the notch area (3031) of the substrate to shield the electric field at the notch area (3031) when the substrate is being plated.Type: GrantFiled: September 7, 2017Date of Patent: October 11, 2022Assignee: ACM RESEARCH (SHANGHAI) INC.Inventors: Hui Wang, Jian Wang, Zhaowei Jia, Hongchao Yang
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Publication number: 20220081796Abstract: A plating apparatus and plating methods for plating metal layers on a substrate.Type: ApplicationFiled: December 28, 2018Publication date: March 17, 2022Applicant: ACM Research (Shanghai) Inc.Inventors: Yinuo Jin, Hongchao Yang, Jian Wang, Hui Wang
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Publication number: 20210301416Abstract: Embodiments of the present invention provide an electroplating apparatus for electroplating on a surface of a wafer, the electroplating apparatus comprising a plurality of electrodes, the plurality of electrodes forming electric fields on the surface of the wafer, wherein an independent electric field is formed in a designated area, the intensity of the independent electric field is independently controlled, when a notch of the wafer is positioned within the designated area, a total amount of power received by the notch within the designated area is reduced.Type: ApplicationFiled: April 29, 2019Publication date: September 30, 2021Applicant: ACM Research (Shanghai) Inc.Inventors: Zhaowei JIA, Jian WANG, Hui WANG, Hongchao YANG
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Patent number: 11008669Abstract: An apparatus for holding a substrate (113) has a chuck cup (101), a seal shell (111), a chuck plate (102) and a vertical driving device (103). The seal shell (111) has a bottom wall (1111), an outer wall (1112) and an inner wall (1114). The inner wall (1114) forms a lip seal portion (1115). The bottom wall (1111) and the outer wall (1112) of the seal shell (111) respectively wrap the bottom surface and the outer surface of the base portion (1011) of the chuck cup (101). The lip seal portion (1115) wraps the supporting portion (1014) of the chuck cup (101) for sealing the edge of the front side of the substrate (113). The apparatus protects the edge of the front side of the substrate, the back side of the substrate and the chuck cup from contacting with the electrolyte solution.Type: GrantFiled: December 4, 2015Date of Patent: May 18, 2021Assignee: ACM Research (Shanghai) Inc.Inventors: Hui Wang, Zhaowei Jia, Hongchao Yang, Jun Wu, Jian Wang
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Publication number: 20210072645Abstract: A coater with automatic cleaning function and a coater automatic cleaning method. The coater (100,200,300,400,500,600,700,800) includes a coater chamber (101,201,301,401,501,601,701,801) capable of being filled up with cleaning solution, a substrate chuck (102,202,302,402,502,602,702,802) holding and positioning a substrate (103,203,303,403,503,603,703,803), and at least one shroud (108,208,308,408,508) capable of moving up for preventing photoresist from splashing out of the coater chamber (101,201,301,401,501,601,701,801), or moving down and immersing into the cleaning solution for cleaning.Type: ApplicationFiled: October 26, 2020Publication date: March 11, 2021Applicant: ACM Research (Shanghai) Inc.Inventors: Hui Wang, Fuping Chen, Wenjun Wang, Hongchao Yang, Voha Nuch, Fufa Chen, Jian Wang, Xiaoyan Zhang, Shu Yang
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Publication number: 20210066106Abstract: A plating chuck for holding a substrate during plating processes, wherein the substrate has a notch area (3031) and a patterned region (3032) adjacent to the notch area (3031). The plating chuck comprises a cover plate (3033) configured to cover the notch area (3031) of the substrate to shield the electric field at the notch area (3031) when the substrate is being plated.Type: ApplicationFiled: September 7, 2017Publication date: March 4, 2021Applicant: ACM Research (Shanghai) Inc.Inventors: Hui Wang, Jian Wang, Zhaowei Jia, Hongchao Yang
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Publication number: 20200354851Abstract: A plating apparatus for depositing metal on a substrate, comprising a membrane frame (14), a catholyte inlet pipe (30) and a center cap (40). The membrane frame (14) has a center passage (144) which passes through the center of the membrane frame (14). The catholyte inlet pipe (30) is connected to the center passage (144) of the membrane frame (14). The center cap (40) is fixed at the center of the membrane frame (14) and covers over the center passage (144) of the membrane frame (14). The top of the center cap (40) has a plurality of first holes (42). The catholyte inlet pipe (30) supplies catholyte to the center cap (40) through the center passage (144) of the membrane frame (14), and the catholyte is supplied to a center area of the substrate through the first holes (42) of the center cap (40).Type: ApplicationFiled: August 30, 2017Publication date: November 12, 2020Applicant: ACM Research (Shanghai) Inc.Inventors: Zhaowei Jia, Hongchao Yang, Chenhua Lu, Jian Wang, Hui Wang
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Patent number: 10816901Abstract: A coater with automatic cleaning function and a coater automatic cleaning method. The coater (100,200,300,400,500,600,700,800) includes a coater chamber (101,201,301,401,501,601,701,801) capable of being filled up with cleaning solution, a substrate chuck (102,202,302,402,502,602,702,802) holding and positioning a substrate (103,203,303,403,503,603,703,803), and at least one shroud (108,208,308,408,508) capable of moving up for preventing photoresist from splashing out of the coater chamber (101,201,301,401,501,601,701,801), or moving down and immersing into the cleaning solution for cleaning.Type: GrantFiled: September 16, 2014Date of Patent: October 27, 2020Assignee: ACM Research (Shanghai) Inc.Inventors: Hui Wang, Fuping Chen, Wenjun Wang, Hongchao Yang, Voha Nuch, Fufa Chen, Jian Wang, Xiaoyan Zhang, Shu Yang
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Publication number: 20200294825Abstract: A substrate heat treatment apparatus for heat treating a substrate, comprising a bake plate, a plurality of support components, a baffle plate, and a driving device. The bake plate defines at least one gas passage. The plurality of support components support the substrate. The baffle plate is fixed on a top surface of the bake plate. The baffle plate surrounds the substrate and a gap is formed between an inner circumferential wall of the baffle plate and the substrate. A driving device drives the plurality of support components to move up or down. When heat treating the substrate, a hot gas is supplied to the space between the substrate and the top surface of the bake plate through the gas passage of the bake plate, and the hot gas flows out through the gap formed between the inner circumferential wall of the baffle plate and the substrate.Type: ApplicationFiled: March 18, 2016Publication date: September 17, 2020Applicant: ACM Research (Shanghai) Inc.Inventors: Hui Wang, Hongchao Yang, Jun Wu, Wenjun Wang, Fuping Chen, Zhiyou Fang