Patents by Inventor Hongchao Yang

Hongchao Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210301416
    Abstract: Embodiments of the present invention provide an electroplating apparatus for electroplating on a surface of a wafer, the electroplating apparatus comprising a plurality of electrodes, the plurality of electrodes forming electric fields on the surface of the wafer, wherein an independent electric field is formed in a designated area, the intensity of the independent electric field is independently controlled, when a notch of the wafer is positioned within the designated area, a total amount of power received by the notch within the designated area is reduced.
    Type: Application
    Filed: April 29, 2019
    Publication date: September 30, 2021
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Zhaowei JIA, Jian WANG, Hui WANG, Hongchao YANG
  • Publication number: 20210277277
    Abstract: The present invention relates to a coating composition, a coating method and use of the composition, and a product coated with the coating composition. The coating composition comprises: (a) an isocyanate-reactive component comprising: (a1) at least one polyaspartic ester, and (a2) optionally a polyetheraspartic ester; (b) an isocyanate component comprising: (b1) at least one isocyanate prepolymer having an isocyanate group equivalent of 300 to 1100, and (b2) at least one isocyanate oligomer containing not less than two isocyanate groups, the weight ratio of the isocyanate prepolymer (b1) to the isocyanate oligomer (b2) being from 1:4 to 4:1; (c) a catalyst; and (d) optionally an additive; wherein the coating composition has a molar ratio of isocyanate groups to isocyanate-reactive groups of 1.5:1 to 8:1. The coating composition provided by the present invention has a long pot life, and the resulting coating has the advantages of fast drying and high hardness.
    Type: Application
    Filed: July 17, 2019
    Publication date: September 9, 2021
    Inventors: Dorota Greszta-Franz, Jianping Shen, Junchao Zheng, Yifeng Xu, Ling Yang, Jinqi Li, Hongchao Li, Hao Liu
  • Patent number: 11008669
    Abstract: An apparatus for holding a substrate (113) has a chuck cup (101), a seal shell (111), a chuck plate (102) and a vertical driving device (103). The seal shell (111) has a bottom wall (1111), an outer wall (1112) and an inner wall (1114). The inner wall (1114) forms a lip seal portion (1115). The bottom wall (1111) and the outer wall (1112) of the seal shell (111) respectively wrap the bottom surface and the outer surface of the base portion (1011) of the chuck cup (101). The lip seal portion (1115) wraps the supporting portion (1014) of the chuck cup (101) for sealing the edge of the front side of the substrate (113). The apparatus protects the edge of the front side of the substrate, the back side of the substrate and the chuck cup from contacting with the electrolyte solution.
    Type: Grant
    Filed: December 4, 2015
    Date of Patent: May 18, 2021
    Assignee: ACM Research (Shanghai) Inc.
    Inventors: Hui Wang, Zhaowei Jia, Hongchao Yang, Jun Wu, Jian Wang
  • Publication number: 20210072645
    Abstract: A coater with automatic cleaning function and a coater automatic cleaning method. The coater (100,200,300,400,500,600,700,800) includes a coater chamber (101,201,301,401,501,601,701,801) capable of being filled up with cleaning solution, a substrate chuck (102,202,302,402,502,602,702,802) holding and positioning a substrate (103,203,303,403,503,603,703,803), and at least one shroud (108,208,308,408,508) capable of moving up for preventing photoresist from splashing out of the coater chamber (101,201,301,401,501,601,701,801), or moving down and immersing into the cleaning solution for cleaning.
    Type: Application
    Filed: October 26, 2020
    Publication date: March 11, 2021
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Hui Wang, Fuping Chen, Wenjun Wang, Hongchao Yang, Voha Nuch, Fufa Chen, Jian Wang, Xiaoyan Zhang, Shu Yang
  • Publication number: 20210066106
    Abstract: A plating chuck for holding a substrate during plating processes, wherein the substrate has a notch area (3031) and a patterned region (3032) adjacent to the notch area (3031). The plating chuck comprises a cover plate (3033) configured to cover the notch area (3031) of the substrate to shield the electric field at the notch area (3031) when the substrate is being plated.
    Type: Application
    Filed: September 7, 2017
    Publication date: March 4, 2021
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Hui Wang, Jian Wang, Zhaowei Jia, Hongchao Yang
  • Publication number: 20200354851
    Abstract: A plating apparatus for depositing metal on a substrate, comprising a membrane frame (14), a catholyte inlet pipe (30) and a center cap (40). The membrane frame (14) has a center passage (144) which passes through the center of the membrane frame (14). The catholyte inlet pipe (30) is connected to the center passage (144) of the membrane frame (14). The center cap (40) is fixed at the center of the membrane frame (14) and covers over the center passage (144) of the membrane frame (14). The top of the center cap (40) has a plurality of first holes (42). The catholyte inlet pipe (30) supplies catholyte to the center cap (40) through the center passage (144) of the membrane frame (14), and the catholyte is supplied to a center area of the substrate through the first holes (42) of the center cap (40).
    Type: Application
    Filed: August 30, 2017
    Publication date: November 12, 2020
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Zhaowei Jia, Hongchao Yang, Chenhua Lu, Jian Wang, Hui Wang
  • Patent number: 10816901
    Abstract: A coater with automatic cleaning function and a coater automatic cleaning method. The coater (100,200,300,400,500,600,700,800) includes a coater chamber (101,201,301,401,501,601,701,801) capable of being filled up with cleaning solution, a substrate chuck (102,202,302,402,502,602,702,802) holding and positioning a substrate (103,203,303,403,503,603,703,803), and at least one shroud (108,208,308,408,508) capable of moving up for preventing photoresist from splashing out of the coater chamber (101,201,301,401,501,601,701,801), or moving down and immersing into the cleaning solution for cleaning.
    Type: Grant
    Filed: September 16, 2014
    Date of Patent: October 27, 2020
    Assignee: ACM Research (Shanghai) Inc.
    Inventors: Hui Wang, Fuping Chen, Wenjun Wang, Hongchao Yang, Voha Nuch, Fufa Chen, Jian Wang, Xiaoyan Zhang, Shu Yang
  • Publication number: 20200294825
    Abstract: A substrate heat treatment apparatus for heat treating a substrate, comprising a bake plate, a plurality of support components, a baffle plate, and a driving device. The bake plate defines at least one gas passage. The plurality of support components support the substrate. The baffle plate is fixed on a top surface of the bake plate. The baffle plate surrounds the substrate and a gap is formed between an inner circumferential wall of the baffle plate and the substrate. A driving device drives the plurality of support components to move up or down. When heat treating the substrate, a hot gas is supplied to the space between the substrate and the top surface of the bake plate through the gas passage of the bake plate, and the hot gas flows out through the gap formed between the inner circumferential wall of the baffle plate and the substrate.
    Type: Application
    Filed: March 18, 2016
    Publication date: September 17, 2020
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Hui Wang, Hongchao Yang, Jun Wu, Wenjun Wang, Fuping Chen, Zhiyou Fang
  • Patent number: 10482093
    Abstract: The present invention proposes a method for data mining, the method comprising: making statistics of the feature vectors of each target object according to the records in a target data set so as to constitute a rough data set, each of the feature vectors including the value of at least one attribute data of the target objects corresponding thereto; screening the feature vectors which correspond to all known the first type of target objects from the rough data set, and performing a filter operation onto the screened feature vectors to obtain samples; and building a regression model based on the samples, and then using the built regression model to determine whether each of all known the second type of target objects potentially belongs to the first type of target objects. The method for data mining disclosed in the present invention is capable of mining and classifying the target objects according to the comprehensive features of the target objects.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: November 19, 2019
    Assignee: CHINA UNIONPAY CO., LTD.
    Inventors: Jun Wang, Hongchao Yang
  • Patent number: 10227705
    Abstract: An apparatus and a method for plating and/or polishing wafer includes a wafer chuck, an auxiliary nozzle apparatus and a main nozzle apparatus. The wafer chuck holds and positions the wafer, moves horizontally, and rotates. The auxiliary nozzle apparatus supplies uncharged or charged electrolyte to cover the outer edge of the wafer and the wafer chuck, and the main nozzle apparatus supplies charged electrolyte to the surface of the wafer, to improve the plating and/or polishing uniformity of the outer edge of the wafer, reduce the entire electric resistance of the apparatus, and improve the plating and/or polishing rate.
    Type: Grant
    Filed: May 9, 2013
    Date of Patent: March 12, 2019
    Assignee: ACM Research (Shanghai) Inc.
    Inventors: Jian Wang, Yinuo Jin, Hongchao Yang, Hui Wang
  • Publication number: 20180320285
    Abstract: An apparatus for holding a substrate (113) has a chuck cup (101), a seal shell (111), a chuck plate (102) and a vertical driving device (103). The seal shell (111) has a bottom wall (1111), an outer wall (1112) and an inner wall (1114). The inner wall (1114) forms a lip seal portion (1115). The bottom wall (1111) and the outer wall (1112) of the seal shell (111) respectively wrap the bottom surface and the outer surface of the base portion (1011) of the chuck cup (101). The lip seal portion (1115) wraps the supporting portion (1014) of the chuck cup (101) for sealing the edge of the front side of the substrate (113). The apparatus protects the edge of the front side of the substrate, the back side of the substrate and the chuck cup from contacting with the electrolyte solution.
    Type: Application
    Filed: December 4, 2015
    Publication date: November 8, 2018
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Hui Wang, Zhaowei Jia, Hongchao Yang, Jun Wu, Jian Wang
  • Publication number: 20170372331
    Abstract: The present invention relates to specifying commercial district information of merchants, and it pertains to the technical field of data processing. The method for specifying commercial district information of merchants according to the present invention includes the steps of: mining and calculating association rules of consumption and transaction data of consumers so as to obtain information of association between merchants; calculating rates of subordination of merchants whose commercial district information has not been specified to several commercial districts based on the association information and specified commercial district information of at least some of the merchants; and specifying the commercial district information for each of said merchants based on their rates of subordination. The present invention can realize automatic specification of commercial district information of merchants, and the specification of commercial district information is accurate and efficient.
    Type: Application
    Filed: December 4, 2015
    Publication date: December 28, 2017
    Applicant: CHINA UNIONPAY CO., LTD.
    Inventors: Hongchao Yang, Jianbin Zheng, Jun Wang
  • Publication number: 20170248848
    Abstract: A coater with automatic cleaning function and a coater automatic cleaning method. The coater (100,200,300,400,500,600,700,800) includes a coater chamber (101,201,301,401,501,601,701,801) capable of being filled up with cleaning solution, a substrate chuck (102,202,302,402,502,602,702,802) holding and positioning a substrate (103,203,303,403,503,603,703,803), and at least one shroud (108,208,308,408,508) capable of moving up for preventing photoresist from splashing out of the coater chamber (101,201,301,401,501,601,701,801), or moving down and immersing into the cleaning solution for cleaning.
    Type: Application
    Filed: September 16, 2014
    Publication date: August 31, 2017
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Hui Wang, Fuping Chen, Wenjun Wang, Hongchao Yang, Voha Nuch, Fufa Chen, Jian Wang, Xiaoyan Zhang, Shu Yang
  • Publication number: 20160314174
    Abstract: The present invention proposes a method for data mining, the method comprising: making statistics of the feature vectors of each target object according to the records in a target data set so as to constitute a rough data set, each of the feature vectors including the value of at least one attribute data of the target objects corresponding thereto; screening the feature vectors which correspond to all known the first type of target objects from the rough data set, and performing a filter operation onto the screened feature vectors to obtain samples; and building a regression model based on the samples, and then using the built regression model to determine whether each of all known the second type of target objects potentially belongs to the first type of target objects. The method for data mining disclosed in the present invention is capable of mining and classifying the target objects according to the comprehensive features of the target objects.
    Type: Application
    Filed: December 10, 2014
    Publication date: October 27, 2016
    Applicant: CHINA UNIONPAY CO., LTD.
    Inventors: Jun Wang, Hongchao Yang
  • Publication number: 20160115613
    Abstract: An apparatus and a method for plating and/or polishing wafer includes a wafer chuck, an auxiliary nozzle apparatus and a main nozzle apparatus. The wafer chuck holds and positions the wafer, moves horizontally, and rotates. The auxiliary nozzle apparatus supplies uncharged or charged electrolyte to cover the outer edge of the wafer and the wafer chuck, and the main nozzle apparatus supplies charged electrolyte to the surface of the wafer, to improve the plating and/or polishing uniformity of the outer edge of the wafer, reduce the entire electric resistance of the apparatus, and improve the plating and/or polishing rate.
    Type: Application
    Filed: May 9, 2013
    Publication date: April 28, 2016
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Jian Wang, Yinuo Jin, Hongchao Yang, Hui Wang