Patents by Inventor Hongdan Yu

Hongdan Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12061113
    Abstract: The present application discloses an intelligent frequency reading method applicable to a low-temperature environment and a wireless vibrating wire acquisition instrument.
    Type: Grant
    Filed: April 26, 2024
    Date of Patent: August 13, 2024
    Assignee: Institute of Rock and Soil Mechanics, Chinese Academy of Sciences
    Inventors: Xianjun Tan, Weizhong Chen, Hongdan Yu, Hongming Tian, Jingqiang Yuan, Wusheng Zhao, Peichao Zheng
  • Patent number: 12055448
    Abstract: The disclosure provides a vibrating wire compressive stress gauge and stress testing equipment suitable for use in low-temperature environments. By providing a stress trigger sleeve made of elastic material, the concrete structure of the lining itself expands when it is affected by high or low temperatures, extruding the stress trigger sleeve, and the extrusion force is offset through the elastic force of the elastic material, thereby preventing the expansion force from being transmitted to the vibrating wire assembly to generate stress signals that are caused by the self-expansion of the lining structure, which may cause measurement error. Specifically, the vibrating wire assembly is provided in the vibrating wire measurement space composed of a stress trigger sleeve and a pair of anchoring disks. When the lining is subjected to external stress, a certain internal force will be generated.
    Type: Grant
    Filed: April 25, 2024
    Date of Patent: August 6, 2024
    Assignee: Institute of Rock and Soil Mechanics, Chinese Academy of Sciences
    Inventors: Xianjun Tan, Weizhong Chen, Hongdan Yu, Jingqiang Yuan, Yun Zhou, Xuyan Tan, Peichao Zheng