Patents by Inventor Hongfang XIE

Hongfang XIE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMAL CUT-OFF DEVICE HAVING A SINGLE-SIDED SILVER-PLATED HOUSING
    Publication number: 20220262585
    Abstract: A metal housing or casing for a thermal fuse (i.e., a thermal cut-off device) that has a multilayer metal construction including a copper-based layer, a first nickel layer disposed on a first side of the copper-based layer and including an outer surface of the casing, a second nickel layer disposed on a second side of the copper-based layer opposite to the first side of the copper-based layer, and a single silver layer disposed only on the second nickel layer and comprising the inner surface of the casing.
    Type: Application
    Filed: February 15, 2022
    Publication date: August 18, 2022
    Applicant: Therm-O-Disc Incorporated
    Inventors: Changcai ZHAO, Rong GUAN, Hongfang XIE