Patents by Inventor Hongfei Lu

Hongfei Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11926549
    Abstract: The present disclosure discloses a treatment process and treatment system of enhanced up-flow multiphase wastewater oxidation. The treatment process includes the following steps: 1) the wastewater is fed into the up-flow multiphase wastewater oxidation system for oxidation treatment; 2) the wastewater is fed to the solid-liquid separation system for solid-liquid separation, the separated heterogeneous catalytic carrier (5) is fed back to the up-flow multiphase wastewater oxidation system, and the wastewater is fed to the neutralization and degassing system; 3) the wastewater is fed to the neutralization and degassing system to adjust a pH of the wastewater to 5.5-7.5, and then is degassed by stirring; 4) the wastewater is fed to the flocculation and sedimentation system for sludge-water separation, a supernatant is discharged, and an outward harmless treatment is performed after a pressure filtration of a sedimentary iron sludge.
    Type: Grant
    Filed: July 4, 2019
    Date of Patent: March 12, 2024
    Assignee: Guangxi Bossco Environmental Protection Agency
    Inventors: Qifeng Yang, HongXiang Zhu, Guoning Chen, Hainong Song, Lihai Lu, Yanding Qin, Xi Liu, Yongli Chen, Hongfei Lin, Qianling Chen, Jinglong Wang
  • Publication number: 20230299066
    Abstract: A semiconductor device, including first and second conductive patterns, a plurality of first semiconductor chips each having a switching device, a plurality of second semiconductor chips each having a diode device, a plurality of first wires, respectively coupling low-potential electrodes of the switching devices and the second conductive pattern, and a plurality of second wires, respectively coupling anode electrodes of the diode devices and the second conductive pattern. Lengths of the first and second wires are substantially equal. The first semiconductor chips and the second semiconductor chips are arranged on the first conductive pattern in two rows, each row being in a first direction and including at least one first semiconductor chip and at least one second semiconductor chip, the first direction being parallel to a predetermined side of the first conductive pattern. The first and second wires are each in a second direction orthogonal to the first direction.
    Type: Application
    Filed: May 22, 2023
    Publication date: September 21, 2023
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventor: Hongfei LU
  • Patent number: 9469639
    Abstract: The present invention relates to naphthylurea derivatives. Such substances can significantly inhibit VEGFR2 and PDGFR-? receptor tyrosine kinase phosphorylation at nanomolar concentration levels. It is a novel type of tyrosine kinase inhibitors which can be used in the treatment of tyrosine kinase-mediated diseases or symptoms such as malignancies and ocular diseases accompanied with pathologic neovascularization.
    Type: Grant
    Filed: August 20, 2014
    Date of Patent: October 18, 2016
    Assignee: Radiant Pharma & Tech. Co., Ltd.
    Inventors: Yingjian Hu, Zhibin Luo, Yanhong Zhang, Li Han, Yun Wang, Hongfei Lu
  • Publication number: 20160207916
    Abstract: The present invention relates to naphthylurea derivatives. Such substances can significantly inhibit VEGFR2 and PDGFR-? receptor tyrosine kinase phosphorylation at nanomolar concentration levels.
    Type: Application
    Filed: August 20, 2014
    Publication date: July 21, 2016
    Inventors: Yingjian HU, Zhibin LUO, Yanhong ZHANG, Li HAN, Yun WANG, Hongfei LU
  • Patent number: 7557007
    Abstract: The method for manufacturing a semiconductor device according to the invention includes forming a thick silicon oxide film uniformly in a trench. Argon ions or the like implanted obliquely into the trench to form an ion implanted damaged region selectively in the portion of the silicon oxide film on the trench sidewall utilizing the shadowing effects of the oblique ion implantation. The silicon oxide film is wet etched to selectively remove the silicon oxide film in the ion implanted damaged region utilizing the etching rate difference, wherein the etching rate is faster in the damaged region than in the undamaged region. As a result, a thick residual oxide film is formed on the bottom and the lower sidewall portion of the trenchwithout causing any bird's beak.
    Type: Grant
    Filed: December 30, 2005
    Date of Patent: July 7, 2009
    Assignee: Fuji Electric Device Technology Co., Ltd.
    Inventors: Kazuo Shimoyama, Mutsumi Kitamura, Hongfei Lu
  • Publication number: 20060166419
    Abstract: The method for manufacturing a semiconductor device according to the invention includes forming a thick silicon oxide film uniformly in a trench. Argon ions or the like implanted obliquely into the trench to form an ion implanted damaged region selectively in the portion of the silicon oxide film on the trench sidewall utilizing the shadowing effects of the oblique ion implantation. The silicon oxide film is wet etched to selectively remove the silicon oxide film in the ion implanted damaged region utilizing the etching rate difference, wherein the etching rate is faster in the damaged region than in the undamaged region. As a result, a thick residual oxide film is formed on the bottom and the lower sidewall portion of the trenchwithout causing any bird's beak.
    Type: Application
    Filed: December 30, 2005
    Publication date: July 27, 2006
    Inventors: Kazuo Shimoyama, Mutsumi Kitamura, Hongfei Lu