Abstract: The present disclosure discloses a treatment process and treatment system of enhanced up-flow multiphase wastewater oxidation. The treatment process includes the following steps: 1) the wastewater is fed into the up-flow multiphase wastewater oxidation system for oxidation treatment; 2) the wastewater is fed to the solid-liquid separation system for solid-liquid separation, the separated heterogeneous catalytic carrier (5) is fed back to the up-flow multiphase wastewater oxidation system, and the wastewater is fed to the neutralization and degassing system; 3) the wastewater is fed to the neutralization and degassing system to adjust a pH of the wastewater to 5.5-7.5, and then is degassed by stirring; 4) the wastewater is fed to the flocculation and sedimentation system for sludge-water separation, a supernatant is discharged, and an outward harmless treatment is performed after a pressure filtration of a sedimentary iron sludge.

Abstract: An electronic device may be provided with an antenna having a resonating element formed from a segment of peripheral conductive housing structures. A speaker may be aligned with first openings in the segment. A vent may be aligned with second openings in the segment. A connector may protrude through the segment. A trace combiner for the antenna may be patterned onto the speaker and may be coupled to the segment. Tuners for the antenna may be disposed on first and second flexible printed circuits that extend along opposing sides of the connector. The tuners may be controlled through the speaker. The second flexible printed circuit may extend along the vent. The vent may have a vent cowling with a cut-out region next to the tuner on the second flexible printed circuit.

Abstract: An electronic device may be provided with an antenna having a resonating element formed from a segment of peripheral conductive housing structures. A speaker may be aligned with first openings in the segment. A vent may be aligned with second openings in the segment. A connector may protrude through the segment. A trace combiner for the antenna may be patterned onto the speaker and may be coupled to the segment. Tuners for the antenna may be disposed on first and second flexible printed circuits that extend along opposing sides of the connector. The tuners may be controlled through the speaker. The second flexible printed circuit may extend along the vent. The vent may have a vent cowling with a cut-out region next to the tuner on the second flexible printed circuit.

Abstract: An electronic device may be provided with a flexible printed circuit and a rigid printed circuit mounted to the flexible printed circuit using a board-to-board (B2B) connector. The flexible printed circuit may include signal conductors coupled to one or more antennas on the rigid printed circuit through the B2B connector. A given one of the signal conductors may include a phase shifter segment on the flexible printed circuit and/or a thick impedance matching segment on the rigid printed circuit that help to form a smooth impedance transition from the flexible printed circuit to the rigid printed circuit and the antenna(s). The B2B connector may include signal contacts interleaved with a ground contacts. The B2B connector may include ground bars laterally surrounding the signal and ground contacts to maximize the strength of mechanical coupling between the flexible printed circuit and the rigid printed circuit.

Abstract: An electronic device may be provided with a sensor module and an antenna having an antenna arm, ground structures, and a tuner. The tuner may be mounted to a printed circuit overlapping the sensor module. A spring may be mounted to the printed circuit and may couple the tuner to a conductive chassis of the sensor module. The sensor module may include optical sensors that gather sensor data through a display and may form ground paths from the tuner to the ground structures. Conductive interconnect structures such as springs may exert biasing forces in different directions to couple the ground paths to different layers of the ground structures. This may serve to couple the antenna to the ground structures as close as possible to the tuner, thereby maximizing antenna performance, despite the presence of the sensor module.

Abstract: An electronic device may be provided with an antenna resonating element on a first substrate that is mounted to a second substrate. A signal conductor may be coupled to a feed terminal on the antenna resonating element. The signal conductor may include impedance matching structures for the antenna. The impedance matching structures may include an open transmission line stub, a grounded transmission line stub, and a phase shifting segment. The impedance matching structures may configure the antenna to exhibit a wide bandwidth in an ultra-wideband (UWB) frequency band. If desired, the signal conductor may have a phase-shifting segment configured to match a non-50 Ohm impedance of a radio-frequency front end coupled to the signal conductor.

Abstract: An electronic device may be provided with an antenna having a resonating element and a light source module mounted to a flexible printed circuit and a metal cowling. The module may emit light through a rear housing wall. The printed circuit may be interposed between the metal cowling and a conductive support plate in the rear housing wall. The printed circuit may include a ground trace coupled to the resonating element. A dimpled pad may couple the ground trace to the support plate. Compressive foam may be used to exert a force against the flexible printed circuit that presses the dimpled pad against the conductive support plate. The ground trace and the dimpled pad may form a return path to ground for the resonating element. The dimpled pad may occupy less height within the device than other structures such as metal springs.

Abstract: An electronic device may be provided with a housing and an antenna. The antenna may be on a first substrate mounted to a second substrate. The housing may include a dielectric cover, a conductive plate on the dielectric cover, and a mid-chassis. The second substrate may be mounted to the mid-chassis. The antenna may include a conductive patch extending from a segment of a conductive ring on the first substrate. The conductive plate may have an opening aligned with the conductive patch. The first substrate may be separated from the dielectric cover by an air gap. A conductive gasket may couple the conductive ring to the conductive plate and may laterally surround the air gap and the opening. The antenna may convey ultra-wideband (UWB) signals through the air gap, the opening, and the dielectric cover layer.

Abstract: An electronic device may be provided with peripheral conductive housing structures having first and second segments. A flexible printed circuit may have a first tail that extends along the first and second segments and a second tail that extends along the first segment. A conductive trace on the first tail may be coupled to an antenna feed terminal on the second segment. A conductive trace on the second tail may couple the conductive trace on the first tail to the first segment. A tuner and filters may be disposed on the flexible printed circuit and may be coupled to the conductive traces. The conductive trace on the second tail may have a tapered width. An antenna in the device may have a resonating element that includes both the first and second segments, thereby allowing the antenna to exhibit a wide bandwidth from 1.1-5 GHz.

Abstract: An electronic device may be provided with peripheral conductive housing structures, a first antenna, and a second antenna. A gap may divide the housing structures into a first segment forming an arm of the first antenna and a second segment forming an arm of the second antenna. A first feed terminal may be coupled to the first segment and a second feed terminal may be coupled to the second segment. Switchable components may be coupled in parallel between the first and second feed terminals across the gap. The switchable components may be adjusted to tune the frequency response of the first and/or second antenna. The switchable components may have a first state in which only the first feed terminal feeds the first antenna and may have a second state in which both the first and second feed terminals feed the first antenna.

Abstract: An electronic device may be provided with peripheral conductive housing structures having a first segment and a second segment. First and second antenna feeds may be coupled between the first segment and the ground structures. The first feed may convey signals in a first band and the second feed may convey signals in a second band. The first segment may be near-field coupled to a slot between the second segment and the ground structures. A first tuner may be coupled between the second segment and the ground structures and may adjust a resonance of the first segment in the first and second bands. A second tuner coupled to the first feed may perform impedance matching in the first band and aperture tuning in the second band. A third tuner coupled to the second feed may perform impedance matching in the second band and aperture tuning in the first band.

Abstract: The present disclosure provides a digital image sensing device with a light intensifier, its structure includes a locating handle, a button, a host, a light intensifier, a regulating mechanism and a sensor, wherein the locating handle is connected to the host, the host fits with the light intensifier through the button in a form of electric connection, and the regulating mechanism is arranged between the light intensifier and the sensor; a stopping device and an interweaving device are arranged on a force-assisted body, and mutual fit is performed on a fillet cylinder through the stopping device and the interweaving device; when a guide rail has a closing tendency, a drum bulge inside the guide rail will firstly push the fillet cylinder to roll upwards, the interweaving device is guided to be located on a stabilizer through a pulling sheet.

Abstract: Disclosed is a method of manufacturing a piezoelectric thin film resonator on a non-silicon substrate, including the following steps: depositing a copper thin film on a silicon wafer; coating photoresist on the copper thin film to perform photoetching so as to remove photoresist in an air gap region under the piezoelectric thin film resonator to be disposed; electroplating-depositing a copper layer, and removing photoresist to obtain a stepped peel sacrifice layer; coating polyimide and performing imidization by heat treatment, making a sandwich structure of the piezoelectric thin film resonator above the polyimide layer; performing etching for the polyimide layer in a region not covered by the piezoelectric thin film resonator by oxygen plasma; placing the obtained device into a copper corrosion solution to dissolve the copper around and under the piezoelectric thin film resonator, attaching a drum coated with polyvinyl alcohol glue onto the piezoelectric thin film resonator, releasing and peeling it from th

Abstract: A large-aperture, high-pixel optical system has six lenses arranged successively from its object side to its image side along its optic axis. The first lens has a convex surface facing the object side and a concave surface facing the image side; The third lens is biconcave; the second and fifth lenses are biconvex; the fourth and sixth lenses each have a concave surface facing the object side and a convex surface facing the image side. The fifth lens and the sixth lens form a combined lens and the optical system satisfies TTL/EFL?4.5. Also disclosed is a camera module using the system. The system and the module are mainly composed of six lenses. Since the number of lenses used is limited, the structure is simple.

Abstract: Disclosed is a method of manufacturing a piezoelectric thin film resonator on a non-silicon substrate, including the following steps: depositing a copper thin film on a silicon wafer; coating photoresist on the copper thin film to perform photoetching so as to remove photoresist in an air gap region under the piezoelectric thin film resonator to be disposed; electroplating-depositing a copper layer, and removing photoresist to obtain a stepped peel sacrifice layer; coating polyimide and performing imidization by heat treatment, making a sandwich structure of the piezoelectric thin film resonator above the polyimide layer; performing etching for the polyimide layer in a region not covered by the piezoelectric thin film resonator by oxygen plasma; placing the obtained device into a copper corrosion solution to dissolve the copper around and under the piezoelectric thin film resonator, attaching a drum coated with polyvinyl alcohol glue onto the piezoelectric thin film resonator, releasing and peeling it from th

Abstract: Provided is a differential wiring method for a high-speed printed circuit board, including the following steps: setting a pre-set impedance required value Z2 of a non-ball grid array (BGA) region, determining the width w2 of the second differential wire and the distance d2 between the two second differential wires according to the pre-set impedance required value Z2; calculating the width w1 of the first differential wire and the distance d1 between the two first differential wires, according to the distance s1 between two adjacent rows of bonding pads in a BGA region bonding pad array and the minimum processable distance s2 between the bonding pad and the first differential wire, where w1 and d1 should satisfy 2w1+d1?s1?2s2, while further calculating w1 and d1 according to a differential characteristic impedance formula; arranging the two first differential wires disposed oppositely to each other in the BGA region according to the determined d1, and arranging the two second differential wires disposed opposi

Abstract: A large-aperture, high-pixel optical system has six lenses arranged successively from its object side to its image side along its optic axis. The first lens has a convex surface facing the object side and a concave surface facing the image side; The third lens is biconcave; the second and fifth lenses are biconvex; the fourth and sixth lenses each have a concave surface facing the object side and a convex surface facing the image side. The fifth lens and the sixth lens form a combined lens and the optical system satisfies TTL/EFL?4.5. Also disclosed is a camera module using the system. The system and the module are mainly composed of six lenses. Since the number of lenses used is limited, the structure is simple. With the unique arrangement of the lenses, and the combination of the fourth and fifth lenses, the desired optical performance thanks to the large aperture, high pixel, low distortion and good elimination of thermal difference can be achieved.

Abstract: A robotic walker and associated method are provided. The robotic walker includes a housing containing a control unit operatively connected to a drive unit. The drive unit is operatively connected to a pair of motorized drive wheels. The robotic walker includes first and second winches, each winch having a strap that can be retracted by its respective winch, each winch is operatively connected to the drive unit, each strap having an end adapted to be removably connected to a pair of leg braces worn by a user. The first and second winches may retract a portion of each respective strap to move the legs of the user forward. A first control button is operatively connected to the control unit. The control unit is configured to operate the robotic walker in at least one control mode and the first control button being operable to start the at least one control mode.

Abstract: Provided is a differential wiring method for a high-speed printed circuit board, including the following steps: setting a pre-set impedance required value Z2 of a non-ball grid array (BGA) region, determining the width w2 of the second differential wire (210) and the distance d2 between the two second differential wires (210) according to the pre-set impedance required value Z2; calculating the width w1 of the first differential wire (110) and the distance d1 between the two first differential wires (110), according to the distance s1 between two adjacent rows of bonding pads in a BGA region bonding pad array and the minimum processable distance s2 between the bonding pad and the first differential wire (110), where w1 and d1 should satisfy 2w1+d1?s1?2s2, while further calculating w1 and d1 according to a differential characteristic impedance formula; arranging the two first differential wires (110) disposed oppositely to each other in the BGA region according to the determined d1, and arranging the two secon

Abstract: A robotic walker and associated method are provided. The robotic walker includes a housing containing a control unit operatively connected to a drive unit. The drive unit is operatively connected to a pair of motorized drive wheels. The robotic walker includes first and second winches, each winch having a strap that can be retracted by its respective winch, each winch is operatively connected to the drive unit, each strap having an end adapted to be removably connected to a pair of leg braces worn by a user. The first and second winches may retract a portion of each respective strap to move the legs of the user forward. A first control button is operatively connected to the control unit. The control unit is configured to operate the robotic walker in at least one control mode and the first control button being operable to start the at least one control mode.