Abstract: The present disclosure discloses a method for producing raw cotton of machine-harvested long-staple cotton with a modal length of greater than or equal to 35 mm, including the steps: planting sea-island long-staple cotton and machining seed cotton, wherein planting the sea-island long-staple cotton includes preparation before machine harvesting, defoliation and ripening, choosing a cotton variety, etc.; and machining the seed cotton includes preparation before seed cotton ginning, mechanical separation of cotton seeds and raw cotton, and finishing the separated raw cotton. Raw cotton fibers obtained by the method of the present disclosure have main quality indexes that: a fiber length is 36.5-38.4 mm, a specific strength is 42.3-46.1 cN/tex, a uniformity is 86.2-87.0%, a foreign-fiber content is 0.2-0.4 g/t, and an impurity content is 2.6-3.4%.

Abstract: A method of bonding wires between a semiconductor die and a substrate on which the die is mounted includes providing an ultrasonic transducer (1). The transducer (1) includes an ultrasonic energy generation device (2), an ultrasonic vibration amplifying device (3) coupled at one end (10) to the ultrasonic energy generation device (2), a bonding tool (5) coupled to the opposite end (12) of the ultrasonic vibration amplifying device (3), and a mounting structure (4) located between the ends (10, 12) of the ultrasonic vibration amplifying device (3). The method also includes performing a first wire bond by operating the ultrasonic transducer (1) at a first ultrasonic frequency and performing a second wire bond by operating the ultrasonic transducer (1) at a second ultrasonic frequency, the second ultrasonic frequency being different from the first ultrasonic frequency.

Abstract: A method of monitoring a ball forming process in a wire bonder. A glow discharge parameter between an electrode on the wire bonder and an end of a wire mounted on the wire bonder on which the ball is being formed is monitored. The monitored parameter is compared with a reference value to determine whether the ball formed is satisfactory.

Abstract: A method of bonding wires between a semiconductor die and a substrate on which the die is mounted includes providing an ultrasonic transducer (1). The transducer (1) includes an ultrasonic energy generation device (2), an ultrasonic vibration amplifying device (3) coupled at one end (10) to the ultrasonic energy generation device (2), a bonding tool (5) coupled to the opposite end (12) of the ultrasonic vibration amplifying device (3), and a mounting structure (4) located between the ends (10, 12) of the ultrasonic vibration amplifying device (3). The method also includes performing a first wire bond by operating the ultrasonic transducer (1) at a first ultrasonic frequency and performing a second wire bond by operating the ultrasonic transducer (1) at a second ultrasonic frequency, the second ultrasonic frequency being different from the first ultrasonic frequency.