Abstract: An optical module including an optical waveguide substrate, a turning prism, an optical reception chip, a laser chip, a reflector and a displacement prism. The optical waveguide substrate is provided, at different sides thereof, with input optical ports and output optical ports to transmit optical reception and emission signals. The laser chip is arranged in a layer different from that of the optical waveguide substrate, so as to guide an optical emission signal from the laser chip into one input optical port. The reflector is arranged in an output optical path of the laser chip to reflect the optical emission signal from the laser chip. A light input end of the displacement prism faces the layer where the laser chip is located, a light output end thereof faces one input optical port to guide the optical emission signal reflected by the reflector into the optical waveguide substrate.

Abstract: An optical module including an upper shell part, a circuit board, a base, and a light reception component and a light emission component respectively disposed on upper and lower surfaces of the base; a base mounting portion is formed on the surface of the circuit board, through which the base is secured to the circuit board. In order to increase heat dissipation effect of the base, a protrusion is formed on an upper surface of the base, which protrudes towards and is in thermal connection with the upper shell part, conducting heat through the base. To dissipate heat generated by the light emission component more effectively, the light emission component is disposed on a lower surface of the base. Heat dissipation effect of the base is improved by forming the protrusion on the upper surface of the base and using it as a heat dissipation protrusion.

Abstract: The present disclosure discloses an optical module including a circuit board; a housing assembly including a light-receiving portion and a light-emitting cavity separated via a separation board and stacked one above the other, one side of the housing assembly adjacent to the circuit board being provided with a first notch through which one end of the circuit board is inserted into the housing assembly; a light-receiving assembly disposed in the light-receiving portion and electrically connected to an upper surface of the circuit board; and a light-emitting assembly disposed in the light-emitting cavity and electrically connected to a lower surface of the circuit board; a concave region is formed in the light-emitting cavity, and a laser assembly of the light-emitting assembly is arranged therein to lift the laser assembly to reduce height difference between wire bonding surface of the laser assembly and lower surface of the circuit board.

Abstract: The present disclosure discloses an optical module including a circuit board; a housing assembly including a light-receiving portion and a light-emitting cavity separated via a separation board and stacked one above the other, one side of the housing assembly adjacent to the circuit board being provided with a first notch through which one end of the circuit board is inserted into the housing assembly; a light-receiving assembly disposed in the light-receiving portion and electrically connected to an upper surface of the circuit board; and a light-emitting assembly disposed in the light-emitting cavity and electrically connected to a lower surface of the circuit board; a concave region is formed in the light-emitting cavity, and a laser assembly of the light-emitting assembly is arranged therein to lift the laser assembly to reduce height difference between wire bonding surface of the laser assembly and lower surface of the circuit board.

Abstract: The present disclosure discloses an optical module including: a circuit board; a housing assembly divided by a separation board into a first portion and a second portion that are stacked one above the other, wherein a light-emitting cavity is formed in the second portion, and a partition wall is provided in the first portion to separate the first portion into a light-receiving cavity and a slot, and is provided with a plurality of light-passing holes via which the light-receiving cavity is in communication with the slot; an optical fiber adapter disposed in the housing assembly and in communication with the light-receiving cavity; a light-emitting assembly arranged in the light emitting cavity and electrically connected to the circuit board, wherein heat generated by the light-emitting assembly is conducted to a surface of the housing assembly via the partition wall; and a light-receiving assembly.

Abstract: Provided is an optical module including a circuit board and an optical transceiver device. The circuit board is provided with a mounting hole and a data processor. The optical transceiver device is mounted on the circuit board and is electrically connected to the data processor. The optical transceiver device includes a mounting shell, a first cover member, a light emission component and a light reception component. The first cover member is disposed on the front surface of the circuit board. A laser assembly and a translation prism assembly of the light emission component are located on the mounting shell and are exposed to the front surface of the circuit board through the mounting hole, and a light exiting direction of a light processing assembly of the light emission component forms a first preset angle with a light entering direction thereof in a plane parallel to the circuit board.

Abstract: An optical module includes a circuit board, a light-emitting housing, a first optical fiber adapter, a first internal optical fiber, and an optical fiber connector. An end of the first internal optical fiber is connected to the first optical fiber adapter, and the optical fiber connector is optically connected to the light-emitting component and wraps another end of the first internal optical fiber. The first internal optical fiber and the optical fiber connector are transparent material members, and light transmittance of the two is different. The light-emitting housing includes a bottom wall and a concave groove. The optical fiber connector is disposed on the bottom wall, and a portion of the optical fiber connector is located above the concave groove. An orthogonal projection of the another end of the first internal optical fiber on the bottom wall is located in the concave groove.

Abstract: An optical module includes a light emitting assembly. The light emitting assembly includes a plurality of lasers, a plurality of wavelength division multiplexers and a lens group. The plurality of lasers emit a plurality of optical signals. The plurality of wavelength division multiplexers multiplex the plurality of optical signals into a plurality of composite optical signals. The lens group includes a first lens, a second lens, and a third lens. The second lens is configured to transmit a first part of the plurality of composite optical signals exited from the first lens, reflect a second part of the plurality of composite optical signals exited from the third lens to the first lens, and transmit the second part of the plurality of composite optical signals reflected by the first lens, so as to multiplex the plurality of composite optical signals into the merge composite optical signal.

Abstract: An optical module includes a light receiving assembly and a first fiber optic adapter. The light receiving assembly includes a first lens group, a plurality of wavelength division demultiplexers and at least one light receiving component. The first lens group is configured to split optical signals transmitted to the first cavity body for a first time according to a wavelength to obtain a first optical signal beam and a second optical signal beam. The plurality of wavelength division demultiplexers include a first wavelength division demultiplexer and a second wavelength division demultiplexer. The first wavelength division demultiplexer is configured to split the first optical signal beam for a second time according to a wavelength. The second wavelength division demultiplexer is configured to split the second optical signal beam for a second time according to a wavelength. The light receiving component includes a plurality of light receiving chips.

Abstract: The present disclosure discloses an optical module including: a circuit board; a housing assembly divided by a separation board into a first portion and a second portion that are stacked one above the other, wherein a light-emitting cavity is formed in the second portion, and a partition wall is provided in the first portion to separate the first portion into a light-receiving cavity and a slot, and is provided with a plurality of light-passing holes via which the light-receiving cavity is in communication with the slot; an optical fiber adapter disposed in the housing assembly and in communication with the light-receiving cavity; a light-emitting assembly arranged in the light emitting cavity and electrically connected to the circuit board, wherein heat generated by the light-emitting assembly is conducted to a surface of the housing assembly via the partition wall; and a light-receiving assembly.

Abstract: A photovoltaic intelligent power supply, comprising a plurality of unit modules, and a communication unit (103) and a control unit (106), wherein all the unit modules are connected to the control unit (106) and the communication unit (103); each unit module comprises an input collection unit (101), a data acquisition unit (102), a boost unit (104), an arc isolation unit (105) and an anti-PID unit (107), wherein the input collection unit (101) is connected to a photovoltaic module; the data acquisition unit (102) is configured to acquire voltage and current state signals; the boost unit (104) is configured to perform interleaving chopping and operate in an MPPT mode; the arc isolation unit (105) is configured to receive instructions sent by the control unit (106) to execute opening and closing; and the anti-PID unit (107) is configured to receive instructions sent by the control unit (106) so as to generate proper DC voltages to be applied between a negative electrode of a cell panel and the ground.

Abstract: A photovoltaic intelligent power supply, comprising a plurality of unit modules, and a communication unit (103) and a control unit (106), wherein all the unit modules are connected to the control unit (106) and the communication unit (103); each unit module comprises an input collection unit (101), a data acquisition unit (102), a boost unit (104), an arc isolation unit (105) and an anti-PID unit (107), wherein the input collection unit (101) is connected to a photovoltaic module; the data acquisition unit (102) is configured to acquire voltage and current state signals; the boost unit (104) is configured to perform interleaving chopping and operate in an MPPT mode; the arc isolation unit (105) is configured to receive instructions sent by the control unit (106) to execute opening and closing; and the anti-PID unit (107) is configured to receive instructions sent by the control unit (106) so as to generate proper DC voltages to be applied between a negative electrode of a cell panel and the ground.