Patents by Inventor Honghua Hu

Honghua Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240070222
    Abstract: Disclosed is a nonlinear optimization method for parameters of ocean ecological dynamics model, comprising the following steps: acquiring a state variable set and a parameter set to be optimized; building an ocean ecological dynamics model; acquiring a final cost function equation group; solving the ocean ecological dynamics model to obtain numerical solutions of each state variable; acquiring a Hamilton function of the cost function equation group under a constraint condition, and acquiring an adjoint equation based on the Hamilton function; adjusting the parameter set to be optimized based on the adjoint equation to obtain an optimal parameter set.
    Type: Application
    Filed: November 23, 2022
    Publication date: February 29, 2024
    Inventors: Honghua SHI, Long HU, Wei ZHENG, Tao XIA, Yongzhi WANG, Liting YIN, Yadong SUI
  • Publication number: 20240017350
    Abstract: A laser-processing apparatus can carry out a process to form a via in a workpiece, having a first material formed on a second material, by directing laser energy onto the workpiece such that the laser energy is incident upon the first material, wherein the laser energy has a wavelength to which the first material is more reflective than the second material. The apparatus can include a back-reflection sensing system operative to capture a back-reflection signal corresponding to a portion of laser energy directed to the workpiece and reflected by the first material and generate a sensor signal based on the captured back-reflection signal; and a controller communicatively coupled to an output of the back-reflection sensing system, wherein the controller is operative to control a remainder of the process by which the via is formed based on the sensor signal.
    Type: Application
    Filed: November 23, 2021
    Publication date: January 18, 2024
    Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.
    Inventors: Jan KLEINERT, Ruolin CHEN, James BROOKHYSER, Mark UNRATH, Honghua HU
  • Publication number: 20220168847
    Abstract: Numerous embodiments are disclosed. Many of which relate to methods of forming vias in workpieces such as printed circuit boards. Some embodiments relates techniques for indirectly ablating a region of an electrical conductor structure of, for example, a printed circuit board by spatially distributing laser energy throughout the region before the electrical conductor is indirectly ablated. Other embodiments relate to techniques for temporally-dividing laser pulses, modulating the optical power within laser pulses, and the like.
    Type: Application
    Filed: May 29, 2020
    Publication date: June 2, 2022
    Inventors: Jan KLEINERT, Zhibin LIN, Joel SCHRAUBEN, Mark UNRATH, Honghua HU, Ruolin CHEN, Chuan YANG, Geoffrey LOTT, Daragh FINN
  • Patent number: 10864599
    Abstract: Disclosed is a method and an apparatus to process a workpiece including producing a first beam of laser energy characterized by a first spatial intensity distribution. A first workpiece is processed using the first beam of laser energy to form a plurality of features at a first distance between the scan lens and the first workpiece and forming a second features at a second distance. The method includes determining which of the plurality of features has a shape that most closely resembles the shape of the first spatial intensity distribution and setting a process distance as the distance that produced that feature. Using this process distance, a surface of a second workpiece is processed using second beam of laser energy with a second spatial intensity distribution.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: December 15, 2020
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Yuan Liu, Honghua Hu, Jim Brookhyser, Guangyu Li, Brandon Bilyeu, Kurt Eaton
  • Publication number: 20190001434
    Abstract: Disclosed is a method and an apparatus to process a workpiece including producing a first beam of laser energy characterized by a first spatial intensity distribution. A first workpiece is processed using the first beam of laser energy to form a plurality of features at a first distance between the scan lens and the first workpiece and forming a second features at a second distance. The method includes determining which of the plurality of features has a shape that most closely resembles the shape of the first spatial intensity distribution and setting a process distance as the distance that produced that feature. Using this process distance, a surface of a second workpiece is processed using second beam of laser energy with a second spatial intensity distribution.
    Type: Application
    Filed: March 17, 2017
    Publication date: January 3, 2019
    Inventors: Yuan Liu, Honghua Hu, Jim Brookhyser, Guangyu Li, Brandon Bilyeu, Kurt Eaton
  • Patent number: D969240
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: November 8, 2022
    Inventor: Honghua Hu