Patents by Inventor Honghui HU

Honghui HU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11699061
    Abstract: A storage apparatus includes a control chip, a storage chip, a power interface configured to receive a first voltage, a first variable-voltage circuit. An input end of the first variable-voltage circuit is coupled to the power interface. The first variable-voltage circuit is configured to convert the first voltage into a second voltage, and provide the second voltage to the control chip and a second variable-voltage circuit, where an input end of the second variable-voltage circuit is coupled to the power interface. The second variable-voltage circuit is configured to convert the first voltage into a third voltage and provide the third voltage to the control chip and the storage chip.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: July 11, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Honghui Hu, Guangqing Liang
  • Publication number: 20220067477
    Abstract: A storage apparatus includes a control chip, a storage chip, a power interface configured to receive a first voltage, a first variable-voltage circuit. An input end of the first variable-voltage circuit is coupled to the power interface. The first variable-voltage circuit is configured to convert the first voltage into a second voltage, and provide the second voltage to the control chip and a second variable-voltage circuit, where an input end of the second variable-voltage circuit is coupled to the power interface. The second variable-voltage circuit is configured to convert the first voltage into a third voltage and provide the third voltage to the control chip and the storage chip.
    Type: Application
    Filed: July 17, 2019
    Publication date: March 3, 2022
    Inventors: Honghui Hu, Guangqing Liang
  • Patent number: 10714148
    Abstract: A SSD storage module comprising a printed circuit board, an encapsulating colloid, and an electronic circuit welded on an inner surface of the printed circuit board and having a data storage function; the encapsulating colloid is formed on the inner surface of the printed circuit board and is configured for seamlessly encapsulating the electronic circuit, an outer surface of the printed circuit board is provided with a plurality of metal contact pieces, the plurality of metal contact pieces are electrically connected with the electronic circuit, and the plurality of metal contact pieces comprise a plurality of SATA interface contact pieces. The encapsulating colloid seamlessly encapsulates the electronic circuit and isolates the electronic circuit from the air, such that a problem that the electronic circuit is directly exposed to the air, and performances of components of the electronic circuit may be affected, thereby resulting in an unstable functionality of a SSD can be avoided.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: July 14, 2020
    Assignee: SHENZHEN LONGSYS ELECTRONICS CO., LTD.
    Inventors: Zhixiong Li, Weiwen Pang, Xiaoqiang Li, Honghui Hu, Jinmou Qin
  • Publication number: 20190341081
    Abstract: A SSD storage module comprising a printed circuit board, an encapsulating colloid, and an electronic circuit welded on an inner surface of the printed circuit board and having a data storage function; the encapsulating colloid is formed on the inner surface of the printed circuit board and is configured for seamlessly encapsulating the electronic circuit, an outer surface of the printed circuit board is provided with a plurality of metal contact pieces, the plurality of metal contact pieces are electrically connected with the electronic circuit, and the plurality of metal contact pieces comprise a plurality of SATA interface contact pieces. The encapsulating colloid seamlessly encapsulates the electronic circuit and isolates the electronic circuit from the air, such that a problem that the electronic circuit is directly exposed to the air, and performances of components of the electronic circuit may be affected, thereby resulting in an unstable functionality of a SSD can be avoided.
    Type: Application
    Filed: July 16, 2019
    Publication date: November 7, 2019
    Applicant: SHENZHEN LONGSYS ELECTRONICS CO., LTD.
    Inventors: Zhixiong LI, Weiwen PANG, Xiaoqiang LI, Honghui HU, Jinmou QIN
  • Patent number: 10388329
    Abstract: A SSD storage module comprising a printed circuit board (1), an encapsulating colloid (2), and an electronic circuit (3) welded on an inner surface of the printed circuit board (1) and having a data storage function; the encapsulating colloid (2) is formed on the inner surface of the printed circuit board (1) and is configured for seamlessly encapsulating the electronic circuit (3), an outer surface of the printed circuit board (1) is provided with a plurality of metal contact pieces (11), the plurality of metal contact pieces (11) are electrically connected with the electronic circuit (3), and the plurality of metal contact pieces (11) comprise a plurality of SATA interface contact pieces (110).
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: August 20, 2019
    Assignee: SHENZHEN LONGSYS ELECTRONICS CO., LTD.
    Inventors: Zhixiong Li, Weiwen Pang, Xiaoqiang Li, Honghui Hu, Jinmou Qin
  • Publication number: 20170236558
    Abstract: A SSD storage module comprising a printed circuit board (1), an encapsulating colloid (2), and an electronic circuit (3) welded on an inner surface of the printed circuit board (1) and having a data storage function; the encapsulating colloid (2) is formed on the inner surface of the printed circuit board (1) and is configured for seamlessly encapsulating the electronic circuit (3), an outer surface of the printed circuit board (1) is provided with a plurality of metal contact pieces (11), the plurality of metal contact pieces (11) are electrically connected with the electronic circuit (3), and the plurality of metal contact pieces (11) comprise a plurality of SATA interface contact pieces (110).
    Type: Application
    Filed: July 18, 2016
    Publication date: August 17, 2017
    Inventors: Zhixiong LI, Weiwen PANG, Xiaoqiang LI, Honghui HU, Jinmou QIN
  • Patent number: D819037
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: May 29, 2018
    Assignee: Shenzhen Longsys Electronics Co., Ltd.
    Inventors: Zhixiong Li, Weiwen Pang, Xiaoqiang Li, Honghui Hu, Jinmou Qin