Patents by Inventor Honghui MOU

Honghui MOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and device for reducing contamination for reliable bond pads
    Patent number: 10410854
    Abstract: The present disclosure generally relates to methods for cleaning the backside of a wafer. A wet cleaning method may be used by stripping off the uppermost spacer layers on the backside of the wafer using a cleaning solution. In one embodiment, hydrogen fluoride (HF) solution may be employed to remove the nitride/oxide spacer layer. In another embodiment, a dry cleaning method may be employed to etch the wafer at the bevel region. Residues are completely removed from the wafer backside. This method improves the yield and storage life of the semiconductor wafers.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: September 10, 2019
    Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Honghui Mou, Xiaodong Li, Yun Ling Tan, Alex See, Liang Li
  • METHOD AND DEVICE FOR REDUCING CONTAMINATION FOR RELIABLE BOND PADS
    Publication number: 20190206676
    Abstract: The present disclosure generally relates to methods for cleaning the backside of a wafer. A wet cleaning method may be used by stripping off the uppermost spacer layers on the backside of the wafer using a cleaning solution. In one embodiment, hydrogen fluoride (HF) solution may be employed to remove the nitride/oxide spacer layer. In another embodiment, a dry cleaning method may be employed to etch the wafer at the bevel region. Residues are completely removed from the wafer backside. This method improves the yield and storage life of the semiconductor wafers.
    Type: Application
    Filed: December 28, 2017
    Publication date: July 4, 2019
    Inventors: Honghui MOU, Xiaodong LI, Yun Ling TAN, Alex SEE, Liang LI