Abstract: A battery system includes a plurality of battery containers, each including a battery rack, a container housing accommodating the battery rack in an internal space, and a first power line configured to transmit charge power and discharge power, wherein the first power lines of the battery containers are connected to each other, and a control cabinet including a control module configured to control the plurality of battery containers, a cabinet housing accommodating the control module in an internal space, and a second power line configured to be connected to the first power line of one of the plurality of battery containers.

Abstract: A substrate comprising a core layer, at least one first dielectric layer coupled to a first surface of the core layer, at least one second dielectric layer coupled to a second surface of the core layer, a plurality of interconnects located at least partially in the at least one first dielectric layer; a region comprising a plurality of block interconnects of an interconnect block; and a solder resist layer coupled to the at least one first dielectric layer.

Abstract: Hybrid package substrates employing film metallization layers with outer pre-impregnated (PPG) region(s) to support high density bump and wire bond connections for respective bump and wire bond connected dies in the IC package, and related hybrid integrated circuit (IC) packages and fabrication methods are disclosed. The package substrate includes film metallization layers of a softer, flexible material that can more easily be patterned to support formation of high density, reduced pitch metal interconnects to support finer bump pitch connections to a bottom, first die(s) in a die region of the package substrate. The package substrate also includes one or more PPG regions a PPG metallization layer(s) adjacent to the die region of the package substrate that reinforces the film metallization layers and also supports the formation of wire bond pads for wire bond connections to an upper, second die(s) in the hybrid IC package.

Abstract: A battery container has improved energy density and can be used in an energy storage system. The battery container includes a container body, a coupling unit configured to couple different container bodies, and a load support unit configured to support a vertical load of the container body.

Abstract: Package substrate with metallization layer(s) that includes an additional metal pad layer to facilitate reduced via size for reduced bump pitch, and related integrated circuit (IC) packages and fabrication methods. An additional metal pad(s) is provided in an insulating layer of a metallization layer(s) of the package substrate in which a via(s) is formed to reduce vertical connectivity distance between metal interconnects in adjacent metallization layers electrically coupled together by the via. This can reduce the aspect ratio and size of the via thereby allowing metal interconnects that are electrically coupled to the via to also be reduced in size (e.g., width) while still supporting an aligned, low resistance connection between the via(s) and the metal interconnects. Being able to reduce the size (e.g., width) of the metal interconnects can reduce bump pitch of the package substrate, which can facilitate a higher density of die/bump connections to the package substrate.

Abstract: Disclosed are devices in which a die, such as a system-on-chip (SoC) die is attached to an interposer with a mold. Unlike convention devices, the contact area for adhesion is increased by providing vertical surfaces in addition to lateral surfaces for attachment. In so doing, possibility of delamination is decreased significantly.

Abstract: An energy storage system according to the present disclosure includes at least one battery rack including a plurality of stacked battery modules; a container accommodating the at least one battery rack, wherein the container includes a bottom plate in which the at least one battery rack is disposed; and a fire fighting water collection chamber disposed lower than the bottom plate and having at least one side in communication with the bottom plate to allow a fire fighting water dropped from the at least one battery rack to enter.

Abstract: A battery rack according to the present disclosure includes a plurality of battery modules; a rack case having receiving portions, each receiving portion configured to and receive one of the plurality of battery modules at each predetermined height, and each receiving portion having a structure in which upper and lower sides and left and right sides are closed and front and rear sides are open; a fire fighting water supply pipe connected to each of the battery modules disposed in the receiving portions which supplies a fire fighting water when a fire occurs; and a drain guide disposed on an outer surface of the rack case including at least one surface of a front outer surface or a rear outer surface of the rack case, the drain guide being configured to guide drainage of the fire fighting water.

Abstract: A cervical spine endplate preparation apparatus is provided. To this end, the present invention comprises: a handle part having a handle to be held by hand and a leading rod extending from the handle in the length direction and for guiding to a space inside the spine of a part to be operated on; a rotating shaft part having an adjustment grip, which generates a driving force by means of rotation by hand, and a rotating shaft passing through the inside of the handle and leading rod; and a shaver part which has a case, provided on the leading rod and inserted into the space of the spine, and a shaver installed inside the case and mating with the rotating shaft to rotate by means of the driving force of the adjustment grip, and having a part of a blade exposed to the top of the case and rotating.

Abstract: There are provided a mask processing method and a mask processing apparatus for reusing a mask used in an organic material deposition process. The mask processing method includes: (a) forming a sacrificial layer on a mask in a first chamber; (b) transferring the mask to a second chamber in which a substrate is disposed, and then processing the substrate using the mask; and (c) removing the sacrificial layer on the mask.

Abstract: The present invention relates to a method for depositing a protection film of a light-emitting element, the method comprising the steps of: depositing a first protection layer on a light-emitting element of a substrate by means of the atomic layer deposition method; and depositing at least one additional protection layer on the first protection layer by means of the plasma-enhanced chemical vapor deposition method.

Abstract: The present invention relates to a passivation film deposition method for a light-emitting diode, comprising the steps of: depositing, on an upper part of a light-emitting diode of a substrate, a first passivation film having a silicon nitride (SiNx); and depositing, on an upper part of the first passivation film, a second passivation film having a silicon oxide (SiOx), wherein the ratio of the thickness of the first passivation film to the thickness of the second passivation film is 0.2-0.4:1.

Abstract: The present invention relates to a method of depositing a protection film for a light-emitting element, the method comprising the steps of: depositing a first inorganic protection layer on a light-emitting element on a substrate; and depositing a second inorganic protection layer, having comparatively smaller internal stress than the first inorganic protection layer, on the first inorganic protection layer.

Abstract: A thin film deposition apparatus is provided. The thin film deposition apparatus prevents powders from being generated by a gas supply unit for supplying process gas when a thin film is deposited by atomic layer deposition (ALD).

Abstract: The present invention relates to a method of depositing a protection film for a light-emitting element, the method comprising the steps of: depositing a first inorganic protection layer on a light-emitting element on a substrate; and depositing a second inorganic protection layer, having comparatively smaller internal stress than the first inorganic protection layer, on the first inorganic protection layer.

Abstract: The present invention relates to a method for depositing a protection film of a light-emitting element, the method comprising the steps of: depositing a first protection layer on a light-emitting element of a substrate by means of the atomic layer deposition method; and depositing at least one additional protection layer on the first protection layer by means of the plasma-enhanced chemical vapor deposition method.

Abstract: The present invention relates to a passivation film deposition method for a light-emitting diode, comprising the steps of: depositing, on an upper part of a light-emitting diode of a substrate, a first passivation film having a silicon nitride (SiNx); and depositing, on an upper part of the first passivation film, a second passivation film having a silicon oxide (SiOx), wherein the ratio of the thickness of the first passivation film to the thickness of the second passivation film is 0.2-0.4:1.

Abstract: Provided is a solar cell module comprising a crystalline silicon wafer, at least one amorphous silicon layer provided on at least one of a top and bottom of the crystalline silicon wafer, a transparent conductive film provided on a surface of the at least one amorphous silicon layer, electrodes provided on a surface of the transparent conductive film and a division unit to divide the transparent conductive film into a current-carrying region and a non-current-carrying region, wherein the current-carrying region is electrically connected to the electrodes and the non-current-carrying region is electrically disconnected from the electrodes.

Abstract: Provided is a solar cell module comprising a crystalline silicon wafer, at least one amorphous silicon layer provided on at least one of a top and bottom of the crystalline silicon wafer, a transparent conductive film provided on a surface of the at least one amorphous silicon layer, electrodes provided on a surface of the transparent conductive film and a division unit to divide the transparent conductive film into a current-carrying region and a non-current-carrying region, wherein the current-carrying region is electrically connected to the electrodes and the non-current-carrying region is electrically disconnected from the electrodes.

Abstract: Provided is a needle assembly for use in oriental acupuncture. The needle assembly includes: a hollow tubular rod member; a pin member which is movably installed in the rod member and can be inserted into a person's skin; and a reuse preventing unit preventing the pin member, which is protruded from an end of the rod member and is inserted into the skin, from being protruded from the end of the rod member and inserted into the skin again.