Patents by Inventor Hong-Jin Park
Hong-Jin Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240170219Abstract: A multilayer electronic component includes: a body having a dielectric layer and first and second internal electrodes alternately disposed with each other while having the dielectric layer interposed therebetween in a first direction; and an external electrode including a connection portion and a band portion extending from the connection portion onto first and second surfaces of the body, wherein the external electrode further includes an electrode layer connected to one of the first and second internal electrodes, a resin layer in contact with the first and second surfaces, and a conductive resin layer disposed on the electrode layer and extending to the resin layer, and L1??L1 when L1 indicates a second-directional size of the resin layer in the band portion, and L1? indicates a second-directional size of the conductive resin layer in the band portion.Type: ApplicationFiled: March 9, 2023Publication date: May 23, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Byung Woo KANG, Jung Min KIM, Hong Je CHOI, Ji Hye HAN, Hye Jin PARK, Su Yun YUN, Sang Wook LEE
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Publication number: 20240150985Abstract: Proposed is a detachable mooring system for an offshore structure, including a first tension adjuster connected to an offshore structure, and blocking a pulling chain from proceeding from an outlet of a body toward an inlet, a second tension adjuster connected to one end of the pulling chain and blocking the pulling chain from proceeding from an outlet of a body toward an inlet, a mooring chain having a first longitudinal end connected to one surface of the second tension adjuster body and having a second longitudinal end connected to an anchor on the seabed, a first lead rope having one longitudinal end connected to one end of the pulling chain discharged out through the first tension adjuster outlet, and a second lead rope having one longitudinal end connected to the second tension adjuster body.Type: ApplicationFiled: January 3, 2024Publication date: May 9, 2024Applicants: KOREA INSTITUTE OF OCEAN SCIENCE & TECHNOLOGY, KOMS INC., DHMC CO., LTD.Inventors: Kang Su LEE, Hong Gun SUNG, Byoung Jae PARK, Jang Jin KIM, Hyun Kook KIM, Chang Hwan SEO, Kyung Seok LEE, Yoon Yong PARK
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Patent number: 11951678Abstract: Disclosed is a method for manufacturing a 3D printing structure, the method including: producing a molded body by performing 3D printing on paste including printing powder in a coagulation bath including a hydrogel; hardening the molded body produced in the coagulation bath; and removing the hydrogel in the coagulation bath. A method for manufacturing a 3D printing structure, which is provided according to an aspect of the disclosure, does not require printing of a separate support, and thus it is possible to save time and costs. A post-processing process for removing a support is not required. Thus, a process is further simplified, and there is no risk of damage to a structure.Type: GrantFiled: October 14, 2021Date of Patent: April 9, 2024Assignee: KOREA INSTITUTE OF MATERIALS SCIENCEInventors: Yeong-jin Choi, Hui-suk Yun, Hong-hyun Park
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Patent number: 11745292Abstract: A glass panel processing method includes a first deformed portion formation step in which, in order to form a via-hole in a glass substrate, a first deformed portion is formed to a first depth from the upper surface of the glass substrate through irradiation with a laser beam along a planned via-hole line, a second deformed portion formation step in which, in order to cut the glass substrate into unit cells, a second deformed portion is formed to a second depth in the glass substrate through irradiation with a laser beam along a planned cutting line, and an etching step in which, the glass substrate with the first deformed portion and the second deformed portion formed therein is etched such that etching of the glass substrate along the planned cutting line is completed before completion of etching of the glass substrate along the planned via-hole line.Type: GrantFiled: November 21, 2022Date of Patent: September 5, 2023Assignees: JOONGWOO NARA CO., LTD., BSP CO., LTD.Inventors: Sung Soo Park, Hong Jin Park
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Publication number: 20230017356Abstract: A through-glass via-hole formation method includes: forming a hole-shaped deformed region extending in a thickness direction of a glass substrate by irradiating the glass substrate with a laser beam at an energy intensity not exceeding an ablation threshold of the glass substrate; and forming a via-hole through the glass substrate along the deformed region by immersing the glass substrate in an etching solution such that the deformed region is etched and removed, wherein an etching solution having a first concentration is used as the etching solution to allow the via-hole to have a first aspect ratio, and an etching solution having a second concentration greater than the first concentration is used as the etching solution to allow the via-hole to have a second aspect ratio smaller than the first aspect ratio.Type: ApplicationFiled: April 27, 2022Publication date: January 19, 2023Applicants: JOONGWOO NARA CO.,LTD., BSP CO., LTD.Inventors: Sung Soo PARK, Hong Jin PARK, Ju Ho Jang
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Patent number: 11532804Abstract: A method of manufacturing a flexible OLED module includes: forming a polymer layer on one surface of a base substrate; forming a thin glass sheet on one surface of the polymer layer; forming multiple OLED elements on one surface of the thin glass sheet; forming a protective layer on one surface of the thin glass sheet to cover the OLED elements; separating the base substrate and the polymer layer from each other through separation of the sacrificial layer by laser lift-off (LLO); and cutting the thin glass sheet and the protective layer to provide multiple unit OLED modules each including the OLED element.Type: GrantFiled: October 13, 2020Date of Patent: December 20, 2022Assignees: BSP CO., LTD., JOONGWOO M-TECH CO., LTD.Inventors: Hong Jin Park, Sung Soo Park
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Publication number: 20210287576Abstract: Disclosed herein is a foldable display apparatus which can reduce occurrence of marks on a folding section thereof, wherein the display apparatus includes a display panel, a mid-frame, and an adhesive layer, the mid-frame is disposed on one surface of the display panel, the adhesive layer is interposed between the display panel and the mid-frame to bond the display panel to the mid-frame and the mid-frame is formed of glass.Type: ApplicationFiled: January 5, 2021Publication date: September 16, 2021Applicants: BSP CO., LTD., JOONGWOO M-TECH CO., LTD.Inventors: Hong Jin PARK, Sung Soo PARK
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Publication number: 20210143372Abstract: A method of manufacturing a flexible OLED module includes: forming a polymer layer on one surface of a base substrate; forming a thin glass sheet on one surface of the polymer layer; forming multiple OLED elements on one surface of the thin glass sheet; forming a protective layer on one surface of the thin glass sheet to cover the OLED elements; separating the base substrate and the polymer layer from each other through separation of the sacrificial layer by laser lift-off (LLO); and cutting the thin glass sheet and the protective layer to provide multiple unit OLED modules each including the OLED element.Type: ApplicationFiled: October 13, 2020Publication date: May 13, 2021Applicants: BSP CO., LTD., JOONGWOO M-TECH CO., LTD.Inventors: Hong Jin PARK, Sung Soo PARK
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Publication number: 20210122673Abstract: A through-glass via hole formation method, includes: an internal deformation region formation step in which an internal deformation region is formed inside a glass substrate at a predetermined distance from a surface of the glass substrate; a surface etching step in which the glass substrate is thinned by immersing the glass substrate in an etching solution such that a portion of the surface of the glass substrate, at which the internal deformation region is not formed, is etched and removed at a first etching rate; and a through-glass via hole formation step in which, with the glass substrate immersed in the etching solution, the internal deformation region is etched and removed at a second etching rate higher than the first etching rate such that a through-glass via hole is formed in the glass substrate along the internal deformation region.Type: ApplicationFiled: August 24, 2020Publication date: April 29, 2021Applicants: BSP CO., LTD., JOONGWOO M-TECH CO., LTD.Inventors: Hong Jin PARK, Sung Soo PARK
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Publication number: 20210114925Abstract: A crack-free glass substrate cutting and thinning method, includes: an internal deformation line formation step in which an internal deformation line is formed inside a glass substrate at a predetermined distance from a surface of the glass substrate; a surface etching step in which the glass substrate is thinned by immersing the glass substrate in an etching solution such that a portion of the surface of the glass substrate, at which the internal deformation line is not formed, is etched and removed at a first etching rate; and an etch-cutting step in which, with the glass substrate immersed in the etching solution, the internal deformation line is etched and removed at a second etching rate higher than the first etching rate such that the glass substrate is cut along the internal deformation line.Type: ApplicationFiled: August 24, 2020Publication date: April 22, 2021Applicants: BSP CO., LTD., JOONGWOO M-TECH CO., LTD.Inventors: Hong Jin PARK, Sung Soo PARK
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Patent number: D823293Type: GrantFiled: October 28, 2016Date of Patent: July 17, 2018Assignee: MODNE INC.Inventors: Woo Jin Kim, Judy Jahey Chung, Ki Dong Kwon, Tae Hun Kim, Hyun Joo Lee, Joo Young Yoon, Hong Jin Park
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Patent number: D823294Type: GrantFiled: October 28, 2016Date of Patent: July 17, 2018Assignee: MODNE INC.Inventors: Woo Jin Kim, Judy Jahey Chung, Ki Dong Kwon, Tae Hun Kim, Hyun Joo Lee, Joo Young Yoon, Hong Jin Park
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Patent number: D823296Type: GrantFiled: October 28, 2016Date of Patent: July 17, 2018Assignee: MODNE INC.Inventors: Woo Jin Kim, Judy Jahey Chung, Ki Dong Kwon, Tae Hun Kim, Hyun Joo Lee, Joo Young Yoon, Hong Jin Park
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Patent number: D823297Type: GrantFiled: October 28, 2016Date of Patent: July 17, 2018Assignee: MODNE INC.Inventors: Woo Jin Kim, Judy Jahey Chung, Ki Dong Kwon, Tae Hun Kim, Hyun Joo Lee, Joo Young Yoon, Hong Jin Park
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Patent number: D823298Type: GrantFiled: October 28, 2016Date of Patent: July 17, 2018Assignee: MODNE INC.Inventors: Woo Jin Kim, Judy Jahey Chung, Ki Dong Kwon, Tae Hun Kim, Hyun Joo Lee, Joo Young Yoon, Hong Jin Park
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Patent number: D830353Type: GrantFiled: October 28, 2016Date of Patent: October 9, 2018Assignee: MODNE INC.Inventors: Woo Jin Kim, Judy Jahey Chung, Ki Dong Kwon, Tae Hun Kim, Hyun Joo Lee, Joo Young Yoon, Hong Jin Park
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Patent number: D860980Type: GrantFiled: October 28, 2016Date of Patent: September 24, 2019Assignee: SPIGEN, INC.Inventors: Woo Jin Kim, Judy Jahey Chung, Ki Dong Kwon, Tae Hun Kim, Hyun Joo Lee, Joo Young Yoon, Hong Jin Park
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Patent number: D861655Type: GrantFiled: October 28, 2016Date of Patent: October 1, 2019Assignee: SPIGEN, INC.Inventors: Woo Jin Kim, Judy Jahey Chung, Ki Dong Kwon, Tae Hun Kim, Hyun Joo Lee, Joo Young Yoon, Hong Jin Park
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Patent number: D915383Type: GrantFiled: September 27, 2019Date of Patent: April 6, 2021Assignee: Spigen, Inc.Inventors: Woo Jin Kim, Judy Jahey Chung, Ki Dong Kwon, Tae Hun Kim, Hyun Joo Lee, Joo Young Yoon, Hong Jin Park
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Patent number: D940120Type: GrantFiled: October 28, 2016Date of Patent: January 4, 2022Assignee: Spigen, Inc.Inventors: Woo Jin Kim, Judy Jahey Chung, Ki Dong Kwon, Tae Hun Kim, Hyun Joo Lee, Joo Young Yoon, Hong Jin Park