Abstract: An antenna module includes a multilayer board, a radio frequency (RF) chip, and a active device array. The multilayer board includes an antenna that transmits and receives electromagnetic waves through a top surface of the multilayer board. The RF chip, on a bottom surface of the multilayer board, is connected to the antenna and processes an RF signal. The active device array, on the bottom surface of the multilayer board, includes active devices, a first input pin and a first output pin. The first input pin and the first output pin are respectively connected to electrodes of an active device of the active devices. The multilayer board includes a first pattern for a first signal to be provided from the RF chip to the first input pin, and a second pattern for a second signal to be provided from the first output pin to the RF chip.

Abstract: The present disclosure provides a communication device and an operating method. The communication device includes an antenna, a transmission processor, a radio frequency chain, and a reception processor. The transmission processor is configured to output a second transmission input signal with the same average power as the average power of a first transmission input signal and a second amplitude greater than a first amplitude of the first transmission input signal. The RF chain is configured to output an RF output signal to be transmitted through the antenna, based on a transmission input signal, and to output a reception input signal based on a signal received through the antenna. The reception processor is configured to check an out-of-band blocker by detecting a peaked frequency spectrum based on the reception input signal and to adjust a reception characteristic parameter of the RF chain based on an amplitude of the peaked frequency spectrum.

Abstract: A CMOS chip includes a signal converting circuit configured to convert a baseband signal and an RF signal, a plurality of ports through which the RF signal is transmitted or received, the plurality of ports being respectively included in a first transmission path, a second transmission path, and a reception path, and a plurality of matching networks connected to the signal converting circuit, the plurality of matching networks being respectively connected to the plurality of ports, a first matching network among the plurality of matching networks including an external matching network, and the external matching network being configured to perform an impedance matching of a compound semiconductor device.

Abstract: The present disclosure provides a communication device and an operating method. The communication device includes an antenna, a transmission processor, a radio frequency chain, and a reception processor. The transmission processor is configured to output a second transmission input signal with the same average power as the average power of a first transmission input signal and a second amplitude greater than a first amplitude of the first transmission input signal. The RF chain is configured to output an RF output signal to be transmitted through the antenna, based on a transmission input signal, and to output a reception input signal based on a signal received through the antenna. The reception processor is configured to check an out-of-band blocker by detecting a peaked frequency spectrum based on the reception input signal and to adjust a reception characteristic parameter of the RF chain based on an amplitude of the peaked frequency spectrum.

Abstract: A transceiver includes a first integrated circuit, a second integrated circuit and an antenna array. The first integrated circuit including a transmission chain, a reception chain, and a control circuit, the transmission chain configured to transmit a first radio frequency (RF) signal and the reception chain configured to receive a second RF signal, and the control circuit configured to selectively ground any one of the transmission chain and the reception chain according to a transmission mode or a reception mode; the second integrated circuit including an active device connected to the transmission chain and the reception chain; and the antenna array including an antenna connected to the active device.

Abstract: An antenna module includes a multilayer board, a radio frequency (RF) chip, and a active device array. The multilayer board includes an antenna that transmits and receives electromagnetic waves through a top surface of the multilayer board. The RF chip, on a bottom surface of the multilayer board, is connected to the antenna and processes an RF signal. The active device array, on the bottom surface of the multilayer board, includes active devices, a first input pin and a first output pin. The first input pin and the first output pin are respectively connected to electrodes of an active device of the active devices. The multilayer board includes a first pattern for a first signal to be provided from the RF chip to the first input pin, and a second pattern for a second signal to be provided from the first output pin to the RF chip.

Abstract: An antenna module includes a multilayer board, a radio frequency (RF) chip, and a first active device array. The multilayer board includes an antenna that transmits and receives electromagnetic waves. The RF chip is on a bottom surface of the multilayer board, and includes transmission circuits each of which constitutes a part of each of transmission paths for generating RF signals to be provided to the antenna. The first active device array is on the bottom surface of the multilayer board, and includes a first group of active devices respectively included in a portion of power amplifiers in the transmission paths of the transmission circuits, and first input pins and first output pins respectively connected to electrodes of the first group of active devices.

Abstract: An antenna module includes a multilayer board, a radio frequency (RF) chip, and a first active device array. The multilayer board includes an antenna that transmits and receives electromagnetic waves. The RF chip is on a bottom surface of the multilayer board, and includes transmission circuits each of which constitutes a part of each of transmission paths for generating RF signals to be provided to the antenna. The first active device array is on the bottom surface of the multilayer board, and includes a first group of active devices respectively included in a portion of power amplifiers in the transmission paths of the transmission circuits, and first input pins and first output pins respectively connected to electrodes of the first group of active devices.