Patents by Inventor Hongjun HEI

Hongjun HEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11761063
    Abstract: Disclosed is a method for preparing a high-entropy alloy composites reinforced by diamond particles, belonging to the technical field of metal composites preparation. A vacuum coating preparation equipment equipped with an in-situ heating sample stage is used to perform a treatment of high-entropy alloy metallizing coating on the surface of diamond particles to generate modified diamond particles, where the alloy of the coating includes any four, five or six elements among seven elements of Ti, Zr, Hf, Nb, Ta, W and Mo in an equal atomic proportion. The obtained coating generates carbide film in-situ with the surface layer of diamond particles, while the high-entropy alloy covers the carbide film, ensuring a strong bond with the diamond, and the high-entropy alloy composites reinforced by diamond particles are finally prepared.
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: September 19, 2023
    Assignee: TAIYUAN UNIVERSITY OF TECHNOLOGY
    Inventors: Yongsheng Wang, Shengwang Yu, Changxing Han, Naixu Wang, Bing Zhou, Yong Ma, Jie Gao, Hongjun Hei, Yanxia Wu
  • Publication number: 20230257856
    Abstract: Disclosed is a method for preparing a high-entropy alloy composites reinforced by diamond particles, belonging to the technical field of metal composites preparation. A vacuum coating preparation equipment equipped with an in-situ heating sample stage is used to perform a treatment of high-entropy alloy metallizing coating on the surface of diamond particles to generate modified diamond particles, where the alloy of the coating includes any four, five or six elements among seven elements of Ti, Zr, Hf, Nb, Ta, W and Mo in an equal atomic proportion. The obtained coating generates carbide film in-situ with the surface layer of diamond particles, while the high-entropy alloy covers the carbide film, ensuring a strong bond with the diamond, and the high-entropy alloy composites reinforced by diamond particles are finally prepared.
    Type: Application
    Filed: January 17, 2023
    Publication date: August 17, 2023
    Inventors: Yongsheng WANG, Shengwang YU, Changxing HAN, Naixu WANG, Bing ZHOU, Yong MA, Jie GAO, Hongjun HEI, Yanxia WU