Patents by Inventor Hongjun Jiang

Hongjun Jiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170003087
    Abstract: The present disclosure relates to modules for heat exchange for use in cooling towers and methods of assembling cooling towers using such modules. The aforementioned modules for heat exchange may include fill packing and a structural system configured to provide support for at least the fill packing, in which the structural system includes a plurality of structural members configured to provide compression and tension support. The aforementioned modules for heat exchange may be assembled prior to being transported to a job site and installed in a cooling tower.
    Type: Application
    Filed: July 1, 2015
    Publication date: January 5, 2017
    Inventors: HONGJUN JIANG, ANDJELKO PISKURIC
  • Publication number: 20170003088
    Abstract: The present disclosure relates to modules for heat exchange for use in cooling towers and methods of assembling cooling towers using such modules. The aforementioned modules for heat exchange may include fill packing and a triangular support structure comprising a plurality of structural members. The aforementioned modules for heat exchange may be assembled prior to being transported to a job site and installed in a cooling tower. The triangular support structure may be configured to provide support for the heat exchange module when the heat exchange module is transported. In other aspects of the present disclosure, the aforementioned modules for heat exchange may include a firewall structure configured to withstand dynamic loads when the heat exchange module is transported.
    Type: Application
    Filed: July 1, 2015
    Publication date: January 5, 2017
    Inventors: HONGJUN JIANG, ANDJELKO PISKURIC
  • Publication number: 20170002583
    Abstract: The present disclosure relates to modules for heat exchange for use in cooling towers and methods of assembling cooling towers using such modules. The aforementioned modules for heat exchange may include fill packing and a structural system configured to provide support for at least the fill packing, in which the structural system includes a plurality of structural members configured to provide compression and tension support. The aforementioned modules for heat exchange may be assembled prior to being transported to a job site and installed in a cooling tower. A method for assembling a cooling tower using the aforementioned modules for heat exchange includes: constructing a cold water basin; assembling an air inlet structure on the cold water basin; and placing a heat exchange module on top of the air inlet structure.
    Type: Application
    Filed: July 1, 2015
    Publication date: January 5, 2017
    Inventors: HONGJUN JIANG, ANDJELKO PISKURIC
  • Patent number: 8680869
    Abstract: AC charging contact mechanisms are provided to charge facilitate testing of mobile devices that have charging contacts on sides of the device. A pin and spring based mechanism is provided to bias a probe against one of the charging contact. A lever based mechanism is also provided which biases a probe against one of the contacts in response to locking the mobile device in a battery emulator.
    Type: Grant
    Filed: February 16, 2010
    Date of Patent: March 25, 2014
    Assignee: Blackberry Limited
    Inventors: Hongjun Jiang, Jefferson Elliot Hea, Mohammad Sepahi, Jun Ni
  • Publication number: 20110199092
    Abstract: AC charging contact mechanisms are provided to charge facilitate testing of mobile devices that have charging contacts on sides of the device. A pin and spring based mechanism is provided to bias a probe against one of the charging contact. A lever based mechanism is also provided which biases a probe against one of the contacts in response to locking the mobile device in a battery emulator.
    Type: Application
    Filed: February 16, 2010
    Publication date: August 18, 2011
    Applicant: RESEARCH IN MOTION LIMITED
    Inventors: HONGJUN JIANG, JEFFERSON ELLIOT HEA, MOHAMMAD SEPAHI, JUN NI
  • Publication number: 20110163755
    Abstract: A printed circuit board (“PCB”) test fixture is provided comprising a PCB support, an electrical tester, first and second enclosure portions, and an actuator. The PCB support is configured for supporting a PCB being tested in a PCB test position. The first enclosure portion includes a pressing device which is configured for effecting, with respect to a PCB supported in the PCB test position on the PCB support, pressing of a circuit of the PCB against the electrical tester so as to provide an operative circuit. The second enclosure portion extending peripherally about the PCB support. The actuator is coupled to a one of the first enclosure portion and the second enclosure portion and configured to effect an application of force to the one of the first enclosure portion and the second enclosure portion. The PCB support is disposed between the first and second enclosure portions.
    Type: Application
    Filed: January 5, 2010
    Publication date: July 7, 2011
    Applicant: RESEARCH IN MOTION LIMITED
    Inventors: Hongjun JIANG, Marek REKSNIS, Arkady IVANNIKOV
  • Patent number: 7973551
    Abstract: There is provided a printed circuit board (“PCB”) test fixture comprising a support, an electrical tester, and a pusher. The support is for supporting a PCB being tested in a PCB test position, The electrical tester is positioned with respect to the PCB test position such that, when a PCB is supported by the support in the PCB test position, the electrical tester is disposed in electrical contact with a circuit on the PCB supported by the support in the PCB test position during PCB testing.
    Type: Grant
    Filed: October 9, 2009
    Date of Patent: July 5, 2011
    Assignee: Research In Motion Limited
    Inventor: Hongjun Jiang
  • Publication number: 20110084719
    Abstract: There is provided a printed circuit board (“PCB”) test fixture comprising a support, an electrical tester, and a pusher. The support is for supporting a PCB being tested in a PCB test position, The electrical tester is positioned with respect to the PCB test position such that, when a PCB is supported by the support in the PCB test position, the electrical tester is disposed in electrical contact with a circuit on the PCB supported by the support in the PCB test position during PCB testing.
    Type: Application
    Filed: October 9, 2009
    Publication date: April 14, 2011
    Inventor: Hongjun JIANG