Patents by Inventor Hong-jun Jin

Hong-jun Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8029292
    Abstract: A multi-socket guide for guiding a semiconductor package to a semiconductor package testing device includes a housing, a guiding unit disposed in the housing, the guiding unit guiding the housing to the semiconductor package testing device, and a mounting unit disposed in the housing, the mounting unit receiving the semiconductor package, wherein a size of the mounting unit corresponds to a size of a ball area of the semiconductor package.
    Type: Grant
    Filed: September 11, 2009
    Date of Patent: October 4, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hong-jun Jin, Jong-mi Kim, Yoon-gyu Song
  • Publication number: 20100068914
    Abstract: A multi-socket guide for guiding a semiconductor package to a semiconductor package testing device includes a housing, a guiding unit disposed in the housing, the guiding unit guiding the housing to the semiconductor package testing device, and a mounting unit disposed in the housing, the mounting unit receiving the semiconductor package, wherein a size of the mounting unit corresponds to a size of a ball area of the semiconductor package.
    Type: Application
    Filed: September 11, 2009
    Publication date: March 18, 2010
    Inventors: Hong-jun Jin, Jong-rni Kim, Yoon-gyu Song