Patents by Inventor Hong Jun Yu

Hong Jun Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dual-interface IC card by laminating a plurality of foils and method of same
    Patent number: 7253024
    Abstract: The present invention provides a method for manufacturing IC card by laminating a plurality of foils. The method of the present invention includes steps of putting a COB, a contact electrode of the COB facing downward; laying at least 2 foils having a hole, wherein said COB is inserted in said respective holes of the foils; laying a foil not having a hole on the foils having a hole; and compressing all of the foils.
    Type: Grant
    Filed: February 13, 2003
    Date of Patent: August 7, 2007
    Assignee: JT Corp.
    Inventors: Hong Jun Yu, Jung Ho Kim