Abstract: Provided herein is technology relating to identifying the binding locations of DNA-binding proteins and particularly, but not exclusively, to methods, systems, and kits that use affinity reagent-specific barcodes for simultaneously mapping the binding sites of multiple proteins in the same cell.

Abstract: A semiconductor structure and a method of fabricating the semiconductor structure are disclosed. The semiconductor structure includes: a carrying layer, a barrier layer, a solder layer and an adhesive layer. The barrier layer is located on the surface of the carrying layer, and there are openings in the barrier layer. The barrier layer includes multiple sub-barrier layers in a stack. The multiple sub-barrier layers respectively form a plurality of steps in the opening, and the heights of the plurality of steps decrease sequentially in a direction from outside of the opening to inside of the opening. A solder layer and an adhesive layer are located in the opening, and the adhesive layer covers the solder layer.

Abstract: Disclosed three-dimensional stacked package structure includes: a packaging substrate, having a substrate body, connecting leads, a through-hole penetrating the substrate body, a first pad and a second pad on opposite surfaces of the substrate body. The stacked structure on the first surface of the substrate body includes a second storage block, and a first storage block above the second storage block; the connecting leads include a first lead and a second lead with equal lengths, the first lead is above the package substrate, and one end is electrically connected to the first pad, and the other end is electrically connected to the first storage block. The second lead passes through the through-hole, and one end is electrically connected to the second storage block, the other end is electrically connected to the second pad. The present disclosure reduces the crosstalk between signal lines, thereby reducing signal delay between different storage blocks.