Patents by Inventor Honglie SONG

Honglie SONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micro-vibration sensor and preparation method thereof
    Patent number: 11456409
    Abstract: A micro-vibration sensor and preparation method thereof. The method includes a metal sheet is coated with first curing material, and first curing material is cured into first cured layer; piezoelectric thin film element is attached to edge of first cured layer; one side, attached with piezoelectric thin film element, of first cured layer is vertically placed into second curing material, and second curing material is cured into second cured layer; and metal sheet is removed to obtain micro-vibration sensor. Due to fact that piezoelectric thin film element is arranged at a crack tip, during micro-vibration, stress in stress field of crack tip is rapidly increased due to crack stress deformation, and stress signal is efficiently converted into electric signal; and micro-vibration sensor has characteristics of being low in detection limit and high in accuracy.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: September 27, 2022
    Assignee: JILIN UNIVERSITY
    Inventors: Zhiwu Han, Kejun Wang, Honglie Song, Junqiu Zhang, Daobing Chen, Linpeng Liu, Binjie Zhang, Tao Sun, Dakai Wang, Changchao Zhang
  • MICRO-VIBRATION SENSOR AND PREPARATION METHOD THEREOF
    Publication number: 20210175411
    Abstract: A micro-vibration sensor and preparation method thereof. The method includes a metal sheet is coated with first curing material, and first curing material is cured into first cured layer; piezoelectric thin film element is attached to edge of first cured layer; one side, attached with piezoelectric thin film element, of first cured layer is vertically placed into second curing material, and second curing material is cured into second cured layer; and metal sheet is removed to obtain micro-vibration sensor. Due to fact that piezoelectric thin film element is arranged at a crack tip, during micro-vibration, stress in stress field of crack tip is rapidly increased due to crack stress deformation, and stress signal is efficiently converted into electric signal; and micro-vibration sensor has characteristics of being low in detection limit and high in accuracy.
    Type: Application
    Filed: October 31, 2019
    Publication date: June 10, 2021
    Applicant: JILIN UNIVERSITY
    Inventors: Zhiwu HAN, Kejun WANG, Honglie SONG, Junqiu ZHANG, Daobing CHEN, Linpeng LIU, Binjie ZHANG, Tao SUN, Dakai WANG, Changchao ZHANG