Patents by Inventor Honglin ZENG

Honglin ZENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11921318
    Abstract: A method of forming a semiconductor structure includes: providing an initial substrate having a first region and a second region; forming a first substrate on the initial substrate; forming a first insulating layer on the first substrate; forming a second substrate on the first insulating layer; removing the second substrate in the second region to form a second insulating layer on the first insulating layer in the second region; and forming a plurality of passive devices on the second insulating layer in the second region and forming a plurality of active devices on the second substrate in the first region.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: March 5, 2024
    Assignees: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
    Inventors: Xiaojun Chen, Honglin Zeng, Xia Feng, Dongsheng Zhang, Xiage Yin, Jiaheng Wu
  • Publication number: 20220365275
    Abstract: A method of forming a semiconductor structure includes: providing an initial substrate having a first region and a second region; forming a first substrate on the initial substrate; forming a first insulating layer on the first substrate; forming a second substrate on the first insulating layer; removing the second substrate in the second region to form a second insulating layer on the first insulating layer in the second region; and forming a plurality of passive devices on the second insulating layer in the second region and forming a plurality of active devices on the second substrate in the first region.
    Type: Application
    Filed: May 12, 2022
    Publication date: November 17, 2022
    Inventors: Xiaojun CHEN, Honglin ZENG, Xia FENG, Dongsheng ZHANG, Xiage YIN, Jiaheng WU
  • Publication number: 20210142028
    Abstract: The present disclosure provides an optical fingerprint identification apparatus and an electronic device. The apparatus includes a fingerprint identification module disposed under a backlight module of the liquid crystal display. The fingerprint identification module includes an optical sensor and a light source disposed adjacent to the optical sensor; the light source is used to emit a detection light to the fingerprint detection area of the liquid crystal display, and the detection light passes through the liquid crystal display via a transmission part of the backlight module and irradiates to a finger above the liquid crystal display to form a fingerprint detection light carrying fingerprint information; and the optical sensor is used to receive the fingerprint detection light to acquire the fingerprint information; where the fingerprint detection light passes through the liquid crystal display and is transmitted to the optical sensor via the transmission part of the backlight module.
    Type: Application
    Filed: December 28, 2020
    Publication date: May 13, 2021
    Applicant: Shenzhen Goodix Technology Co., Ltd.
    Inventors: Fei ZHOU, Wenming CHI, Honglin ZENG, Bingwen WANG