Abstract: The present invention provides a photocurable adhesive composition. The photocurable adhesive composition comprises, based on the total solid content thereof, 10 to 40 wt % of a thermoplastic polymer containing carboxylic groups and epoxy groups, 20 to 50 wt % of an epoxy component, 1 to 10 wt % of a hydroxy-containing compound, and 0.1 to 5 wt % of a photoinitiator. The present invention further provides a photocurable adhesive tape comprising the photocurable adhesive composition. The photocurable adhesive composition and the photocurable adhesive tape prepared according to technical solutions of the present invention have excellent adhesiveness to phosphorus-containing nickel-plated substrates.

Abstract: The present invention provides a thermally conductive adhesive composition, based on the total weight of the composition, comprising: (a) 5-70% by weight of an epoxy component; (b) 5-60% by weight of thermally conductive material; (c) 0.001-10% by weight of a photoinitiator; (d) 0-40% by weight of a thermoplastic polymer; (e) 0-50% by weight of a hydroxyl-functional component; and (f) 0-50% by weight of a halogen-free flame retardant. The present invention further provides a thermally conductive adhesive tape comprising the adhesive composition.

Abstract: The present invention provides a thermally conductive adhesive composition, based on the total weight of the composition, comprising: (a) 5-70% by weight of an epoxy component; (b) 5-60% by weight of thermally conductive material; (c) 0.001-10% by weight of a photoinitiator; (d) 0-40% by weight of a thermoplastic polymer; (e) 0-50% by weight of a hydroxyl-functional component; and (f) 0-50% by weight of a halogen-free flame retardant. The present invention further provides a thermally conductive adhesive tape comprising the adhesive composition.

Abstract: A halogen-free pressure-sensitive adhesive composition is provided, based on the total weight of the composition, comprising (A) 15-60 wt % of acrylic-based polymer, (B) 10-50 wt % of thermally conductive filler, and (C) 20-50 wt % of halogen-free flame retardant, based on 100% of the total weight of the composition, wherein the component (C) comprises: sub-component (C1) comprising at least one organophosphorous-based flame retardant; and sub-component (C2) comprising at least one flame retardant selected from the group consisting of nitrogen-containing compound-based flame retardants, graphite material-based flame retardants, melamine cyanurate-based flame retardants, metal hydroxide-based flame retardants, metal oxide-based flame retardants, metal phosphate-based flame retardants other than the organophosphorous-based flame retardants of (C1), and the composition has a P content no less than 4.0 wt %, based on 100 wt % of the total weight of the composition.