Abstract: Some embodiments include an integrated structure having a first opening extending through a stack of alternating insulative levels and conductive levels. A nitride structure is within the first opening and narrows the first opening to form a second opening. Detectable oxide is between the nitride structure and one or more of the conductive levels. Some embodiments include an integrated structure having a conductive material, a select device gate material over the conductive material, and vertically-stacked conductive levels over the select device gate material. A first opening extends through the vertically-stacked levels to the conductive material and has opposing sidewalls along a cross-section. Nitride liners are along the sidewalls of the first opening. Detectable oxide is between at least one of the nitride liners and one or more of the vertically-stacked conductive levels. Some embodiments include methods for forming integrated structures.

Abstract: Some embodiments include an integrated structure having a first opening extending through a stack of alternating insulative levels and conductive levels. A nitride structure is within the first opening and narrows the first opening to form a second opening. Detectable oxide is between the nitride structure and one or more of the conductive levels. Some embodiments include an integrated structure having a conductive material, a select device gate material over the conductive material, and vertically-stacked conductive levels over the select device gate material. A first opening extends through the vertically-stacked levels to the conductive material and has opposing sidewalls along a cross-section. Nitride liners are along the sidewalls of the first opening. Detectable oxide is between at least one of the nitride liners and one or more of the vertically-stacked conductive levels. Some embodiments include methods for forming integrated structures.

Abstract: Some embodiments include an integrated structure having a first opening extending through a stack of alternating insulative levels and conductive levels. A nitride structure is within the first opening and narrows the first opening to form a second opening. Detectable oxide is between the nitride structure and one or more of the conductive levels. Some embodiments include an integrated structure having a conductive material, a select device gate material over the conductive material, and vertically-stacked conductive levels over the select device gate material. A first opening extends through the vertically-stacked levels to the conductive material and has opposing sidewalls along a cross-section. Nitride liners are along the sidewalls of the first opening. Detectable oxide is between at least one of the nitride liners and one or more of the vertically-stacked conductive levels. Some embodiments include methods for forming integrated structures.

Abstract: Some embodiments include an integrated structure having a first opening extending through a stack of alternating insulative levels and conductive levels. A nitride structure is within the first opening and narrows the first opening to form a second opening. Detectable oxide is between the nitride structure and one or more of the conductive levels. Some embodiments include an integrated structure having a conductive material, a select device gate material over the conductive material, and vertically-stacked conductive levels over the select device gate material. A first opening extends through the vertically-stacked levels to the conductive material and has opposing sidewalls along a cross-section. Nitride liners are along the sidewalls of the first opening. Detectable oxide is between at least one of the nitride liners and one or more of the vertically-stacked conductive levels. Some embodiments include methods for forming integrated structures.

Abstract: Some embodiments include an integrated structure having a first opening extending through a stack of alternating insulative levels and conductive levels. A nitride structure is within the first opening and narrows the first opening to form a second opening. Detectable oxide is between the nitride structure and one or more of the conductive levels. Some embodiments include an integrated structure having a conductive material, a select device gate material over the conductive material, and vertically-stacked conductive levels over the select device gate material. A first opening extends through the vertically-stacked levels to the conductive material and has opposing sidewalls along a cross-section. Nitride liners are along the sidewalls of the first opening. Detectable oxide is between at least one of the nitride liners and one or more of the vertically-stacked conductive levels. Some embodiments include methods for forming integrated structures.

Abstract: Some embodiments include an integrated structure having a first opening extending through a stack of alternating insulative levels and conductive levels. A nitride structure is within the first opening and narrows the first opening to form a second opening. Detectable oxide is between the nitride structure and one or more of the conductive levels. Some embodiments include an integrated structure having a conductive material, a select device gate material over the conductive material, and vertically-stacked conductive levels over the select device gate material. A first opening extends through the vertically-stacked levels to the conductive material and has opposing sidewalls along a cross-section. Nitride liners are along the sidewalls of the first opening. Detectable oxide is between at least one of the nitride liners and one or more of the vertically-stacked conductive levels. Some embodiments include methods for forming integrated structures.

Abstract: Some embodiments include an integrated structure having a first opening extending through a stack of alternating insulative levels and conductive levels. A nitride structure is within the first opening and narrows the first opening to form a second opening. Detectable oxide is between the nitride structure and one or more of the conductive levels. Some embodiments include an integrated structure having a conductive material, a select device gate material over the conductive material, and vertically-stacked conductive levels over the select device gate material. A first opening extends through the vertically-stacked levels to the conductive material and has opposing sidewalls along a cross-section. Nitride liners are along the sidewalls of the first opening. Detectable oxide is between at least one of the nitride liners and one or more of the vertically-stacked conductive levels. Some embodiments include methods for forming integrated structures.

Abstract: A method of reading code symbols using a digital image capture and processing system which includes: an image formation and detection subsystem; an illumination subsystem; an illumination control subsystem; a digital image processing subsystem; and an input/output subsystem; and a system control subsystem. In the illustrative embodiment, a micro-computing platform implements the digital image processing subsystem, the input/output subsystem and the system control subsystem. The micro-computing platform includes a microprocessor, a memory architecture, and a multi-tier modular software architecture responsive to the generation of a triggering event within the system. Triggering events can be generated by an automatic object detector or by a manually actuated trigger switch.

Abstract: A digital image capture and processing system comprising an illumination measurement subsystem for measuring the level of illumination at a particular region of the field of view (FOV) of the system during object illumination and imaging operations, and producing and storing an illumination measure for achieving a desired spatial intensity in a digital image to be formed and detected by the image formation and detection subsystem. An illumination control subsystem uses the illumination measure to control a LED-based illumination array during object illumination and imaging operations. A programmed image processor supports an image-processing based illumination metering program, as well as processes digital images formed and detected by the image formation and detection subsystem so as to read or acquire information graphically represented in the digital images.

Abstract: A hand-supportable digital-imaging based system for reading bar code symbols involving: automatically detecting the presence of an object within a field of view FOV of the system, and in response thereto, automatically generating an image cropping zone (ICZ) framing pattern and projecting the ICZ framing pattern within the FOV and onto the detected object; visually aligning the code symbol on the detected object, within the ICZ framing pattern; manually actuating a trigger switch when the code symbol on the object is located within the ICZ framing pattern, and while the ICZ framing pattern and a field of illumination are being simultaneously projected onto the object during object illumination operations, forming and capturing a digital image of the code symbol on the detected object; automatically cropping the image pixels contained within the spatial boundaries of the ICZ framing pattern, from the pixels of the digital image; and decode processing the cropped image so as to read one or more 1D and/or 2D cod

Abstract: A digital-imaging based code symbol reading system comprising an image sensing array with a field of view (FOV), an illumination subsystem with an LED illumination array, an automatic illumination measurement subsystem, an illumination control subsystem, and programmed imager processor supporting an image-processing based illumination metering program. The automatic illumination measurement subsystem, employing a photodetector operating independently from the image sensing array, is used to automatically measure the illumination level at a particular region of the FOV and determine the illumination duration necessary to achieve a desired spatial intensity in the detected digital image.

Abstract: A method of reading bar code symbols using a digital-imaging based code symbol reading system employing an event-driven multi-tier modular software architecture and supporting automatic operating system login and loading of a bar code symbol reading application.

Abstract: A method of reading bar code symbols comprising the steps of: (a) projecting an image cropping zone (ICZ) framing pattern within the FOV of an image sensing array during wide-area illumination and image capturing operation; (b) visually aligning an object to be imaged within the ICZ framing pattern; (c) forming and capturing an wide-area image of the entire FOV, which spatially encompasses the ICZ framing pattern aligned about the object to be imaged; (d) using automatic software-based image cropping algorithm to automatically crop the pixels within the spatial boundaries defined by the ICZ framing pattern, from those pixels contained in the entire wide-area image frame captured during step (c); and (e) automatically decode processing the image represented by the cropped image pixels in the ICZ framing pattern so as to read a 1D or 2D bar code symbol graphically represented therein.

Abstract: A digital-imaging based code symbol reading system comprising an image sensing array with a field of view (FOV), an illumination subsystem with an LED illumination array, an automatic illumination measurement subsystem, an illumination control subsystem, and programmed imager processor supporting an image-processing based illumination metering program. The automatic illumination measurement subsystem automatically measures the illumination level at a particular region of the FOV and determines the illumination duration necessary to achieve a desired spatial intensity in the detected digital image. The illumination metering program automatically analyzes and measures, in real-time, the spatial intensity distribution of the digital image and determines whether or not a corrected illumination duration is required or desired when detecting the next or subsequent digital images, during the current or subsequent object illumination and imaging cycle.

Abstract: A portable digital image capturing and processing system comprising: an image formation and detection subsystem; a narrow-band illumination subsystem; a narrow-band transmission-type optical filter subsystem; an automatic light exposure measurement subsystem; and an automatic illumination control subsystem. The image formation and detection subsystem has an area-type image sensing array for detecting digital images of objects formed thereon by image formation optics providing a field of view (FOV) for the system. Within the FOV of the image formation and detection subsystem, the narrow-band illumination subsystem produces a field of narrow-band illumination consisting essentially of a narrow band of wavelengths of visible illumination.

Abstract: A portable digital image capturing and processing system comprising an image formation and detection subsystem, an LED-based illumination subsystem, an automatic light exposure measurement subsystem, and an automatic illumination control subsystem. The image formation and detection subsystem has an area-type image sensing array for detecting digital images of objects formed thereon by image formation optics providing a field of view (FOV) for the system. The automatic light exposure measurement subsystem employs a photodetector operated independently from the area-type image sensing array, for automatically measuring the light exposure incident upon a selected portion of the FOV, and producing an electrical signal representative of the light exposure measurement. The automatic illumination control subsystem responds to the electrical signal and controls the duration of LED-based illumination produced from the LED-based illumination subsystem during the image capture mode.

Abstract: A portable digital image capturing and processing system comprising: an image formation and detection subsystem; a narrow-band illumination subsystem; a narrow-band transmission-type optical filter subsystem; an automatic light exposure measurement subsystem; and an automatic illumination control subsystem. The image formation and detection subsystem has an area-type image sensing array for detecting digital images of objects formed thereon by image formation optics providing a field of view (FOV) for the system. Within the FOV of the image formation and detection subsystem, the narrow-band illumination subsystem produces a field of narrow-band illumination consisting essentially of a narrow band of wavelengths of visible illumination.

Abstract: A hand-supportable digital image capture and processing system comprises: an area-type image formation and detection subsystem having an area-type image detection array; an LED-based illumination subsystem having a LED-based illumination array; an automatic light exposure measurement and illumination control subsystem; an image capturing and buffering subsystem; and an image-processing subsystem. The LED array is automatically driven in a precise manner to globally expose the area-type image detection array with LED-based illumination only when substantially all of its rows of pixels are in a state of integration and have a common integration time, thereby enabling the capture of high quality images independent of the relative motion between the object and the hand-supportable digital image capture and processing system.