Patents by Inventor Hongqi XIANG

Hongqi XIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240009797
    Abstract: The present invention relates to B24B, and more specifically, the present invention relates to an endpoint detection window, a chemical mechanical polishing pad with a window and a preparation method thereof. A side surface of the window is provided with a plurality of circumferential grooves. In the present invention, a column-shaped window with a specially designed side surface structure is provided and subjected to integrated pouring and molding with a polishing pad to manufacture a chemical mechanical polishing pad having high bonding strength between the window and the polishing pad. As a side surface of the window is of a multi-groove structure, not only is the bonding contact area between the window and the pad increased, but also a convex structure is formed by a polishing pad body material poured into the grooves so as to form an embedded bonding manner with a groove structure of a window material.
    Type: Application
    Filed: July 5, 2023
    Publication date: January 11, 2024
    Inventors: Hongqi XIANG, Jianguo SHI, Kai CHEN, Lijun YAO