Patents by Inventor Hongquan XIAO

Hongquan XIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240244040
    Abstract: Embodiments of this specification provide a communication method and apparatus based on a relay cluster. The relay cluster includes a load balancing server and at least two relay servers. The communication method includes: receiving a relay request packet sent by a client, where the relay request packet includes a transaction identifier, and the transaction identifier includes a mode field and a routing information field; acquiring routing information of a first relay server of the at least two relay servers based on a value of the mode field and a value of the routing information field in the relay request packet; and sending a relay allocation packet carrying the routing information of the first relay server to the client, so that the client establishes a relay channel based on the routing information of the first relay server.
    Type: Application
    Filed: October 11, 2022
    Publication date: July 18, 2024
    Inventors: Ke ZENG, Yong CHEN, Hongquan ZHANG, Lingtao KONG, Han XIAO, Xiaokang QIN, Bin YANG
  • Publication number: 20240219875
    Abstract: Provided are a calibration method for splicing light source modules, a projection method, a 3D printing method, a calibration apparatus, a 3D printer, and a non-volatile computer-readable storage medium. There are at least two light source modules. The calibration method includes: performing optical calibration processing on each of the light source modules, wherein a splicing overlapping area is present in projection regions of the light source modules subjected to optical calibration processing; and performing, on the basis of the splicing overlapping area, calibration accuracy inspection on each of the light source modules subjected to optical calibration processing.
    Type: Application
    Filed: March 16, 2024
    Publication date: July 4, 2024
    Inventors: Peng DING, Xin WAN, Jun HU, Hongquan XIAO
  • Publication number: 20240116249
    Abstract: Disclosed in the disclosure are a method, system and apparatus for processing slice image for 3D printing, and a storage medium. The method includes: acquiring a slice image of a three-dimensional model, and a relationship between a grayscale compensation parameter and a size adjustment value; determining at least one size adjustment value according to the slice image; determining at least one grayscale compensation parameter according to the at least one size adjustment value and the relationship between the grayscale compensation parameter and the size adjustment value; and respectively performing grayscale processing on edge pixels of corresponding contours in the slice image according to the plurality of grayscale compensation parameters, where the processed slice image is used for 3D printing.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 11, 2024
    Inventors: Xin WAN, Yu GUO, Lingfeng DENG, Dachao ZHOU, Juntao GUO, Hongquan XIAO
  • Publication number: 20240116250
    Abstract: Disclosed in the disclosure are a method, system and apparatus for processing slice image for 3D printing, and a storage medium. The method includes: acquiring a slice image of a three-dimensional model, and a relationship between a grayscale compensation parameter and a size adjustment value; determining at least one size adjustment value according to the slice image; determining at least one grayscale compensation parameter according to the at least one size adjustment value and the relationship between the grayscale compensation parameter and the size adjustment value; and respectively performing grayscale processing on edge pixels of corresponding contours in the slice image according to the plurality of grayscale compensation parameters, where the processed slice image is used for 3D printing.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 11, 2024
    Inventors: Xin WAN, Yu GUO, Lingfeng DENG, Dachao ZHOU, Juntao GUO, Hongquan XIAO