Abstract: Structures that include resistive memory elements and methods of forming a structure that includes resistive memory elements. The structure comprises a bipolar junction transistor including a base, a first terminal having a first raised semiconductor layer over the base, and a second terminal having a second raised semiconductor layer over the base. The first raised semiconductor layer is spaced in a lateral direction from the second raised semiconductor layer. The structure further comprises a resistive memory element including a first electrode, a second electrode, and a switching layer between the first electrode and the second electrode. The first electrode of the resistive memory element is coupled to the first terminal of the bipolar junction transistor.

Abstract: A substrate is provided. The substrate includes a base, a semiconductor layer over the base, and an insulator layer between the base and the semiconductor layer. The semiconductor layer has a first semiconductor layer portion having a first thickness, a second semiconductor layer portion having a second thickness, and a third semiconductor layer portion having a third thickness, and the first thickness, the second thickness, and the third thickness are different from each other.

Abstract: A planar transistor device is disclosed including a gate structure positioned above a semiconductor substrate, the semiconductor substrate comprising a substantially planar upper surface, a channel region, a source region, a drain region, and at least one layer of a two-dimensional (2D) material that is positioned in at least one of the source region, the drain region or the channel region, wherein the layer of 2D material has a substantially planar upper surface, a substantially planar bottom surface and a substantially uniform vertical thickness across an entire length of the layer of 2D material in the gate length direction and across an entire width of the layer of 2D material in the gate width direction, wherein the substantially planar upper surface and the substantially planar bottom surface of the layer of 2D material are positioned approximately parallel to a substantially planar surface of the semiconductor substrate.

Abstract: Embodiments of the disclosure provide an integrated circuit (IC) structure including a gate structure over a semiconductor layer. The gate structure includes a first portion having a first horizontal width, and a second portion laterally adjacent the first portion and having a second horizontal width less than the first horizontal width. A gate contact is on the first portion of the gate structure and is not on the second portion of the gate structure.

Abstract: An illustrative device disclosed herein includes a doped well region and a conductive well tap conductively coupled to the doped well region, the conductive well tap including first and second opposing sidewall surfaces. In this example the device also includes a first sidewall spacer that has a first vertical height positioned around the conductive well tap and a second sidewall spacer positioned adjacent the first sidewall spacer along the first and second opposing sidewall surfaces of the conductive well tap, wherein the second sidewall spacer has a second vertical height that is less than the first vertical height.

Abstract: A planar transistor device is disclosed including a gate structure positioned above a semiconductor substrate, the semiconductor substrate comprising a substantially planar upper surface, a channel region, a source region, a drain region, and at least one layer of a two-dimensional (2D) material that is positioned in at least one of the source region, the drain region or the channel region, wherein the layer of 2D material has a substantially planar upper surface, a substantially planar bottom surface and a substantially uniform vertical thickness across an entire length of the layer of 2D material in the gate length direction and across an entire width of the layer of 2D material in the gate width direction, wherein the substantially planar upper surface and the substantially planar bottom surface of the layer of 2D material are positioned approximately parallel to a substantially planar surface of the semiconductor substrate.

Abstract: An illustrative device disclosed herein includes a doped well region and a conductive well tap conductively coupled to the doped well region, the conductive well tap including first and second opposing sidewall surfaces. In this example the device also includes a first sidewall spacer that has a first vertical height positioned around the conductive well tap and a second sidewall spacer positioned adjacent the first sidewall spacer along the first and second opposing sidewall surfaces of the conductive well tap, wherein the second sidewall spacer has a second vertical height that is less than the first vertical height.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to devices with slotted active regions and methods of manufacture. The method includes: forming a mandrel on top of a diffusion region comprising a diffusion material; forming a first material over the mandrel and the diffusion region; removing the mandrel to form multiple spacers each having a thickness; depositing a second material over the spacers and the diffusion material; and forming slots in the diffusion region by removing a portion of the second material over the diffusion region and the underlying diffusion material.

Abstract: One illustrative vertical transistor device disclosed herein includes a channel region comprising at least one layer of a two-dimensional (2D) material, a bottom source/drain region, a top source/drain region and a gate structure positioned all around at least the at least one layer of a two-dimensional (2D) material.

Abstract: One illustrative device disclosed herein includes a bottom source/drain region and a top source/drain region positioned vertically above at least a portion of the bottom source/drain region, wherein each of the bottom source/drain region and the top source/drain region comprise at least one layer of a two-dimensional (2D) material. The device also includes a substantially vertically oriented semiconductor structure positioned vertically between the bottom source/drain region and the top source/drain region and a gate structure positioned all around an outer perimeter of the substantially vertically oriented semiconductor structure for at least a portion of the vertical height of the substantially vertically oriented semiconductor structure.

Abstract: One illustrative device disclosed herein includes a bottom source/drain region and a top source/drain region positioned vertically above at least a portion of the bottom source/drain region, wherein each of the bottom source/drain region and the top source/drain region comprise at least one layer of a two-dimensional (2D) material. The device also includes a substantially vertically oriented semiconductor structure positioned vertically between the bottom source/drain region and the top source/drain region and a gate structure positioned all around an outer perimeter of the substantially vertically oriented semiconductor structure for at least a portion of the vertical height of the substantially vertically oriented semiconductor structure.

Abstract: One illustrative vertical transistor device disclosed herein includes a channel region comprising at least one layer of a two-dimensional (2D) material, a bottom source/drain region, a top source/drain region and a gate structure positioned all around at least the at least one layer of a two-dimensional (2D) material.

Abstract: A planar transistor device is disclosed including a gate structure positioned above a semiconductor substrate, the semiconductor substrate comprising a substantially planar upper surface, a channel region, a source region, a drain region, and at least one layer of a two-dimensional (2D) material that is positioned in at least one of the source region, the drain region or the channel region, wherein the layer of 2D material has a substantially planar upper surface, a substantially planar bottom surface and a substantially uniform vertical thickness across an entire length of the layer of 2D material in the gate length direction and across an entire width of the layer of 2D material in the gate width direction, wherein the substantially planar upper surface and the substantially planar bottom surface of the layer of 2D material are positioned approximately parallel to a substantially planar surface of the semiconductor substrate.

Abstract: The present disclosure relates to an isolation region between semiconductor devices and methods of fabrication. Embodiments include device having a silicon-on-insulator (SOI) substrate; a dummy gate between two metal gates formed over the SOI substrate, the dummy gate providing a physical diffusion break between the two metal gates; raised source/drain (S/D) regions formed on sides of the metal gates; and interlayer dielectric formed over the dummy gate, raised S/D regions and metal gates and in openings on sides of the dummy gate.

Abstract: The present disclosure relates to an isolation region between semiconductor devices and methods of fabrication. Embodiments include device having a silicon-on-insulator (SOI) substrate; a dummy gate between two metal gates formed over the SOI substrate, the dummy gate providing a physical diffusion break between the two metal gates; raised source/drain (S/D) regions formed on sides of the metal gates; and interlayer dielectric formed over the dummy gate, raised S/D regions and metal gates and in openings on sides of the dummy gate.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to devices with slotted active regions and methods of manufacture. The method includes: forming a mandrel on top of a diffusion region comprising a diffusion material; forming a first material over the mandrel and the diffusion region; removing the mandrel to form multiple spacers each having a thickness; depositing a second material over the spacers and the diffusion material; and forming slots in the diffusion region by removing a portion of the second material over the diffusion region and the underlying diffusion material.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to devices with slotted active regions and methods of manufacture. The method includes: forming a mandrel on top of a diffusion region comprising a diffusion material; forming a first material over the mandrel and the diffusion region; removing the mandrel to form multiple spacers each having a thickness; depositing a second material over the spacers and the diffusion material; and forming slots in the diffusion region by removing a portion of the second material over the diffusion region and the underlying diffusion material.