Patents by Inventor Hongseon PARK

Hongseon PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite conductive substrate and manufacturing method thereof
    Patent number: 11089678
    Abstract: The present disclosure provides a composite conductive substrate exhibiting enhanced properties both in the folding endurance and the electric conductivity and a method of manufacturing the composite conductive substrate. A composite conductive substrate according to an exemplary embodiment of the present disclosure includes: an insulating layer; a metal nanowire structure embedded beneath one surface of the insulating layer; and a metal thin film coupled to the metal nanowire structure. The composite conductive substrate may be fabricated in an order of the insulating film, the metal nanowire structure, and the metal thin film, or vice versa.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: August 10, 2021
    Assignee: Korea Electronics Technology Institute
    Inventors: Chuljong Han, Minsuk Oh, Eunji Ko, Hongseon Park
  • COMPOSITE CONDUCTIVE SUBSTRATE AND MANUFACTURING METHOD THEREOF
    Publication number: 20200253046
    Abstract: The present disclosure provides a composite conductive substrate exhibiting enhanced properties both in the folding endurance and the electric conductivity and a method of manufacturing the composite conductive substrate. A composite conductive substrate according to an exemplary embodiment of the present disclosure includes: an insulating layer; a metal nanowire structure embedded beneath one surface of the insulating layer; and a metal thin film coupled to the metal nanowire structure. The composite conductive substrate may be fabricated in an order of the insulating film, the metal nanowire structure, and the metal thin film, or vice versa.
    Type: Application
    Filed: January 31, 2019
    Publication date: August 6, 2020
    Applicant: KOREA ELECTRONICS TECHNOLOGY INSTITUTE
    Inventors: Chuljong HAN, Minsuk OH, Eunji KO, Hongseon PARK