Abstract: A system and method for transmitting a wavelength division multiplexed (WDM) signal on an optical transmission path. The system includes at least one first modulation format transmitter configured to generate an associated first modulation format signal on an associated signal wavelength using a first modulation format having a first spectral efficiency, and at least one second modulation format transmitter configured to generate an associated second modulation format signal on an associated signal wavelength using a second modulation format having a second spectral efficiency higher than the first spectral efficiency. The second modulation format signals having an optical power set nominally higher than the optical power of the first modulation format signals. The first and second modulation format signals are combined into an aggregate output signal on the optical transmission path.

Abstract: A method for intraoperatively measuring joint contact mechanics of a patient's joint is provided. The method includes inserting a sensor between first and second bones of a joint. Then a predetermined force is applied to one of the first and second bones. Afterwards, contact mechanics such as, contact stresses, contact areas and/or forces are measured between the first and second bones in response to the applied predetermined force.

Abstract: A system and method for fault recovery in a branched optical network. In response to a fault, power distribution in channels on recovering digital line segments is adjusted to minimize a merit function based on one or more system parameters.

Abstract: An apparatus for monitoring optical equipment in an optical circuit is disclosed in which the apparatus may include an optical device situated to receive an optical input signal and to reflect a portion of the energy of the received optical input signal, thereby providing a reflected input signal; a first photodiode located along a path of the reflected input signal, and operable to receive optical energy from the reflected optical input signal and from ambient optical power; a second photodiode located substantially outside the reflection path of the optical input signal; and means for calculating a magnitude of a power level of the optical input signal from values of outputs from the first and second photodiodes.

Abstract: A system and method for fault recovery in a branched optical network. In response to a fault, power distribution in channels on recovering digital line segments is adjusted to minimize a merit function based on one or more system parameters.

Abstract: An optical circuit is described which may include an SOA-MZI circuit providing an output signal; and a polarization filtering device (PFD) configured to receive the output signal of the SOA-MZI and to provide at least one signal at the output of the PFD.

Abstract: A reflector assembly is disclosed that may include a housing; a fiber stud disposed within the housing; a filter lens having an OTDR reflective layer, the filter lens located downstream from the fiber stud and receiving light energy from the fiber stud, and configured to be transparent for light within a communication wavelength band and reflective within a diagnostic wavelength band.

Abstract: An apparatus for monitoring optical equipment in an optical circuit is disclosed in which the apparatus may include an optical device situated to receive an optical input signal and to reflect a portion of the energy of the received optical input signal, thereby providing a reflected input signal; a first photodiode located along a path of the reflected input signal, and operable to receive optical energy from the reflected optical input signal and from ambient optical power; a second photodiode located substantially outside the reflection path of the optical input signal; and means for calculating a magnitude of a power level of the optical input signal from values of outputs from the first and second photodiodes.

Abstract: An optical circuit is described which may include an SOA-MZI circuit providing an output signal; and a polarization filtering device (PFD) configured to receive the output signal of the SOA-MZI and to provide at least one signal at the output of the PFD.

Abstract: An optical circuit is described which may include an SOA-MZI circuit providing an output signal; and a polarization filtering device (PFD) configured to receive the output signal of the SOA-MZI and to provide at least one signal at the output of the PFD.

Abstract: An optical circuit is described which may include an SOA-MZI circuit providing an output signal; and a polarization filtering device (PFD) configured to receive the output signal of the SOA-MZI and to provide at least one signal at the output of the PFD.

Abstract: Monitoring of the input power is performed on-chip and is used to monitor and maintain performance, detect failure and trigger network protection strategies. An optical power-monitoring technique uses a photodetector monolithically integrated with the semiconductor optical amplifier—Mach-Zehnder interferometer circuit to monitor the P2R device and keep the output stable while the input power varies.

Abstract: Monitoring of the input power is performed on-chip and is used to monitor and maintain performance, detect failure and trigger network protection strategies. An optical power-monitoring technique uses a photodetector monolithically integrated with the semiconductor optical amplifier—Mach-Zehnder interferometer circuit to monitor the P2R device and keep the output stable while the input power varies.

Abstract: The present invention provides a method of manufacturing VCSELs which involves a flip-bonding process wherein the top surface of the VCSEL wafer is bonded face down onto a surrogate substrate. The process begins in a manner similar to traditional double dielectric stack based VCSEL, but then involves flip-bonding the wafer onto an In or Ag epoxy coated surrogate substrate. The InP substrate is then selectively etched. After flip-bonding the wafer fabrication proceeds on the freshly etched surface which now forms the top surface. Next, standard mesa-isolation and contact formation techniques are performed on this newly etched surface.